Abstract: A coating system and a method for using such a system comprising a vessel, a flexible container within the vessel, and a coating apparatus. The flexible container includes an outlet port, wherein the flexible container is configured to contract in response to an increase in pressure within the vessel. The flexible container is configured to output a coating composition through the outlet port in response to contraction. The coating apparatus is configured to receive the coating composition from the outlet port and in some embodiments, deliver the coating composition to a wafer surface.

Abstract: A water replenishment device includes a water generator and a container. The water generator includes a seat body, a heat exchanger, and a thermoelectric cooler. The seat body has a fluid channel and a catchment hole. The catchment hole is in fluid communication with the fluid channel, and the fluid channel is configured for an environment airflow to pass therethrough. The heat exchanger is partially located in the fluid channel. The thermoelectric cooler has a cold surface and a hot surface. The cold surface of the thermoelectric cooler is thermally coupled to the heat exchanger. The container has a storage space. The storage space is in fluid communication with the fluid channel via the catchment hole. The thermoelectric cooler is configured to condense the environment airflow to a liquid, and the liquid is configured to be stored in the storage space via the catchment hole.

Abstract: A micro-bolometer and a thermal sensing method thereof are provided. Each of switching circuits switches connection relationship between a first connection point or a second connection point of a corresponding thermal sensing pixel and different signal transmission lines and a shared connection line, so as to adjust the connection mode of the thermal sensing pixels, the first signal transmission line, the second signal transmission line and the at least one shared connection line, and thus to change a sensing signal provided by the thermal sensing pixels.

Abstract: A water cooling assembly is configured to be mounted at an electrical connector of a circuit board. The water cooling assembly includes a mounting plate and a water cooling radiator. The mounting plate includes a mounting portion and a plugging portion. The plugging portion is connected to a side of the mounting portion, and the plugging portion is configured to be inserted into the electrical connector of the circuit board. The water cooling radiator is fastened to the mounting portion of the mounting plate.

Abstract: A water replenishment device includes a water generator and a container. The water generator includes a seat body, a heat exchanger, and a thermoelectric cooler. The seat body has a fluid channel and a catchment hole. The catchment hole is in fluid communication with the fluid channel, and the fluid channel is configured for an environment airflow to pass therethrough. The heat exchanger is partially located in the fluid channel. The thermoelectric cooler has a cold surface and a hot surface. The cold surface of the thermoelectric cooler is thermally coupled to the heat exchanger. The container has a storage space. The storage space is in fluid communication with the fluid channel via the catchment hole. The thermoelectric cooler is configured to condense the environment airflow to a liquid, and the liquid is configured to be stored in the storage space via the catchment hole.

Abstract: Examples pertaining to improvement on user equipment (UE) uplink latency in wireless communications are described. When an apparatus is in a special mode, a processor of the apparatus transmits to a network a request for permission to perform an uplink (UL) transmission for a plurality of times. The processor then receives from the network a grant. In response to receiving the grant, the processor performs the UL transmission to the network. In transmitting the request for the plurality of times, the processor transmits the request for the plurality of times at a frequency higher than a frequency at which the request to perform UL transmissions is transmitted to the network when the apparatus is in a normal operational mode.

Abstract: A coating system comprising a vessel, a flexible container within the vessel, and a coating apparatus. The flexible container including an outlet port, wherein the flexible container is configured to contract in response to an increase in pressure within the vessel. The flexible container is configured to output a coating composition through the outlet port in response to contraction. The coating apparatus is configured to receive the coating composition from the outlet port.

Abstract: Examples pertaining to improvement on user equipment (UE) uplink latency in wireless communications are described. When an apparatus is in a special mode, a processor of the apparatus transmits to a network a request for permission to perform an uplink (UL) transmission for a plurality of times. The processor then receives from the network a grant. In response to receiving the grant, the processor performs the UL transmission to the network. In transmitting the request for the plurality of times, the processor transmits the request for the plurality of times at a frequency higher than a frequency at which the request to perform UL transmissions is transmitted to the network when the apparatus is in a normal operational mode.

Abstract: Examples pertaining to improvement on user equipment (UE) uplink latency in wireless communications are described. When an apparatus is in a special mode, a processor of the apparatus transmits to a network a request for permission to perform an uplink (UL) transmission for a plurality of times. The processor then receives from the network a grant. In response to receiving the grant, the processor performs the UL transmission to the network. In transmitting the request for the plurality of times, the processor transmits the request for the plurality of times at a frequency higher than a frequency at which the request to perform UL transmissions is transmitted to the network when the apparatus is in a normal operational mode.

Abstract: This disclosure relates to an external liquid cooling device including at least one radiator, at least one airflow generator, a water block and a mount head module. The at least one airflow generator and the water block are respectively disposed at two adjacent sides of the at least one radiator. The mount head module includes two connectors which are respectively connected to the at least one radiator and the water block via piping. The mount head module and the water block are respectively located at two opposite sides of the at least one radiator.

Abstract: Various embodiments provide for analyzing (e.g., debugging) waveform data generated for a simulated circuit design, which can be used as part of electronic design automation (EDA). For example, where a user modifies a circuit design in a manner that impacts a next simulation run performed on the circuit design, various embodiments perform the next simulation run only on one or more portions of the circuit design affected by the user's modifications, while the results/simulated values for the rest of the circuit design are kept or reused.

Abstract: An external heat dissipation device includes an airflow-guiding base and a refrigerating device. The airflow-guiding base has a supporting surface and a perforation located thereon. The refrigerating device includes a casing, a thermoelectric cooler, a cold air transferring assembly and a hot air transferring assembly. The casing has a storage space. The thermoelectric cooler is located in the storage space and has a cooling surface and a heat releasing surface opposite to each other. The cold air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the cooling surface. The hot air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the heat releasing surface. The storage space is divided into a cold chamber and a hot chamber by the thermoelectric cooler and the cooling plates.

Abstract: The disclosure provides a connector assembly which includes a first connector module, a second connector module and a connection assistance module. The first connector module includes a first carrier and two first connectors which are fixed to the first carrier. The second connector module includes a second carrier and two second connectors which are fixed to the second carrier. The second connectors are respectively and detachably connected to the first connectors. The connection assistance module includes a rotatable component and an assembled component respectively disposed on the first carrier and the second carrier. The rotatable component has an inclined surface, and the assembled component has an engaging portion. When the rotatable component is rotated, the engaging portion is guided by the inclined surface so that the first carrier is moved toward or away from the second carrier, allowing the first connectors to be detachably connected to the second connectors.

Abstract: This disclosure relates to an external liquid cooling device including at least one radiator, at least one airflow generator, a water block and a mount head module. The at least one airflow generator and the water block are respectively disposed at two adjacent sides of the at least one radiator. The mount head module includes two connectors which are respectively connected to the at least one radiator and the water block via piping. The mount head module and the water block are respectively located at two opposite sides of the at least one radiator.

Abstract: Examples pertaining to improvement on user equipment (UE) uplink latency in wireless communications are described. When an apparatus is in a special mode, a processor of the apparatus transmits to a network a request for permission to perform an uplink (UL) transmission for a plurality of times. The processor then receives from the network a grant. In response to receiving the grant, the processor performs the UL transmission to the network. In transmitting the request for the plurality of times, the processor transmits the request for the plurality of times at a frequency higher than a frequency at which the request to perform UL transmissions is transmitted to the network when the apparatus is in a normal operational mode.

Abstract: The present disclosure relates to a method for electronic design. Embodiments may include receiving, using a processor, an electronic design and performing formal verification upon at least a portion of the electronic design for a specific problem statement. Embodiments may further include generating a plurality of traces associated with the formal verification satisfying the specific problem statement and displaying, at a graphical user interface, an option to select at least one of the plurality of traces for display at the graphical user interface while the formal verification is performed.

Abstract: A liquid cooling device, which is configured to be in thermal contact with a first and a second heat sources which are disposed on a PCB, includes a first and a second thermal plates and a first and a second thermal blocks. The first thermal plate is configured to be disposed on the PCB. The second thermal plate is disposed on the first thermal plate. The thermal plates together form a storage space configured to store a coolant. The thermal blocks are configured to respectively be in thermal contact with the heat sources. The thermal blocks are movably disposed on the second thermal plate, such that protruding heights of the thermal blocks from the second thermal plate are adjustable respectively according to a gap width between the first heat source and the second thermal plate and a gap width between the second heat source and the second thermal plate.

Abstract: A liquid cooling device, which is configured to be in thermal contact with a first and a second heat sources which are disposed on a PCB, includes a first and a second thermal plates and a first and a second thermal blocks. The first thermal plate is configured to be disposed on the PCB. The second thermal plate is disposed on the first thermal plate. The thermal plates together form a storage space configured to store a coolant. The thermal blocks are configured to respectively be in thermal contact with the heat sources. The thermal blocks are movably disposed on the second thermal plate, such that protruding heights of the thermal blocks from the second thermal plate are adjustable respectively according to a gap width between the first heat source and the second thermal plate and a gap width between the second heat source and the second thermal plate.

Abstract: The disclosure provides a connector assembly which includes a first connector module, a second connector module and a connection assistance module. The first connector module includes a first carrier and two first connectors which are fixed to the first carrier. The second connector module includes a second carrier and two second connectors which are fixed to the second carrier. The second connectors are respectively and detachably connected to the first connectors. The connection assistance module includes a rotatable component and an assembled component respectively disposed on the first carrier and the second carrier. The rotatable component has an inclined surface, and the assembled component has an engaging portion. When the rotatable component is rotated, the engaging portion is guided by the inclined surface so that the first carrier is moved toward or away from the second carrier, allowing the first connectors to be detachably connected to the second connectors.

Abstract: An external heat dissipation device includes an airflow-guiding base and a refrigerating device. The airflow-guiding base has a supporting surface and a perforation located thereon. The refrigerating device includes a casing, a thermoelectric cooler, a cold air transferring assembly and a hot air transferring assembly. The casing has a storage space. The thermoelectric cooler is located in the storage space and has a cooling surface and a heat releasing surface opposite to each other. The cold air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the cooling surface. The hot air transferring assembly includes a cooling plate and a cooling radiator, and the cooling plate is in thermal contact with the heat releasing surface. The storage space is divided into a cold chamber and a hot chamber by the thermoelectric cooler and the cooling plates.