Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A product-display system for displaying and securing a retail product. The system may include a retainer having a retainer bracket and a retainer body coupled to the retainer bracket. A retaining cable may be coupled to the retainer body at an opening in the retainer body. A fastener that may be unfastened to release the product from the retainer may only be accessed through the opening of the retainer body such that when the retaining cable is coupled to the opening, no fasteners of the retainer may be visible or accessible. The system may also include a display stem for holding the retainer and product. The display stem may include a recess for receiving at least a portion of the retainer body. The retaining cable may extend through the display stem and may simultaneously transmit power and data to a displayed product. The retainer may be returned to and held on top of the display stem using a retaining cable.

Abstract: A switching regulator includes a power stage circuit and a controller circuit. The controller circuit includes a first amplification circuit, a second amplification circuit, a ramp signal generation circuit, and a comparator. The first amplification circuit generates an amplification signal according to a difference between a low-pass filtered signal and a feedback signal. The second amplification circuit generates an adjustment signal according to a difference between the feedback signal and a fast response signal. The comparator generates a pulse width modulation signal according to a difference between the amplification signal and a ramp signal to generate a switch control signal. The adjustment signal adaptively adjusts the amplification signal or the ramp signal. The low-pass filtered signal is related to a signal generated by filtering out higher frequency part of the reference signal, and the reference signal is related to a dynamic change of a target level of the output voltage.

Abstract: A system includes a processor, and a display, a reader, a switch, a scale, a memory device, intake-type buttons and output-type buttons that are connected to the processor. The processor controls the display to display an identification number obtained by using the reader to read an identifier. The switch is operated to enable the processor to operate in an intake mode or an output mode. When operating in the intake (output) mode, the processor controls the display to display a symbol corresponding to one of the intake-type (output-type) buttons that is determined to be pressed, and in response to receipt of weight data from the scale, controls the display to display a value of pre-intake (post-output) weight obtained based on the weight data, and stores the value of pre-intake (post-output) weight in the memory device.

Abstract: Described herein are variations of an analyte monitoring system, including an analyte monitoring device. For example, an analyte monitoring device may include an implantable microneedle array for use in measuring one or more analytes (e.g., glucose), such as in a continuous manner. The microneedle array may include, for example, at least one microneedle including a tapered distal portion having an insulated distal apex, and an electrode on a surface of the tapered distal portion located proximal to the insulated distal apex. At least some of the microneedles may be electrically isolated such that one or more electrodes is individually addressable.

Abstract: A semiconductor device includes a plurality of semiconductor layers arranged one above another, and source/drain epitaxial regions on opposite sides of the plurality of semiconductor layers. The semiconductor device further includes a gate structure surrounding each of the plurality of semiconductor layers. The gate structure includes interfacial layers respectively over the plurality of semiconductor layers, a high-k dielectric layer over the interfacial layers, and a gate metal over the high-k dielectric layer. The gate structure further includes gate spacers spacing apart the gate structure from the source/drain epitaxial regions. A top position of the high-k dielectric layer is lower than top positions of the gate spacers.

Abstract: The present disclosure provides a soluble microcarrier, including soluble polymer including a plurality of soluble monomers binding to each other with a reducing crosslinking agent. The soluble microcarrier of present disclosure facilitates the attachment of cells, and reducing agents can facilitate the detachment of cells. When the soluble microcarrier is in contact with a reducing agent, the soluble microcarrier degrades.

Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Abstract: A power converter includes an upper-gate circuit, a lower-gate circuit, an inductor, a first current sensor, a second current sensor, a weight adjustment circuit, and a PWM (Pulse Width Modulation) controller. The upper-gate circuit receives an input voltage. The lower-gate circuit is coupled to a ground node. The upper-gate circuit and the lower-gate circuit are operated according to the PWM voltage. The inductor is coupled to the upper-gate circuit and the lower-gate circuit. The first current sensor monitors the upper-gate circuit, so as to generate a first detection current. The second current sensor monitors the lower-gate circuit, so as to generate a second detection current. The weight adjustment circuit generates a control current according to the first detection current and the second detection current. The PWM controller generates the PWM voltage according to the control current.

Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Abstract: A semiconductor fabrication facility (FAB) is provided. The FAB includes a group of processing tools. The FAB also includes a number of sampling tubes connecting the group of processing tools. In addition, the FAB includes a sampling station which includes a connection port, a valve manifold box and a controller. The valve manifold box is used for switching a gas sample from one of the processing tools to the connection port. The controller is sued for controlling the connection of the valve manifold box and the sampling tubes. The FAB further includes a metrology module. The metrology module is connected to the connection port of the sampling station and is used to perform a measurement of a parameter related to the gas sample.

Abstract: A semiconductor device includes source and a drain above a substrate and spaced apart along a first direction, and a semiconductor channel extending between the source and the drain. The semiconductor device further includes gate spacers, an interfacial layer, and a metal gate structure. The gate spacers are disposed on the semiconductor channel and spaced apart by a spacer-to-spacer distance along the first direction. The interfacial layer is on the semiconductor channel. The interfacial layer extends a length along the first direction, and the length is less than a minimum of the spacer-to-spacer distance along the first direction. The metal gate structure is over the interfacial layer.

Abstract: A PWM (Pulse Width Modulation) controller includes a current detector, a current emulator, a voltage-to-current converter, and a current adder. The current detector detects a first current, and generates a second current according to the first current. The current detector receives an input voltage and outputs an output voltage. The current emulator obtains the relative information of a lower-gate current. The voltage-to-current converter draws a third current from the current emulator according to the input voltage and the output voltage. The current emulator generates a fourth current according to the relative information and the third current. The current adder adds the fourth current to the second current, so as to generate a sum current.

Abstract: The invention relates to a power tool that can be held with one hand for reversing, comprising: a casing having a grip part and a manipulation port; a driving device having a control member; the control member is capable of controlling an actuation direction of the driving device; a power source disposed below the driving device and capable of driving the driving device; a reversing assembly disposed at a periphery of the power source and having a reversing member; the reversing member controls the control member to generate changes of displacement, a driving direction of the driving device is changed by action of turning the reversing assembly that is away from the driving device, and there is an appropriate manipulating distance between the grip part and the manipulation port, so that a user is capable of manipulating by holding and reversing the power tool with one hand at a same position.

Abstract: A photochromic compound including a core skeletal structure represented by the following Formula (I), wherein D is oxygen or sulfur; E is oxygen, sulfur, or NR2?; a is 0 or 1; R1 is hydrogen, or substituted or unsubstituted alkyl; R2 and R2? are each independently selected from hydrogen, substituted or unsubstituted alkyl, substituted or unsubstituted aryl, substituted or unsubstituted heteroaryl, or substituted or unsubstituted heterocycloalkyl; and the photochromic compound is a thermally reversible photochromic compound.

Abstract: A semiconductor fabrication facility (FAB) is provided. The FAB includes a group of processing tools. The FAB also includes a number of sampling tubes connecting the group of processing tools. In addition, the FAB includes a sampling station which includes a connection port, a valve manifold box and a controller. The valve manifold box is used for switching a gas sample from one of the processing tools to the connection port. The controller is sued for controlling the connection of the valve manifold box and the sampling tubes. The FAB further includes a metrology module. The metrology module is connected to the connection port of the sampling station and is used to perform a measurement of a parameter related to the gas sample.

Abstract: A semiconductor fabrication facility (FAB) is provided. The FAB includes a number of processing tools. The FAB also includes a sampling station connected to the processing tools. In addition, the FAB includes a detection vehicle detachably connected to the sampling station and comprising a metrology module. When the detection vehicle is connected to the sampling station, a gas sample is delivered from one of the processing tools to the metrology module of the detection vehicle via the sampling station for performing a measurement of a parameter in related to the gas sample by the metrology module. In addition, the FAB includes a control system configured to issue a warning when the parameter in related to the gas sample from the one of the processing tools is out of a range of acceptable values associated with the one of the processing tools.