Patents by Inventor Chien Wang

Chien Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250064149
    Abstract: An elastic support device configured to be disposed on a waist protector is provided, wherein the elastic support device includes: a main body defining a first direction and a second direction which are transverse to each other, the waist protector extending in the first direction, the main body including a plurality of V-shaped elastic members, each of the plurality of V-shaped elastic members including a connection portion and two ribs extending from the connection portion, in the first direction the ribs of neighboring two of the plurality of V-shaped elastic members being connected to each other, in the second direction the connection portions of neighboring two of the plurality of V-shaped elastic members being connected to each other, the main body being elastically restorable.
    Type: Application
    Filed: August 20, 2024
    Publication date: February 27, 2025
    Inventor: YU-CHIEN WANG
  • Publication number: 20250069881
    Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.
    Type: Application
    Filed: November 7, 2024
    Publication date: February 27, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Lin CHANG, Chih-Chien WANG, Chihy-Yuan CHENG, Sz-Fan CHEN, Chien-Hung LIN, Chun-Chang CHEN, Ching-Sen KUO, Feng-Jia SHIU
  • Publication number: 20250021458
    Abstract: The electronic device monitoring method, provided by the present invention, comprises the following steps: obtaining a coordinate information and an additional information of each electronic device by the master electronic device; generating a display position table by the master electronic device according to the coordinate information and the additional information of each electronic device; generating a barcode pattern, indicating a monitoring website and a plurality of display parameters, by the master electronic device according to the display position table in real time; reading the barcode pattern by a mobile device to connect to a browsing interface related to the monitoring website associated with a monitoring website address; displaying a device pattern corresponding to each electronic device by the browsing interface according to a plurality of display parameters; wherein the barcode pattern indicates the monitoring website address and the plurality of display parameters.
    Type: Application
    Filed: July 10, 2023
    Publication date: January 16, 2025
    Inventors: Yung-Chien WANG, Kuo-Chu HU, Szu-Hsin YEH, Chi-Wen HUNG
  • Patent number: 12165867
    Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: December 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Lin Chang, Chih-Chien Wang, Chihy-Yuan Cheng, Sz-Fan Chen, Chien-Hung Lin, Chun-Chang Chen, Ching-Sen Kuo, Feng-Jia Shiu
  • Publication number: 20240304445
    Abstract: A photomask structure includes a plurality of first layout patterns, a plurality of second layout patterns, and a ring-shaped layout pattern. The first layout patterns and the second layout patterns are alternately arranged. Each of the first layout patterns has a first end and a second end. Each of the second layout patterns has a third end and a fourth end. The first end is adjacent to the third end. The second end is adjacent to the fourth end. The ring-shaped layout pattern surrounds the first layout patterns and the second layout patterns. The first end is connected to the ring-shaped layout pattern. The second end is not connected to the ring-shaped layout pattern. The third end is not connected to the ring-shaped layout pattern. The fourth end is connected to the ring-shaped layout pattern.
    Type: Application
    Filed: December 25, 2023
    Publication date: September 12, 2024
    Applicant: Winbond Electronics Corp.
    Inventors: Kao-Tun Chen, Li-Chien Wang
  • Patent number: 12051660
    Abstract: Systems, methods, and devices for 3D packaging. In some embodiments, a semiconductor package includes a first die and a second die. The first die includes a first bonding pad on a top of the first die and near a first edge of the first die. The second die includes a second bonding pad on a top of the second die and near a second edge of the second die. A pillar is located on the second bonding pad. The first die is mounted on top of the second die such that the first edge is parallel to the second edge and offset from the second edge such that the pillar is exposed. A wire is bonded to a bonding surface of the pillar and bonded to a bonding surface of the first bonding pad.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: July 30, 2024
    Assignee: Western Digital Technologies, Inc.
    Inventors: Xuyi Yang, Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu
  • Patent number: 12023270
    Abstract: A cervical collar is provided, including: a collar member; a chin support, movably disposed on the collar member; a connection member, movably disposed on the collar member, connected with the chin support; and an adjustment assembly, including an inner thread portion, a thread shaft and a knob, the inner thread portion being disposed on the connection member, the thread shaft being disposed on the collar member and rotatable about an axial direction, the inner thread portion and the thread shaft being screwed with each other, the knob being connected with the thread shaft on the axial direction and located outside an end of the collar member in the axial direction, wherein the thread shaft rotates to drive the inner thread portion to move in the axial direction.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: July 2, 2024
    Inventor: Yu-Chien Wang
  • Publication number: 20230386820
    Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 30, 2023
    Inventors: Wei-Lin CHANG, Chih-Chien WANG, Chihy-Yuan CHENG, Sz-Fan CHIEN, Chien-Hung LIN, Chun-Chang CHEN, Ching-Sen KUO, Feng-Jia SHIU
  • Patent number: 11830458
    Abstract: A display device and a method for operating a display device disclosed herein include transmitting a proximity signal from a proximity sensor, the proximity sensor being positioned under a lower surface of a surface layer with an illumination component being positioned between the surface layer and the proximity sensor, in response to the illumination component being deactivated, receiving a reflected proximity signal based on the proximity signal, determining a proximity value based on the reflected proximity signal and modifying an operation of the display device based on the proximity value. The modifying the operation of the display device includes any one or a combination of activating the illumination component, deactivating the illumination component, or modifying a property of the illumination component.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: November 28, 2023
    Assignee: Vishay Semiconductor GmbH
    Inventors: Cheng Chieh Huang, Wei Chien Wang, Yu Hao Kao
  • Patent number: 11779079
    Abstract: The present invention relates to a composition of a hot-melt adhesive film and a method for producing a shoe sole. The composition of the hot-melt adhesive film comprises a hot-melt adhesive material and an electromagnetic radiation absorbing material. The hot-melt adhesive material includes ethylene vinyl acetate and thermoplastic materials. The electromagnetic radiation absorbing material is uniformly dispersed in the hot-melt adhesive material. Energy of an electromagnetic radiation can be absorbed by the electromagnetic radiation absorbing material, thereby producing thermal energy, further increasing temperature and adhering property of the hot-melt adhesive film. Therefore, a midsole and an outsole of the shoe sole can be adhered by the hot-melt adhesive film. Further, the hot-melt adhesive film is made from recyclable materials. Therefore, the hot-melt adhesive film is fully recyclable.
    Type: Grant
    Filed: August 25, 2019
    Date of Patent: October 10, 2023
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Chuh-Yung Chen, Cheng-Wei Huang, Meng-Heng Wu, Chao-Yu Lai, Yu-Ning Shu, Chen-Chien Wang
  • Publication number: 20230307377
    Abstract: A self-aligned multiple patterning mark is provided. The mark includes a group of patterns disposed on the substrate and a cover layer. The group of patterns includes a plurality of strip patterns extending in a first direction and arranged parallel to each other, and the ends of two adjacent strip patterns are connected to each other to form an independent ring. The cover layer is disposed on the substrate and covers the group of patterns. The cover layer has an opening extending in a second direction across the first direction, and the cover layer covers two opposite ends of each strip pattern.
    Type: Application
    Filed: February 21, 2023
    Publication date: September 28, 2023
    Applicant: Winbond Electronics Corp.
    Inventors: Chiao-Ling Hsu, Li-Chien Wang
  • Patent number: 11769662
    Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: September 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Lin Chang, Chih-Chien Wang, Chihy-Yuan Cheng, Sz-Fan Chen, Chien-Hung Lin, Chun-Chang Chen, Ching-Sen Kuo, Feng-Jia Shiu
  • Publication number: 20230233354
    Abstract: A cervical collar is provided, including: a collar member; a chin support, movably disposed on the collar member; a connection member, movably disposed on the collar member, connected with the chin support; and an adjustment assembly, including an inner thread portion, a thread shaft and a knob, the inner thread portion being disposed on the connection member, the thread shaft being disposed on the collar member and rotatable about an axial direction, the inner thread portion and the thread shaft being screwed with each other, the knob being connected with the thread shaft on the axial direction and located outside an end of the collar member in the axial direction, wherein the thread shaft rotates to drive the inner thread portion to move in the axial direction.
    Type: Application
    Filed: January 27, 2022
    Publication date: July 27, 2023
    Inventor: YU-CHIEN WANG
  • Publication number: 20230228813
    Abstract: The present invention provides a glitch detector including a first inverter, a second inverter, a first capacitor and a second capacitor. The first inverter is connected between a supply voltage and a ground voltage, and is configured to receive a first signal at a first node to generate a second signal to a second node. The second inverter is connected between the supply voltage and the ground voltage, and is configured to receive the second signal at the second node to generate the first signal to the first node. A first electrode of the first capacitor is coupled to the supply voltage, and a second electrode of the first capacitor is coupled to the first node. A first electrode of the second capacitor is coupled to the ground voltage, and a second electrode of the second capacitor is coupled to the second node.
    Type: Application
    Filed: November 18, 2022
    Publication date: July 20, 2023
    Applicant: MEDIATEK INC.
    Inventor: Tze-Chien Wang
  • Patent number: 11701087
    Abstract: The present disclosure provides a positioning method for head and neck assessment comprising positioning a probe to the head and neck structures of a subject according to reference planes defined by light beams.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: July 18, 2023
    Assignee: AMCAD BIOMED CORPORATION
    Inventors: Argon Chen, Hao-Chien Wang, Chiung-Nien Chen, Pei-Lin Lee, Chin-Chung Shu, Edward Chia-Hao Liu, Shu-Ning Yu
  • Publication number: 20230194571
    Abstract: The present invention provides a probe card. A module cap, on the probe card substrate, is designed to have a chute and the probe module can be installed on or uninstalled from the module cap via the chute. That simplifies the operations of assembling and disassembling the probe card and avoids positioning error.
    Type: Application
    Filed: December 19, 2022
    Publication date: June 22, 2023
    Inventors: TZU-CHIEN WANG, WEN-YUAN HSU, MING-HSIEN CHEN, JIA-LIN LU
  • Patent number: 11583835
    Abstract: A nickel-iron alloy hydrogenation catalyst and a fabricating method thereof are provided. The nickel-iron alloy hydrogenation catalyst has 65 to 95 atomic percent nickel; and 5 to 35 atomic percent of iron, wherein the nickel-iron alloy hydrogenation catalyst is spherical and has an average particle diameter of 180 to 300 nm. The nickel-iron alloy hydrogenation catalyst is present in a non-carrier form. The nickel-iron alloy hydrogenation catalyst can generate a hydrogenation reaction at a low temperature (about 130˜140° C.) and has a high conversion rate (compared to pure nickel catalyst).
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: February 21, 2023
    Assignee: National Cheng Kung University
    Inventors: Chuh-Yung Chen, Cheng-Chien Wang, Po-Wei Lan, Ying-Ji Lin
  • Patent number: 11529245
    Abstract: A kinematic-axis locating device for knee arthroplasty includes two spoon-shaped arms and a linking piece. The two spoon-shaped arms are to be placed between a proximal tibia and a distal femur. Due to checking effects of ligaments on the proximal tibia and the distal femur, a medial condyle femur and a lateral condyle femur hold the two spoon-shaped arms on the tibial plateau using their respective curvatures. The linking piece provides a reference axis that is naturally defined by the two inserted and positioned spoon-shaped arms. The reference axis is roughly parallel to a kinematic axis upon which the medial condyle and the lateral condyle pivot against the tibial plateau. Articular surface resection can then be performed between the proximal tibia and the distal femur with reference to the reference axis.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: December 20, 2022
    Inventor: Chih-Chien Wang
  • Publication number: 20220383793
    Abstract: A display device and a method for operating a display device disclosed herein include transmitting a proximity signal from a proximity sensor, the proximity sensor being positioned under a lower surface of a surface layer with an illumination component being positioned between the surface layer and the proximity sensor, in response to the illumination component being deactivated, receiving a reflected proximity signal based on the proximity signal, determining a proximity value based on the reflected proximity signal and modifying an operation of the display device based on the proximity value.
    Type: Application
    Filed: August 8, 2022
    Publication date: December 1, 2022
    Applicant: Vishay Semiconductor GmbH
    Inventors: Cheng Chieh HUANG, Wei Chien WANG, Yu Hao KAO
  • Publication number: 20220301849
    Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.
    Type: Application
    Filed: March 19, 2021
    Publication date: September 22, 2022
    Inventors: Wei-Lin CHANG, Chih-Chien WANG, Chihy-Yuan CHENG, Sz-Fan CHEN, Chien-Hung LIN, Chun-Chang CHEN, Ching-Sen KUO, Feng-Jia SHIU