Patents by Inventor Chien-Ming Wu

Chien-Ming Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110282831
    Abstract: A device including a virtual drive system is provided. An image file can be identified as an ordinary physical disk drive via the device. The device includes a storage unit, an image management unit, and an operating-system interface. The storage unit is configured to store at least one image file. The image management unit includes an image management program which can manage the image files to be selected. The operating-system interface is connected by electrical signals with an operating-system apparatus and is controlled by the image management program to send a controlling signal to the operating-system apparatus. Therefore, the operating-system apparatus can identify as many physical disk drives as the corresponding selected image files.
    Type: Application
    Filed: June 23, 2010
    Publication date: November 17, 2011
    Applicant: National Chip Implementation Center National Applied Research Laboratories
    Inventors: Chun-Ming Huang, Chien-Ming Wu, Wei-De Chien, Wei-Chang Tsai, Chin-Long Wey, Yu-Tsang Chang
  • Publication number: 20110188210
    Abstract: A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements.
    Type: Application
    Filed: April 1, 2010
    Publication date: August 4, 2011
    Applicant: National Chip Implementation Center National Applied Research Laboratories
    Inventors: Chun-Ming Huang, Chin-Long Wey, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chi-Shi Chen, Chi-Sheng Lin
  • Publication number: 20110138248
    Abstract: A method for arranging memories of a low-complexity low-density parity-check (LDPC) decoder and a low-complexity LDPC decoder using the same method are provided. The main idea of the method for arranging memories of a low-complexity LDPC decoder is to merge at least one or two small-capacity memory blocks into one memory group, so that the memory area can be reduced and the power consumption in reading or writing data is lowered. Besides, as the merged memory group shares the same address line in reading or writing data, at least one delay unit is used to adjust the reading or writing order and thereby ensure data validity. A low-complexity LDPC decoder using the disclosed method can meet the demands of high processing rate and low power consumption.
    Type: Application
    Filed: February 18, 2010
    Publication date: June 9, 2011
    Applicant: National Chip Implementation Center National Applied Research Laboratories
    Inventors: Chien-Ming Wu, Ming-Der Shieh, Chun-Ming Huang, Chi-Sheng Lin, Shih-Hao Fang, Shing-Chung Tang
  • Publication number: 20110096506
    Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.
    Type: Application
    Filed: January 12, 2010
    Publication date: April 28, 2011
    Applicant: National Chip Implementation Center National Applied Research Laboratories
    Inventors: Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chin-Long Wey, Chi-Shi Chen, Chi-Sheng Lin
  • Patent number: 7932749
    Abstract: A hybrid driving apparatus and a method thereof are provided. The hybrid driving apparatus includes a first driving unit, a second driving unit, and a resistor. The first driving unit has a first output end. The second driving unit has a second output end coupled to a first bonding pad. The resistor is coupled between the first output end and the first bonding pad to serve as a matching impedance. When the driving apparatus operates in a first transmission mode, the first driving unit and the second driving unit jointly drive the first bonding pad. When the driving apparatus operates in a second transmission mode, the first driving unit and the second driving unit drive the first bonding pad and a second bonding pad respectively.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: April 26, 2011
    Assignee: Realtek Semiconductor Corp.
    Inventor: Chien-Ming Wu
  • Publication number: 20100330741
    Abstract: A fabrication method for a system-on-chip (SoC) module is provided. The fabrication method includes the steps of providing at least two SoC sub-modules and connecting the SoC sub-modules. The SoC sub-modules are electrically connected with each other by connection interfaces of the SoC sub-modules so as to form the SoC module. As the SoC sub-modules have been verified in advance, the time required for verifying the resulting SoC module can be significantly reduced. As for application-specific SoC modules, they are fabricated by connecting with application-specific SoC sub-modules via the appropriate connection interfaces. Thus, the time and costs for developing SoC modules can both be minimized.
    Type: Application
    Filed: September 30, 2009
    Publication date: December 30, 2010
    Applicant: National Chip Implementation Center National Applied Research Laboratories.
    Inventors: Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chin-Long Wey, Chi-Shi Chen, Chi-Sheng Lin
  • Publication number: 20100290633
    Abstract: A method and an apparatus for automatic noise compensation used with audio reproduction equipment are provided. The method comprises: (a) collecting a plurality of mixed audio signals, each mixed audio signal including equipment sound output by the audio reproduction equipment, and background noise; (b) removing the equipment sound from the mixed audio signals to obtain the background noise therein; (c) determining whether or not a plurality of mixed audio signals under inspection include a significant sound; and (d) adjusting the volume of the audio reproduction equipment according to whether or not a significant sound has been generated in the surrounding area and the magnitude of the background noise in the mixed audio signals under inspection to satisfy a plurality of predetermined compensation conditions.
    Type: Application
    Filed: October 18, 2007
    Publication date: November 18, 2010
    Applicant: PANASONIC CORPORATION
    Inventors: Yin-Shan Chen, Che-Ming Lin, Chien-Ming Wu, Chia-Shin Yen
  • Patent number: 7809560
    Abstract: In a method and system for identifying speech sound and non-speech sound in an environment, a speech signal and other non-speech signals are identified from a mixed sound source having a plurality of channels. The method includes the following steps: (a) using a blind source separation (BSS) unit to separate the mixed sound source into a plurality of sound signals; (b) storing spectrum of each of the sound signals; (c) calculating spectrum fluctuation of each of the sound signals in accordance with stored past spectrum information and current spectrum information sent from the blind source separation unit; and (d) identifying one of the sound signals that has a largest spectrum fluctuation as the speech signal.
    Type: Grant
    Filed: January 26, 2006
    Date of Patent: October 5, 2010
    Assignee: Panasonic Corporation
    Inventors: Chia-Shin Yen, Chien-Ming Wu, Che-Ming Lin
  • Patent number: 7755177
    Abstract: The present invention discloses a carrier structure of a System-on-Chip (SoC) with a custom interface. The carrier structure includes a substrate, at least one common die, at least one custom interface and a molding compound. The common die and the custom interface are disposed on the substrate. The molding compound is used to package the common die which electrically connects to the substrate and the custom interface respectively. The carrier structure which includes the common die can form a complete SoC by connecting to an expansive die through the custom interface. The carrier structure with the common die which can be tested and certified in advance allows reducing and simplifying the developing procedures of the SoC.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: July 13, 2010
    Assignees: National Applied Research Laboratories
    Inventors: Chin-Long Wey, Chun-Ming Huang, Chien-Ming Wu, Chih-Chyan Yang, Wei-De Chien
  • Publication number: 20100134627
    Abstract: A hand-off monitoring method is provided for monitoring a space divided into several monitoring regions. Each of the monitoring regions is monitored by a surveillance camera. The hand-off monitoring method comprises receiving a warning signal from a location and identifying a first surveillance camera related to the location according to the warning signal. Then, an object triggering the warning signal is identified according to a video signal provided by the first surveillance camera. A moving path of the object is predicted according to a non-linear movement prediction model. Then, a control operation is performed, according to the moving path, to control the surveillance cameras in the monitoring regions where the moving path passes so as to hand-off monitor the object.
    Type: Application
    Filed: December 16, 2008
    Publication date: June 3, 2010
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Chia-Shin Yen, Pei-Lin Hou, Chien-Ming Wu, Kun-Cheng Tsai
  • Patent number: 7714756
    Abstract: The present invention discloses a digital-to-analog converter (DAC), including a bias voltage generating unit, a digital-to-analog converting stage, and an operating amplifier. The bias voltage generating unit is utilized for generating a first bias voltage. The digital-to-analog converting stage is utilized for converting a digital signal into a voltage signal, the digital-to-analog converting stage includes a current source for providing a current, and a switching unit is coupled to the current source for controlling the current to pass the switching unit according to the digital signal, and a load. The current flows through the load to generate the voltage signal. The operating amplifier is coupled to the bias voltage generating unit and the digital-to-analog converting stage for controlling the current source according to the first bias voltage.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: May 11, 2010
    Assignee: Realtek Semiconductor Corp.
    Inventors: Chen-Chih Huang, Ming-Han Lee, Chien-Ming Wu
  • Publication number: 20100059886
    Abstract: The present invention discloses a carrier structure of a System-on-Chip (SoC) with a custom interface. The carrier structure includes a substrate, at least one common die, at least one custom interface and a molding compound. The common die and the custom interface are disposed on the substrate. The molding compound is used to package the common die which electrically connects to the substrate and the custom interface respectively. The carrier structure which includes the common die can form a complete SoC by connecting to an expansive die through the custom interface. The carrier structure with the common die which can be tested and certified in advance allows reducing and simplifying the developing procedures of the SoC.
    Type: Application
    Filed: November 14, 2008
    Publication date: March 11, 2010
    Inventors: Chin-Long Wey, Chun-Ming Huang, Chien-Ming Wu, Chih-Chyan Yang, Wei-De Chien
  • Publication number: 20100039145
    Abstract: A hybrid driving apparatus and a method thereof are provided. The hybrid driving apparatus includes a first driving unit, a second driving unit, and a resistor. The first driving unit has a first output end. The second driving unit has a second output end coupled to a first bonding pad. The resistor is coupled between the first output end and the first bonding pad to serve as a matching impedance. When the driving apparatus operates in a first transmission mode, the first driving unit and the second driving unit jointly drive the first bonding pad. When the driving apparatus operates in a second transmission mode, the first driving unit and the second driving unit drive the first bonding pad and a second bonding pad respectively.
    Type: Application
    Filed: August 13, 2009
    Publication date: February 18, 2010
    Inventor: Chien-Ming WU
  • Publication number: 20090322559
    Abstract: A direction detecting apparatus is adapted for installation on a vehicle, and includes a first sound collecting unit, a second sound collecting unit, an identifying unit, a direction estimating unit, and a notifying unit. The first and second sound collecting units collect sounds from roads. The identifying unit identifies the types of the sounds collected by the first and second sound collecting units. The direction estimating unit determines whether a warning sound comes from the front when the sound type identified by the identifying unit is a warning sound. The direction estimating unit estimates the direction of the warning sound when the warning sound comes from the front, and estimates a lane in which the warning sound is located when the warning sound comes from behind. The notifying unit is for providing notification of the estimation result of the direction estimating unit.
    Type: Application
    Filed: August 28, 2007
    Publication date: December 31, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Chia-Shin Yen, Chien-Ming Wu
  • Publication number: 20090195950
    Abstract: The invention discloses a network communication processing apparatus capable of processing the cable discharge event. The network communication processing apparatus comprises an electrostatic protection circuit coupled between two signal pins used for transmitting/receiving the network signal on a cable. When the cable discharge event occurred on the cable, the electrostatic protection circuit will be turned on so that the two signal pins are short together to discharge back the electrostatic signal to the cable.
    Type: Application
    Filed: January 29, 2009
    Publication date: August 6, 2009
    Inventors: Chien Ming WU, Tay-Her Tsaur
  • Publication number: 20090070108
    Abstract: In a method and system for identifying speech sound and non-speech sound in an environment, a speech signal and other non-speech signals are identified from a mixed sound source having a plurality of channels. The method includes the following steps: (a) using a blind source separation (BSS) unit to separate the mixed sound source into a plurality of sound signals; (b) storing spectrum of each of the sound signals; (c) calculating spectrum fluctuation of each of the sound signals in accordance with stored past spectrum information and current spectrum information sent from the blind source separation unit; and (d) identifying one of the sound signals that has a largest spectrum fluctuation as the speech signal.
    Type: Application
    Filed: January 26, 2006
    Publication date: March 12, 2009
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Chia-Shin Yen, Chien-Ming Wu, Che-Ming Lin
  • Publication number: 20080117088
    Abstract: The present invention discloses a digital-to-analog converter (DAC), including a bias voltage generating unit, a digital-to-analog converting stage, and an operating amplifier. The bias voltage generating unit is utilized for generating a first bias voltage. The digital-to-analog converting stage is utilized for converting a digital signal into a voltage signal, the digital-to-analog converting stage includes a current source for providing a current, and a switching unit is coupled to the current source for controlling the current to pass the switching unit according to the digital signal, and a load. The current flows through the load to generate the voltage signal. The operating amplifier is coupled to the bias voltage generating unit and the digital-to-analog converting stage for controlling the current source according to the first bias voltage.
    Type: Application
    Filed: November 1, 2007
    Publication date: May 22, 2008
    Inventors: Chen-Chih Huang, Ming-Han Lee, Chien-Ming Wu
  • Publication number: 20070279635
    Abstract: An apparatus and a method for measuring gap width, displacement shift or relative position between two subjects using surface plasmon resonance (SPR) are disclosed. First, a TM mode light beam is provided, so as to generate SPR on a surface of one of the two subjects. Then, the signal of the reflective light or penetrative light on the surface is measured. Because SPR is sensitive to the changes of the gap, displacement shift or relative position when the width of the gap is equal to or smaller than twice the penetration length of the surface plasmon wave, the gap, displacement shift and relative position can be acquired by sensing changes of the signal. Accordingly, the width of the gap, displacement shift, relative position and surface roughness smaller than twice the penetration length or even less than 10 nm can be measured.
    Type: Application
    Filed: July 24, 2006
    Publication date: December 6, 2007
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Pao Tung Wu, Chien Ming Wu
  • Publication number: 20040126797
    Abstract: The present invention relates to a micro-array system and the uses thereof. Particularly, the micro-array system is for a micro amount of biomolecules carrying on a bioreaction in a reaction solution, which comprises a substrate comprising a plurality of micro-wells for receiving the reaction solution; a plurality of micro-beads placing in the reaction solution for the biomolecules attached on surfaces thereon; and a vibrating module for vibrating the substrate, which makes the biomolecules attached on the micro-beads react evenly. Optionally, the micro-array system further comprises a temperature control module for controlling the temperature of the reaction solution. The bioreaction performed in the micro-array system according to the invention has the advantages of having a high sensitivity, being easily post-manipulated, being easily operated, having a high reliability and being reusable.
    Type: Application
    Filed: October 21, 2003
    Publication date: July 1, 2004
    Applicants: NATIONAL TSING-HUA UNIVERSITY, STANFORD UNIVERSITY
    Inventors: Chih-Ying Hsu, Tzong-Hsiung Hseu, Ruey-Shing Huang, David R. Cox, Chien-ming Wu, Jiann Heng Chen, Min-Lung Tsai, Ming-Tsong Lai, Yong-Li Pan, Tai-ching Fan
  • Publication number: 20030077067
    Abstract: A television program editing device includes an input portion for receiving input data, an identity verification portion for inspecting identity and authority of the editor, an internal data storage portion for storing data read from the external storage device, a data processing portion for processing data inquiries and changes, a changed data buffer portion for recording data revised by the editor, a data access portion communicated with the external storage device, and a display portion for exhibiting program guide data to the editor.
    Type: Application
    Filed: October 23, 2001
    Publication date: April 24, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Chien-Ming Wu, Hsien-Fen Hsieh