Patents by Inventor Chien-Wei Lee

Chien-Wei Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120075209
    Abstract: A touch panel, which contains a substrate, a mask layer, a sensing circuit layer and a barrier layer, is disclosed. The mask layer is disposed around the bottom surface of the substrate. The sensing circuit layer is located on the same side of the substrate with the mask layer, and the surrounding area of the sensing circuit layer is shielded by the mask layer. In addition, the area of the sensing circuit layer exposed from the mask layer is defined as a sensing region. Furthermore, the barrier layer is disposed between the substrate and the sensing circuit layer and between the mask layer and the sensing circuit layer. Concurrently, the barrier layer further provides separation between the mask layer and the sensing circuit layer. The barrier layer has a transparent appearance. Particularly, the barrier layer is provided for changing optical refraction and harmonizing optical reflection index and transmittance.
    Type: Application
    Filed: March 18, 2011
    Publication date: March 29, 2012
    Applicant: CATCHER TECHNOLOGY CO., LTD.
    Inventors: CHIEN-WEI LEE, YAN-WEI CHEN, CHIH-LUNG LIN
  • Patent number: 8130013
    Abstract: A driving circuit of an input/output (I/O) interface is provided. The driving circuit includes a main output stage and an enhancing unit. The main output stage receives at least one driving signal and outputs an output signal corresponding to an input signal accordingly. The enhancing unit is coupled to the main output stage. The enhancing unit receives and detects the level of the output signal so as to drive the output force of the main output stage in a first output level or a second output level, wherein the first output level is higher than the second output level.
    Type: Grant
    Filed: February 8, 2010
    Date of Patent: March 6, 2012
    Assignee: Phison Electronics Corp.
    Inventors: Yu-Tong Lin, Yu-Chia Liu, Chien-Wei Lee
  • Publication number: 20110148475
    Abstract: A driving circuit of an input/output (I/O) interface is provided. The driving circuit includes a main output stage and an enhancing unit. The main output stage receives at least one driving signal and outputs an output signal corresponding to an input signal accordingly. The enhancing unit is coupled to the main output stage. The enhancing unit receives and detects the level of the output signal so as to drive the output force of the main output stage in a first output level or a second output level, wherein the first output level is higher than the second output level.
    Type: Application
    Filed: February 8, 2010
    Publication date: June 23, 2011
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: YU-TONG LIN, Yu-Chia Liu, Chien-Wei Lee
  • Publication number: 20110083829
    Abstract: A method for manufacturing a heat-dissipating structure with high heat-dissipating efficiency, includes the following steps: providing a heat-dissipating casing having a hollow heat-dissipating body that has at least two ends; closing one end of the hollow heat-dissipating body; pouring work liquid from other end of the hollow heat-dissipating body into an inner portion of the hollow heat-dissipating body; cooling the work liquid from the liquid state to the solid state by an external cooling medium; extracting air from the hollow heat-dissipating body; and then closing the other end of the hollow heat-dissipating body to form an evacuated hollow heat-dissipating body.
    Type: Application
    Filed: October 9, 2009
    Publication date: April 14, 2011
    Inventors: Shui-Hsu HUNG, Chien-Wei LEE, Shih-Wei LEE
  • Publication number: 20100326644
    Abstract: A plane-type heat-dissipating structure with high heat-dissipating effect includes a first heat-dissipating unit and a second heat-dissipating unit. The first heat-dissipating unit has an evacuated hollow heat-dissipating body, a plurality of supports integratedly formed in the hollow heat-dissipating body in order to divide an inner space of the hollow heat-dissipating body into a plurality of receiving spaces, and a plurality of microstructures integratedly formed on an inner surface of the hollow heat-dissipating body. Work liquid is filled into the receiving spaces. The second heat-dissipating unit is integratedly formed on an outer surface of the first heat-dissipating unit.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 30, 2010
    Inventors: Shui-Hsu Hung, Chien-Wei Lee, Shih-Wei Lee
  • Publication number: 20060288914
    Abstract: A compound pallet comprising an upper compound plate and a lower compound plate; each plate being formed by using a plurality of plate layers clamping a plurality of fiber layers; and filling material is filled between the plate fibers and the fiber layers; and the filling material being formed by 35 to 40 neutral liquid, 5 to 10% of adhesive, 40% of cement and 20% of edible seaweed. The upper compound plate is formed with a plurality of protruded ribs so that a cross section of the upper compound plate is formed as continuous rectangular waves; and the lower compound plate is formed with a plurality of protruded ribs so that a cross section of the lower compound plate is formed as continuous rectangular waves; and the orientation of the ribs of the upper compound plate is vertical to the orientation of the ribs of the lower compound plate.
    Type: Application
    Filed: June 28, 2005
    Publication date: December 28, 2006
    Inventor: Chien-Wei Lee