Patents by Inventor Chien Wang
Chien Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250069881Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.Type: ApplicationFiled: November 7, 2024Publication date: February 27, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Lin CHANG, Chih-Chien WANG, Chihy-Yuan CHENG, Sz-Fan CHEN, Chien-Hung LIN, Chun-Chang CHEN, Ching-Sen KUO, Feng-Jia SHIU
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Publication number: 20250064149Abstract: An elastic support device configured to be disposed on a waist protector is provided, wherein the elastic support device includes: a main body defining a first direction and a second direction which are transverse to each other, the waist protector extending in the first direction, the main body including a plurality of V-shaped elastic members, each of the plurality of V-shaped elastic members including a connection portion and two ribs extending from the connection portion, in the first direction the ribs of neighboring two of the plurality of V-shaped elastic members being connected to each other, in the second direction the connection portions of neighboring two of the plurality of V-shaped elastic members being connected to each other, the main body being elastically restorable.Type: ApplicationFiled: August 20, 2024Publication date: February 27, 2025Inventor: YU-CHIEN WANG
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Publication number: 20250021458Abstract: The electronic device monitoring method, provided by the present invention, comprises the following steps: obtaining a coordinate information and an additional information of each electronic device by the master electronic device; generating a display position table by the master electronic device according to the coordinate information and the additional information of each electronic device; generating a barcode pattern, indicating a monitoring website and a plurality of display parameters, by the master electronic device according to the display position table in real time; reading the barcode pattern by a mobile device to connect to a browsing interface related to the monitoring website associated with a monitoring website address; displaying a device pattern corresponding to each electronic device by the browsing interface according to a plurality of display parameters; wherein the barcode pattern indicates the monitoring website address and the plurality of display parameters.Type: ApplicationFiled: July 10, 2023Publication date: January 16, 2025Inventors: Yung-Chien WANG, Kuo-Chu HU, Szu-Hsin YEH, Chi-Wen HUNG
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Patent number: 12165867Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.Type: GrantFiled: July 24, 2023Date of Patent: December 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wei-Lin Chang, Chih-Chien Wang, Chihy-Yuan Cheng, Sz-Fan Chen, Chien-Hung Lin, Chun-Chang Chen, Ching-Sen Kuo, Feng-Jia Shiu
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Publication number: 20240304445Abstract: A photomask structure includes a plurality of first layout patterns, a plurality of second layout patterns, and a ring-shaped layout pattern. The first layout patterns and the second layout patterns are alternately arranged. Each of the first layout patterns has a first end and a second end. Each of the second layout patterns has a third end and a fourth end. The first end is adjacent to the third end. The second end is adjacent to the fourth end. The ring-shaped layout pattern surrounds the first layout patterns and the second layout patterns. The first end is connected to the ring-shaped layout pattern. The second end is not connected to the ring-shaped layout pattern. The third end is not connected to the ring-shaped layout pattern. The fourth end is connected to the ring-shaped layout pattern.Type: ApplicationFiled: December 25, 2023Publication date: September 12, 2024Applicant: Winbond Electronics Corp.Inventors: Kao-Tun Chen, Li-Chien Wang
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Patent number: 12051660Abstract: Systems, methods, and devices for 3D packaging. In some embodiments, a semiconductor package includes a first die and a second die. The first die includes a first bonding pad on a top of the first die and near a first edge of the first die. The second die includes a second bonding pad on a top of the second die and near a second edge of the second die. A pillar is located on the second bonding pad. The first die is mounted on top of the second die such that the first edge is parallel to the second edge and offset from the second edge such that the pillar is exposed. A wire is bonded to a bonding surface of the pillar and bonded to a bonding surface of the first bonding pad.Type: GrantFiled: October 29, 2021Date of Patent: July 30, 2024Assignee: Western Digital Technologies, Inc.Inventors: Xuyi Yang, Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu
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Patent number: 12023270Abstract: A cervical collar is provided, including: a collar member; a chin support, movably disposed on the collar member; a connection member, movably disposed on the collar member, connected with the chin support; and an adjustment assembly, including an inner thread portion, a thread shaft and a knob, the inner thread portion being disposed on the connection member, the thread shaft being disposed on the collar member and rotatable about an axial direction, the inner thread portion and the thread shaft being screwed with each other, the knob being connected with the thread shaft on the axial direction and located outside an end of the collar member in the axial direction, wherein the thread shaft rotates to drive the inner thread portion to move in the axial direction.Type: GrantFiled: January 27, 2022Date of Patent: July 2, 2024Inventor: Yu-Chien Wang
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Publication number: 20230386820Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.Type: ApplicationFiled: July 24, 2023Publication date: November 30, 2023Inventors: Wei-Lin CHANG, Chih-Chien WANG, Chihy-Yuan CHENG, Sz-Fan CHIEN, Chien-Hung LIN, Chun-Chang CHEN, Ching-Sen KUO, Feng-Jia SHIU
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Patent number: 11830458Abstract: A display device and a method for operating a display device disclosed herein include transmitting a proximity signal from a proximity sensor, the proximity sensor being positioned under a lower surface of a surface layer with an illumination component being positioned between the surface layer and the proximity sensor, in response to the illumination component being deactivated, receiving a reflected proximity signal based on the proximity signal, determining a proximity value based on the reflected proximity signal and modifying an operation of the display device based on the proximity value. The modifying the operation of the display device includes any one or a combination of activating the illumination component, deactivating the illumination component, or modifying a property of the illumination component.Type: GrantFiled: August 8, 2022Date of Patent: November 28, 2023Assignee: Vishay Semiconductor GmbHInventors: Cheng Chieh Huang, Wei Chien Wang, Yu Hao Kao
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Patent number: 11779079Abstract: The present invention relates to a composition of a hot-melt adhesive film and a method for producing a shoe sole. The composition of the hot-melt adhesive film comprises a hot-melt adhesive material and an electromagnetic radiation absorbing material. The hot-melt adhesive material includes ethylene vinyl acetate and thermoplastic materials. The electromagnetic radiation absorbing material is uniformly dispersed in the hot-melt adhesive material. Energy of an electromagnetic radiation can be absorbed by the electromagnetic radiation absorbing material, thereby producing thermal energy, further increasing temperature and adhering property of the hot-melt adhesive film. Therefore, a midsole and an outsole of the shoe sole can be adhered by the hot-melt adhesive film. Further, the hot-melt adhesive film is made from recyclable materials. Therefore, the hot-melt adhesive film is fully recyclable.Type: GrantFiled: August 25, 2019Date of Patent: October 10, 2023Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: Chuh-Yung Chen, Cheng-Wei Huang, Meng-Heng Wu, Chao-Yu Lai, Yu-Ning Shu, Chen-Chien Wang
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Publication number: 20230307377Abstract: A self-aligned multiple patterning mark is provided. The mark includes a group of patterns disposed on the substrate and a cover layer. The group of patterns includes a plurality of strip patterns extending in a first direction and arranged parallel to each other, and the ends of two adjacent strip patterns are connected to each other to form an independent ring. The cover layer is disposed on the substrate and covers the group of patterns. The cover layer has an opening extending in a second direction across the first direction, and the cover layer covers two opposite ends of each strip pattern.Type: ApplicationFiled: February 21, 2023Publication date: September 28, 2023Applicant: Winbond Electronics Corp.Inventors: Chiao-Ling Hsu, Li-Chien Wang
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Patent number: 11769662Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.Type: GrantFiled: March 19, 2021Date of Patent: September 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wei-Lin Chang, Chih-Chien Wang, Chihy-Yuan Cheng, Sz-Fan Chen, Chien-Hung Lin, Chun-Chang Chen, Ching-Sen Kuo, Feng-Jia Shiu
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Publication number: 20230233354Abstract: A cervical collar is provided, including: a collar member; a chin support, movably disposed on the collar member; a connection member, movably disposed on the collar member, connected with the chin support; and an adjustment assembly, including an inner thread portion, a thread shaft and a knob, the inner thread portion being disposed on the connection member, the thread shaft being disposed on the collar member and rotatable about an axial direction, the inner thread portion and the thread shaft being screwed with each other, the knob being connected with the thread shaft on the axial direction and located outside an end of the collar member in the axial direction, wherein the thread shaft rotates to drive the inner thread portion to move in the axial direction.Type: ApplicationFiled: January 27, 2022Publication date: July 27, 2023Inventor: YU-CHIEN WANG
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Publication number: 20230228813Abstract: The present invention provides a glitch detector including a first inverter, a second inverter, a first capacitor and a second capacitor. The first inverter is connected between a supply voltage and a ground voltage, and is configured to receive a first signal at a first node to generate a second signal to a second node. The second inverter is connected between the supply voltage and the ground voltage, and is configured to receive the second signal at the second node to generate the first signal to the first node. A first electrode of the first capacitor is coupled to the supply voltage, and a second electrode of the first capacitor is coupled to the first node. A first electrode of the second capacitor is coupled to the ground voltage, and a second electrode of the second capacitor is coupled to the second node.Type: ApplicationFiled: November 18, 2022Publication date: July 20, 2023Applicant: MEDIATEK INC.Inventor: Tze-Chien Wang
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Patent number: 11701087Abstract: The present disclosure provides a positioning method for head and neck assessment comprising positioning a probe to the head and neck structures of a subject according to reference planes defined by light beams.Type: GrantFiled: July 23, 2020Date of Patent: July 18, 2023Assignee: AMCAD BIOMED CORPORATIONInventors: Argon Chen, Hao-Chien Wang, Chiung-Nien Chen, Pei-Lin Lee, Chin-Chung Shu, Edward Chia-Hao Liu, Shu-Ning Yu
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Publication number: 20230194571Abstract: The present invention provides a probe card. A module cap, on the probe card substrate, is designed to have a chute and the probe module can be installed on or uninstalled from the module cap via the chute. That simplifies the operations of assembling and disassembling the probe card and avoids positioning error.Type: ApplicationFiled: December 19, 2022Publication date: June 22, 2023Inventors: TZU-CHIEN WANG, WEN-YUAN HSU, MING-HSIEN CHEN, JIA-LIN LU
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Patent number: 11583835Abstract: A nickel-iron alloy hydrogenation catalyst and a fabricating method thereof are provided. The nickel-iron alloy hydrogenation catalyst has 65 to 95 atomic percent nickel; and 5 to 35 atomic percent of iron, wherein the nickel-iron alloy hydrogenation catalyst is spherical and has an average particle diameter of 180 to 300 nm. The nickel-iron alloy hydrogenation catalyst is present in a non-carrier form. The nickel-iron alloy hydrogenation catalyst can generate a hydrogenation reaction at a low temperature (about 130˜140° C.) and has a high conversion rate (compared to pure nickel catalyst).Type: GrantFiled: September 23, 2020Date of Patent: February 21, 2023Assignee: National Cheng Kung UniversityInventors: Chuh-Yung Chen, Cheng-Chien Wang, Po-Wei Lan, Ying-Ji Lin
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Patent number: 11529245Abstract: A kinematic-axis locating device for knee arthroplasty includes two spoon-shaped arms and a linking piece. The two spoon-shaped arms are to be placed between a proximal tibia and a distal femur. Due to checking effects of ligaments on the proximal tibia and the distal femur, a medial condyle femur and a lateral condyle femur hold the two spoon-shaped arms on the tibial plateau using their respective curvatures. The linking piece provides a reference axis that is naturally defined by the two inserted and positioned spoon-shaped arms. The reference axis is roughly parallel to a kinematic axis upon which the medial condyle and the lateral condyle pivot against the tibial plateau. Articular surface resection can then be performed between the proximal tibia and the distal femur with reference to the reference axis.Type: GrantFiled: September 29, 2020Date of Patent: December 20, 2022Inventor: Chih-Chien Wang
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Publication number: 20220383793Abstract: A display device and a method for operating a display device disclosed herein include transmitting a proximity signal from a proximity sensor, the proximity sensor being positioned under a lower surface of a surface layer with an illumination component being positioned between the surface layer and the proximity sensor, in response to the illumination component being deactivated, receiving a reflected proximity signal based on the proximity signal, determining a proximity value based on the reflected proximity signal and modifying an operation of the display device based on the proximity value.Type: ApplicationFiled: August 8, 2022Publication date: December 1, 2022Applicant: Vishay Semiconductor GmbHInventors: Cheng Chieh HUANG, Wei Chien WANG, Yu Hao KAO
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Publication number: 20220297259Abstract: The present invention provides an automated system for exchanging polish plate, comprising a loading chamber to store polish plates ready for use, and the automated system has a mechanical arm to pick up and place polish plates between a test chamber and the loading chamber. The present invention realizes automated exchange of polish plates.Type: ApplicationFiled: October 21, 2021Publication date: September 22, 2022Inventors: Tzu-Chien WANG, Wen-Yuan HSU