Abstract: The present disclosure relates to a method of performing an optical proximity correction (OPC) procedure that provides for a high degree of freedom by using an approximation design layer. In some embodiments, the method is performed by forming an integrated chip (IC) design having an original design layer with one or more original design shapes. An approximation design layer, which is different from the original design layer, is generated from the original design layer. The approximation design layer is a design layer that has been adjusted to remove features that may cause optical proximity correction (OPC) problems. An optical proximity correction (OPC) procedure is then performed on the approximation design layer. By performing the OPC procedure on the approximation design layer rather than on the original design layer, characteristics of the OPC procedure can be improved.

Abstract: Provided is an integrated circuit (IC) design method. The method includes receiving a design layout of the IC, the design layout having a first main feature, and adding a negative assist feature to the design layout, wherein the negative assist feature has a first width, the negative assist feature divides the first main feature into a second main feature and a third main feature by the first width, and the first width is sub-resolution in a photolithography process.

Abstract: Provided is an integrated circuit (IC) photo mask. The IC photo mask includes a main feature of the IC, the main feature having a plurality of sides, and a plurality of assist features, the assist features being spaced from each other and spaced from the main feature, wherein each one of the assist features is adjacent to one of the sides, each one of the assist features has an elongated shape along a direction, whereby extending the shape in the direction would intersect at least another one of the assist features and the assist features are sub-resolution correction features for correcting for optical proximity effect in a photolithography process.

Abstract: A touch electrode device includes first electrode lines and second electrode lines formed on a transparent substrate. An insulating block is disposed at a junction between a first conductive connecting portion of the first electrode line and a second conductive connecting portion of the second electrode line. At least one insulating line is extended from the insulating block and disposed along the first electrode line.

Abstract: A touch panel includes first electrode lines disposed along a first axis on a transparent substrate, adjacent first electrodes being connected via a first conductive connecting element. The touch panel also includes second electrode lines disposed along a second axis on the transparent substrate, adjacent second electrodes being connected via a conductive bridge. The conductive bridge includes low-temperature conductive material.

Abstract: A touch electrode device includes first electrode lines and second electrode lines formed on a transparent substrate. An insulating block is disposed at a junction between a first conductive connecting portion of the first electrode line and a second conductive connecting portion of the second electrode line. Insulating lines are respectively extended from the insulating blocks along the first electrode line, and are disposed in gaps between the first electrodes and the adjacent second electrodes.

Abstract: A touch panel includes a touch electrode layer disposed on a touch area of a transparent substrate, and a light shielding layer disposed on a boundary area of the transparent substrate. At least one inner edge of the light shielding layer has plural trenches filled with conductive material. A trace layer is disposed on the light shielding layer and is electrically coupled with the touch electrode layer via the filled conductive material.

Abstract: A touch electrode device includes first electrode lines and second electrode lines formed on a transparent substrate. An insulating block is disposed at a junction between a first conductive connecting portion of the first electrode line and a second conductive connecting portion of the second electrode line. At least one insulating line is extended from the insulating block and disposed along the first electrode line.

Abstract: A method of forming a photolithography mask including forming a first linear non-dense feature on the mask and forming a plurality of parallel linear assist features disposed substantially perpendicular to the at least one linear non-dense design feature. In an embodiment, the photolithography mask further includes a first transverse linear assist feature disposed substantially transverse to the plurality of parallel linear assist features.

Abstract: The present invention is directed to a touch panel. The touch panel includes an optical layer disposed on a bottom surface of at least one peripheral edge of a transparent substrate. A light shielding layer is disposed on at least a portion of a bottom surface of the optical layer. A touch sensing layer is disposed below the transparent substrate and the light shielding layer.

Abstract: A touch electrode device includes a substrate and at least one transparent electrode layer. The transparent electrode layer is disposed above a surface of the substrate. The transparent electrode layer includes a plurality of metal nanowires.

Abstract: The present invention is directed to a touch panel. The touch panel includes a light shielding layer disposed on a bottom surface of at least one peripheral edge of a transparent substrate. An optical layer with a refractive index greater than 1.5 is disposed on a surface of the transparent substrate. A touch sensing layer is disposed below the transparent substrate.

Abstract: A method of forming a photolithography mask including forming a first linear non-dense feature on the mask and forming a plurality of parallel linear assist features disposed substantially perpendicular to the at least one linear non-dense design feature. In an embodiment, the photolithography mask further includes a first transverse linear assist feature disposed substantially transverse to the plurality of parallel linear assist features.

Abstract: A photolithography mask includes a design feature located in an isolated or semi-isolated region of the mask and a plurality of parallel linear assist features disposed substantially perpendicular to the design feature. The plurality of parallel linear assist features may include a first series of parallel assist features disposed on a first side of the design feature and perpendicularly thereto, and a second series of parallel assist features disposed on a second side of the design feature and perpendicularly thereto.

Abstract: An optimized optical proximity correction modeling method comprises receiving a selection of a regression method, displaying regression parameters, receiving values for the displayed regression parameters, receiving a selection of an optimization method, displaying optimization parameters, receiving values for the displayed optimization parameters, and generating an optimized optical proximity correction output.

Abstract: A photolithography mask includes a design feature located in an isolated or semi-isolated region of the mask and a plurality of parallel linear assist features disposed substantially perpendicular to the design feature. The plurality of parallel linear assist features may include a first series of parallel assist features disposed on a first side of the design feature and perpendicularly thereto, and a second series of parallel assist features disposed on a second side of the design feature and perpendicularly thereto.

Abstract: An automatic air-blown cleaning apparatus for cleaning a liquid crystal display (LCD) component in an LCD assembly process. The automatic air-blown cleaning apparatus has an assembly station for receiving and assembling the liquid crystal display component, a conveying device for delivering the liquid crystal display component to the next assembly station, and an air filtering blower provided on the conveying device. The air filtering blower sends an air flow toward the liquid crystal display component to remove residual matter from the liquid crystal display component.

Abstract: A photolithography mask includes a design feature located in an isolated or semi-isolated region of the mask and a plurality of parallel linear assist features disposed substantially perpendicular to the design feature.

Abstract: An automatic air-blown cleaning apparatus for cleaning a liquid crystal display (LCD) component in an LCD assembly process. The automatic air-blown cleaning apparatus has an assembly station for receiving and assembling the liquid crystal display component, a conveying device for delivering the liquid crystal display component to the next assembly station, and an air filtering blower provided on the conveying device. The air filtering blower sends an air flow toward the liquid crystal display component to remove residual matter from the liquid crystal display component.

Abstract: An automatic air-blown cleaning apparatus for cleaning a liquid crystal display (LCD) component in an LCD assembly process. The automatic air-blown cleaning apparatus has an assembly station for receiving and assembling the liquid crystal display component, a conveying device for delivering the liquid crystal display component to the next assembly station, and an air filtering blower provided on the conveying device. The air filtering blower sends an air flow toward the liquid crystal display component to remove residual matter from the liquid crystal display component.