Patents by Inventor Chien-Ping Huang
Chien-Ping Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140203425Abstract: A heat dissipating device includes a semiconductor packaging structure having a stator set and a semiconductor element provided therein, a fan wheel set pivotally connected to the semiconductor packaging structure, and a guiding structure having a guiding channel. The guiding structure receives the semiconductor packaging structure and the fan wheel set. The fan wheel set includes a plurality of blades located above the surface of the semiconductor packaging structure. The stator set and the semiconductor element controls the first blades. The blades extend beyond side surfaces the semiconductor packaging structure and have their sizes increased, such that the airflow volume can be increased without changing the size of the semiconductor packaging structure.Type: ApplicationFiled: October 30, 2013Publication date: July 24, 2014Applicant: AMTEK SEMICONDUCTORS CO., LTD.Inventor: Chien-Ping Huang
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Patent number: 8736030Abstract: A quad flat non-leaded (QFN) package structure with an electromagnetic interference (EMI) shielding function is proposed, including: a lead frame having a die pad, a plurality of supporting portions connecting to the die pad and a plurality of leads disposed around the periphery of the die pad without connecting to the die pad; a chip mounted on the die pad; bonding wires electrically connecting the chip and the leads; an encapsulant for encapsulating the chip, the bonding wires and the lead frame and exposing the side and bottom surfaces of the leads and the bottom surface of the die pad; and a shielding film disposed on the top and side surfaces of the encapsulant and electrically connecting to the supporting portions for shielding from EMI. A method of fabricating the package structure as described above is further proposed.Type: GrantFiled: April 28, 2010Date of Patent: May 27, 2014Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chin-Tsai Yao, Chien-Ping Huang, Chun-Chi Ke
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Patent number: 8719993Abstract: Semiconductor equipment is provided to include a reaction chamber, a movable frame, and at least one cleaning brush head. The cleaning brush head is configured to operate on at least one dirty portion to be cleaned within the reaction chamber. The movable frame is disposed within the reaction chamber. The movable frame is capable of carrying a susceptor. The cleaning brush head is capable of touching the dirty portion. The cleaning brush head is capable of moving relative to the dirty portion for removing the residue which is attached to the portion to be cleaned.Type: GrantFiled: April 3, 2013Date of Patent: May 13, 2014Assignee: Hermes-Epitek CorporationInventors: Chien-Ping Huang, Tsan-Hua Huang, Tsung-Hsun Han
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Patent number: 8716861Abstract: A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability.Type: GrantFiled: February 27, 2013Date of Patent: May 6, 2014Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Chun-Yuan Li, Fu-Di Tang, Chien-Ping Huang, Chun-Chi Ke
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Patent number: 8653661Abstract: A package structure having an MEMS element is provided, which includes: a protection layer having openings formed therein; conductors formed in the openings, respectively; conductive pads formed on the protection layer and the conductors; a MEMS chip disposed on the conductive pads; and an encapsulant formed on the protection layer for encapsulating the MEMS chip. By disposing the MEMS chip directly on the protection layer to dispense with the need for a carrier, such as a wafer or a circuit board that would undesirably add to the thickness, the present invention reduces the overall thickness of the package to thereby achieve miniaturization.Type: GrantFiled: June 28, 2011Date of Patent: February 18, 2014Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chang-Yueh Chan, Chien-Ping Huang, Chun-Chi Ke, Shih-Kuang Chiu
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Publication number: 20140000655Abstract: Semiconductor equipment is provided to include a reaction chamber, a movable frame, and at least one cleaning brush head. The cleaning brush head is configured to operate on at least one dirty portion to be cleaned within the reaction chamber. The movable frame is disposed within the reaction chamber. The movable frame is capable of carrying a susceptor. The cleaning brush head is capable of touching the dirty portion. The cleaning brush head is capable of moving relative to the dirty portion for removing the residue which is attached to the portion to be cleaned.Type: ApplicationFiled: September 5, 2013Publication date: January 2, 2014Inventors: Chien-Ping HUANG, Tsan-Hua Huang, Tsung-Hsun HAN
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Publication number: 20130277459Abstract: A showerhead is disclosed in this invention. The showerhead includes a bottom portion, at least one plate, and a top portion. The bottom portion includes a plurality of gas tubes which are integratedly formed on the bottom portion. The gas tubes include at least one first gas tube. The at least one plate includes a first plate. The first plate includes a plurality of first openings, wherein the gas tubes pass through the first openings. The top portion is coupled to the bottom portion for forming at least one inner space.Type: ApplicationFiled: June 18, 2013Publication date: October 24, 2013Inventors: Chien-Ping HUANG, Tsan-Hua Huang
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Patent number: 8564115Abstract: Proposed is a package structure having a micro-electromechanical (MEMS) element, including a chip having a plurality of electrical connecting pads and a MEMS element formed thereon; a lid disposed on the chip for covering the MEMS element; a stud bump disposed on each of the electrical connecting pads; an encapsulant formed on the chip with part of the stud bumps being exposed from the encapsulant; and a metal conductive layer formed on the encapsulant and connected to the stud bumps. The invention is characterized by completing the packaging process on the wafer directly to enable thinner and cheaper package structures to be fabricated within less time. This invention further provides a method for fabricating the package structure as described above.Type: GrantFiled: June 8, 2012Date of Patent: October 22, 2013Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chang-Yueh Chan, Chien-Ping Huang, Chun-Chi Ke, Chun-An Huang, Chih-Ming Huang
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Patent number: 8546183Abstract: A heat dissipating semiconductor package and a fabrication method thereof are provided. A semiconductor chip is mounted on a chip carrier. A heat sink is mounted on the chip, and includes an insulating core layer, a thin metallic layer formed on each of an upper surface and a lower surface of the insulating core layer and a thermal via hole formed in the insulating core layer. A molding process is performed to encapsulate the chip and the heat sink with an encapsulant to form a package unit. A singulation process is performed to peripherally cut the package unit. A part of the encapsulant above the thin metallic layer on the upper surface of the heat sink is removed, such that the thin metallic layer on the upper surface of the heat sink is exposed, and heat generated by the chip can be dissipated through the heat sink.Type: GrantFiled: September 30, 2008Date of Patent: October 1, 2013Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chien-Ping Huang, Chih-Ming Huang
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Patent number: 8525348Abstract: A fabrication method of a chip scale package includes providing electronic components, each having an active surface with electrode pads and an opposite inactive surface, and a hard board with a soft layer disposed thereon; adhering the electronic components to the soft layer via the inactive surfaces thereof; pressing the electronic components such that the soft layer encapsulates the electronic components while exposing the active surfaces thereof; forming a dielectric layer on the active surfaces of the electronic components and the soft layer; and forming a first wiring layer on the dielectric layer and electrically connected to the electrode pads, thereby solving the conventional problems caused by directly attaching a chip on an adhesive film, such as film-softening, encapsulant overflow, warpage, chip deviation and contamination that lead to poor electrical connection between the electrode pads and the wiring layer formed in a subsequent RDL process and even waste product.Type: GrantFiled: December 17, 2010Date of Patent: September 3, 2013Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chiang-Cheng Chang, Chun-Chi Ke, Chien-Ping Huang
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Patent number: 8484847Abstract: A showerhead is disclosed in this invention. The showerhead includes a bottom portion, at least one plate, and a top portion. The bottom portion includes a plurality of gas tubes which are integratedly formed on the bottom portion. The gas tubes include at least one first gas tube. The at least one plate includes a first plate. The first plate includes a plurality of first openings, wherein the gas tubes pass through the first openings. The top portion is coupled to the bottom portion for forming at least one inner space.Type: GrantFiled: April 9, 2010Date of Patent: July 16, 2013Assignee: Hermes-Epitek CorporationInventors: Chien-Ping Huang, Tsan-Hua Huang
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Patent number: 8448288Abstract: Semiconductor equipment is provided to include a reaction chamber, a movable frame, and at least one cleaning brush head. The cleaning brush head is configured to operate on at least one dirty portion to be cleaned within the reaction chamber. The movable frame is disposed within the reaction chamber. The movable frame is capable of carrying a susceptor. The cleaning brush head is capable of touching the dirty portion. The cleaning brush head is capable of moving relative to the dirty portion for removing the residue which is attached to the portion to be cleaned.Type: GrantFiled: March 17, 2010Date of Patent: May 28, 2013Assignee: Hermes-Epitek CorporationInventors: Chien-Ping Huang, Tsan-Hua Huang, Tsung-Hsun Han
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Patent number: 8421199Abstract: A semiconductor package structure includes: a dielectric layer; a metal layer disposed on the dielectric layer and having a die pad and traces, the traces each including a trace body, a bond pad extending to the periphery of the die pad, and an opposite trace end; metal pillars penetrating the dielectric layer with one ends thereof connecting to the die pad and the trace ends while the other ends thereof protruding from the dielectric layer; a semiconductor chip mounted on the die pad and electrically connected to the bond pads through bonding wires; and an encapsulant covering the semiconductor chip, the bonding wires, the metal layer, and the dielectric layer. The invention is characterized by disposing traces with bond pads close to the die pad to shorten bonding wires and forming metal pillars protruding from the dielectric layer to avoid solder bridging encountered in prior techniques.Type: GrantFiled: April 29, 2010Date of Patent: April 16, 2013Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang, Chun-Chi Ke
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Patent number: 8420452Abstract: A leadframe-based semiconductor package and a fabrication method thereof are provided. The leadframe-based semiconductor package includes a chip implanted with a plurality of first and second conductive bumps thereon, and a leadframe having a plurality of leads. The first conductive bumps are bonded to the leads to electrically connect the chip to the leadframe. The chip, the first and second conductive bumps, and the leadframe are encapsulated by an encapsulant, with bottom ends of the second conductive bumps and bottom surfaces of the leads being exposed from the encapsulant. This allows the second conductive bumps to provide additional input/output electrical connections for the chip besides the leads.Type: GrantFiled: August 19, 2011Date of Patent: April 16, 2013Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Han-Ping Pu, Chien-Ping Huang
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Publication number: 20130063059Abstract: Proposed is a driver having dead-time compensation function. The driver having dead-time compensation function generates an output voltage according to a voltage command and a frequency command. The driver includes an inverter, an output current detector and a control unit. The inverter receives a DC voltage and operates with a pulse width modulation mode so that the driver outputs the output voltage and an output current. The output current detector detects the current value of the output current to generate a output current detecting signal. The control unit outputs a switching control signal to inverter according to the voltage command and the frequency command. The control unit corrects a reference command according to dead-time and the output current detecting signal related to the output current so that amplitude and waveform smoothness of the output voltage and the output current are compensated.Type: ApplicationFiled: August 20, 2012Publication date: March 14, 2013Applicant: DELTA ELECTRONICS, INC.Inventors: Chien-Yu Chi, Chien-Ping Huang
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Patent number: 8390118Abstract: A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability.Type: GrantFiled: August 19, 2010Date of Patent: March 5, 2013Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Pang-Chun Lin, Chun-Yuan Li, Fu-Di Tang, Chien-Ping Huang, Chun-Chi Ke
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Publication number: 20130026516Abstract: A light-emitting diode (LED) package structure and a packaging method thereof are provided. The packaging method includes: forming first conductive layers on a silicon substrate, and forming a reflection cavity and electrode via holes from a top surface of the silicon substrate; forming a reflection layer on predetermined areas of a surface of the reflection cavity, and forming second conductive layers and metal layers on surfaces of the electrode via holes; and mounting a chip and forming an encapsulant, so as to fabricate the LED package structure. In the present invention, there is no need to perform at least two plating processes for connecting upper and lower conductive layers of the silicon substrate in the electrode via holes, and the problem of poor connection of the conductive layers in the electrode via holes can be avoided, thereby making the fabrication processes simplified and time-effective and also improving the overall production yield.Type: ApplicationFiled: September 1, 2011Publication date: January 31, 2013Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Jih-Fu Wang, Chien-Ping Huang, Wen-Hao Lee, Hsien-Wen Chen, Ming-Hsiu Lee
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Patent number: 8361843Abstract: A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant.Type: GrantFiled: August 1, 2011Date of Patent: January 29, 2013Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Min-Shun Hung, Ho-Yi Tsai, Chien-Ping Huang, Cheng-Hsu Hsiao
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Publication number: 20120286425Abstract: A package structure having an MEMS element is provided, which includes: a protection layer having openings formed therein; conductors formed in the openings, respectively; conductive pads formed on the protection layer and the conductors; a MEMS chip disposed on the conductive pads; and an encapsulant formed on the protection layer for encapsulating the MEMS chip. By disposing the MEMS chip directly on the protection layer to dispense with the need for a carrier, such as a wafer or a circuit board that would undesirably add to the thickness, the present invention reduces the overall thickness of the package to thereby achieve miniaturization.Type: ApplicationFiled: June 28, 2011Publication date: November 15, 2012Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chang-Yueh Chan, Chien-Ping Huang, Chun-Chi Ke, Shih-Kuang Chiu
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Patent number: 8304891Abstract: A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.Type: GrantFiled: December 4, 2008Date of Patent: November 6, 2012Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Cheng-Chia Chiang, Chin-Huang Chang, Chien-Ping Huang, Chih-Ming Huang, Jung-Pin Huang