Abstract: The present invention relates to a midsole material composition, a method for producing the midsole material and a shoe sole. The midsole material composition comprises an elastomer, a thermoplastic polymer, a suitable crosslinker and a catalyst, such that the midsole material of the present invention can be fabricated by subjecting the midsole material composition to a phase-inversion crosslinking reaction and a foaming process. The aforementioned thermoplastic polymer, which is a recyclable material, is inverted into a continuous phase after the phase-inversion crosslinking reaction, thereby enhancing a recycling property of the midsole material and improving a reusability of the shoe sole.

Abstract: A solid dosage form comprises an inner core containing a cycloserine compound and an outer layer attached to the inner core. The dosage form can be enteric tablet or transdermal patch, suitable for treating a neuropsychiatric disorder or tuberculosis.

Abstract: Systems, methods, and devices for 3D packaging. In some embodiments, a semiconductor package includes a first die and a second die. The first die includes a first bonding pad on a top of the first die and near a first edge of the first die. The second die includes a second bonding pad on a top of the second die and near a second edge of the second die. A pillar is located on the second bonding pad. The first die is mounted on top of the second die such that the first edge is parallel to the second edge and offset from the second edge such that the pillar is exposed. A wire is bonded to a bonding surface of the pillar and bonded to a bonding surface of the first bonding pad.

Abstract: An adjustable neck brace is provided, including: a neck collar, including a sliding engaging groove, the sliding engaging groove extending in an extension direction and having a first engaging portion; a single positioning member, attached to the neck collar and movable along the sliding engaging groove, having a second engaging portion, the second engaging portion being releasably positioningly engaged with the first engaging portion; a chin support, relatively movably connected to the neck collar; at least one connecting member, connecting the positioning member and the chin support.

Abstract: A neck collar is provided, including: a neck sleeve, a chin support and an adjustment mechanism. The chin support is swingably connected to the neck sleeve. The adjustment mechanism includes at least one linking member and at least one driving member with which the linking member is co-movably connected. Each of the at least one linking member is movably connected to the neck sleeve and movably abutted against the chin support. The at least one driving member is externally operable and adjustable to drive the at least one linking member to move relative to the neck sleeve and to move relative to the chin support, simultaneously, between a first position and a second position. When the at least one linking member is moved toward the second position, the at least one linking member drives the chin support to swing upwardly relative to the neck sleeve.

Abstract: Systems, methods, and devices for 3D packaging. In some embodiments, a semiconductor package includes a first die and a second die. The first die includes a first bonding pad on a top of the first die and near a first edge of the first die. The second die includes a second bonding pad on a top of the second die and near a second edge of the second die. A pillar is located on the second bonding pad. The first die is mounted on top of the second die such that the first edge is parallel to the second edge and offset from the second edge such that the pillar is exposed. A wire is bonded to a bonding surface of the pillar and bonded to a bonding surface of the first bonding pad.

Abstract: A bearing system includes a first bearing, a second bearing, and a rotating member. The first bearing is hollow and has a first inner face. The second bearing is located in the first bearing. The second bearing includes a second inner face axially aligned with the first inner face. A partitioning space is formed between the first inner face and the second inner face. The rotating member has a shaft and a protruding portion coupled to the shaft. The protruding portion is located in the partitioning space. A dynamic pressure gap is formed between the protruding portion and the first inner face during rotation. Another dynamic pressure gap is formed between the protruding portion and the second inner face during rotation.

Abstract: A monitoring structure for a critical dimension of a lithography process including a dummy pattern layer and a patterned photoresist layer is provided. The dummy pattern layer includes a dummy pattern. The patterned photoresist layer includes at least one monitoring mark located above the dummy pattern. The monitoring mark includes a first portion and a second portion that intersect each other. The first portion extends in a first direction, the second portion extends in a second direction, and the first direction intersects the second direction.

Abstract: A first photoresist pattern and a second photoresist pattern are formed over a substrate. The first photoresist pattern is separated from the second photoresist pattern by a gap. A chemical mixture is coated on the first and second photoresist patterns. The chemical mixture contains a chemical material and surfactant particles mixed into the chemical material. The chemical mixture fills the gap. A baking process is performed on the first and second photoresist patterns, the baking process causing the gap to shrink. At least some surfactant particles are disposed at sidewall boundaries of the gap. A developing process is performed on the first and second photoresist patterns. The developing process removes the chemical mixture in the gap and over the photoresist patterns. The surfactant particles disposed at sidewall boundaries of the gap reduce a capillary effect during the developing process.

Abstract: A monitoring structure for a critical dimension of a lithography process including a dummy pattern layer and a patterned photoresist layer is provided. The dummy pattern layer includes a dummy pattern. The patterned photoresist layer includes at least one monitoring mark located above the dummy pattern. The monitoring mark includes a first portion and a second portion that intersect each other. The first portion extends in a first direction, the second portion extends in a second direction, and the first direction intersects the second direction.

Abstract: Systems, methods, and devices for 3D packaging. In some embodiments, a semiconductor package includes a first die and a second die. The first die includes a first bonding pad on a top of the first die and near a first edge of the first die. The second die includes a second bonding pad on a top of the second die and near a second edge of the second die. A pillar is located on the second bonding pad. The first die is mounted on top of the second die such that the first edge is parallel to the second edge and offset from the second edge such that the pillar is exposed. A wire is bonded to a bonding surface of the pillar and bonded to a bonding surface of the first bonding pad.

Abstract: A nickel-iron alloy hydrogenation catalyst and a fabricating method thereof are provided. The nickel-iron alloy hydrogenation catalyst has 65 to 95 atomic percent nickel; and 5 to 35 atomic percent of iron, wherein the nickel-iron alloy hydrogenation catalyst is spherical and has an average particle diameter of 180 to 300 nm. The nickel-iron alloy hydrogenation catalyst is present in a non-carrier form. The nickel-iron alloy hydrogenation catalyst can generate a hydrogenation reaction at a low temperature (about 130˜140° C.) and has a high conversion rate (compared to pure nickel catalyst).

Abstract: Techniques, devices, and systems disclosed herein include detecting a vertical synchronization (VSYNC) signal cycle, determining a high frequency trigger pulse based on detecting an illumination component's pulse width modulation (PWM) signal, the high frequency trigger pulse corresponding to the illumination component's deactivation times, receiving a delay time period and activating a first sensor, at a first time, within the VSYNC signal cycle, the first time determined based on the high frequency trigger pulse and the delay time period. The first sensor may sense a first sensor reading and may be deactivated after being activated. A display setting may be adjusted based at least on the first sensor reading and the illumination component may be activated after the first sensor is deactivated.

Abstract: A neck collar is provided, including: a neck sleeve, a chin support and an adjustment mechanism. The chin support is swingably connected to the neck sleeve. The adjustment mechanism includes at least one linking member and at least one driving member with which the linking member is co-movably connected. Each of the at least one linking member is movably connected to the neck sleeve and movably abutted against the chin support. The at least one driving member is externally operable and adjustable to drive the at least one linking member to move relative to the neck sleeve and to move relative to the chin support, simultaneously, between a first position and a second position. When the at least one linking member is moved toward the second position, the at least one linking member drives the chin support to swing upwardly relative to the neck sleeve.

Abstract: A bearing system includes a first bearing, a second bearing, and a rotating member. The first bearing is hollow and has a first inner face. The second bearing is located in the first bearing. The second bearing includes a second inner face axially aligned with the first inner face. A partitioning space is formed between the first inner face and the second inner face. The rotating member has a shaft and a protruding portion coupled to the shaft. The protruding portion is located in the partitioning space. A dynamic pressure gap is formed between the protruding portion and the first inner face during rotation. Another dynamic pressure gap is formed between the protruding portion and the second inner face during rotation.

Abstract: A rear support assembly of neck collar is provided, including: a nape base, including a main body and two positioning mechanisms, each positioning mechanisms including a positioning member and an inserting space, the positioning member having a first combination portion; two support sheets, respectively movably inserted into the inserting space of one of the two positioning mechanisms, each said support sheets including a plurality of second combination portions, each second combination portions being engageable with the first combination portion of one of the two positioning mechanisms; one of the two support sheets and the main body respectively having one of a first guide track or a first rib; the other of the two support sheets and the main body respectively having one of a second guide track or a second rib.

Abstract: An orthosis is provided, including: a first supporting member, a second supporting member, a pivot mechanism and an attachment mechanism. The first supporting member is configured to be attached to an inner side of a foot and correspond to a big toe. The second supporting member is configured to be attached to the inner side of the foot and correspond to a metatarsophalangeal (MTP) joint of the big toe. The first supporting member and the second supporting member are rotatably connected with the pivot mechanism, and the pivot mechanism has a pivot axis configured to correspond to a distal interphalangeal (DIP) joint of the big toe. The attachment mechanism is configured to attach the first supporting member and the second supporting member to the foot.

Abstract: A first photoresist pattern and a second photoresist pattern are formed over a substrate. The first photoresist pattern is separated from the second photoresist pattern by a gap. A chemical mixture is coated on the first and second photoresist patterns. The chemical mixture contains a chemical material and surfactant particles mixed into the chemical material. The chemical mixture fills the gap. A baking process is performed on the first and second photoresist patterns, the baking process causing the gap to shrink. At least some surfactant particles are disposed at sidewall boundaries of the gap. A developing process is performed on the first and second photoresist patterns. The developing process removes the chemical mixture in the gap and over the photoresist patterns. The surfactant particles disposed at sidewall boundaries of the gap reduce a capillary effect during the developing process.

Abstract: The present disclosure provides a positioning method for head and neck assessment comprising positioning a probe to the head and neck structures of a subject according to reference planes defined by light beams.