Abstract: The present disclosure relates to anti-SSEA4 antibodies and bindings fragments thereof comprising specific complementarity determining regions capable of high affinity binding to SSEA4 molecules and SSEA4-associated expressing tumor cells, such as breast cancer, pancreatic cancer, and renal cancer cells. The anti-SSEA4 antibodies and binding fragments induce ADCC or CDC effects in the targeted tumor cells and inhibit and/or reduce the cancer/tumor proliferation. The present disclosure also provides anti-SSEA4 antibodies and binding fragments thereof as a pharmaceutical composition for treating cancer. In addition, the anti-SSEA4 antibodies and binding fragments are useful in the diagnosis of cancers.

Abstract: An electronic device with a heat-dissipating function and a liquid-cooling radiator module are provided. The electronic device includes a first circuit board, a second circuit board and a liquid-cooling radiator module. The second circuit board is mounted on the first circuit board. The liquid-cooling radiator module is attached on the second circuit board and in thermal contact with an electronic component of the second circuit board. The liquid-cooling radiator module includes plural airflow channels and a fan. The plural airflow channels are in parallel with the second circuit board. The fan produces airflow toward the plural airflow channel. After the airflow passes through the plural airflow channels, the airflow is outputted in a direction parallel with the second circuit board. Since the airflow is not obstructed by the adjacent function circuit boards, the heat-dissipating efficiency is enhanced.

Abstract: A water cooling head includes water cooling head includes a casing, a base and a pump. The casing includes an inlet and an outlet. An outer side of the base has a heat-absorbing surface. A thermal conduction structure is disposed on an inner side of the base. An active space is defined by the base and the casing collaboratively. The pump includes a first magnetic element, a second magnetic element, an impeller and a pivotal part. The first magnetic element is located outside the active space. The first magnetic element is arranged between the impeller and the base along a direction perpendicular to the base. The pivotal part, the second magnetic element and the impeller are disposed within the active space. The pivotal part is connected with the impeller and arranged between the impeller and the base. The second magnetic element is installed on the pivotal part.

Abstract: A high voltage device includes: a semiconductor layer, an isolation structure, a drift oxide region, a well, a body region, a body contact, a buffer region, a gate, and a source and a drain. The body contact includes a main body contact and at least one sub-body contact. The main body contact is adjacent to the source, wherein the main body contact and the source are rectangles that extend along a width direction, and the source is located between the main body contact and the gate. The sub-body contact extends from the main body contact toward the gate and contacts an inverse current channel. The buffer region encompasses all the periphery of the body region below a top surface of the semiconductor layer, wherein an impurity concentration of the buffer region is lower than an impurity concentration of the body region.

Abstract: A clustered heat dissipation device and a chassis are provided. The clustered heat dissipation device includes a heat-absorbing manifold, plural heat-absorbing heads and plural connection pipes. The heat-absorbing manifold includes an inlet chamber and an outlet chamber. The inlet chamber includes at least one first liquid inlet and plural first liquid outlets. The outlet chamber includes plural second liquid inlets and at least one second liquid outlet. The heat-absorbing manifold is in thermal contact with a first heat source. The plural connection pipes are connected with the heat-absorbing heads and the corresponding first liquid outlets and connected with the heat-absorbing heads and the corresponding second liquid inlets.

Abstract: A water-cooling head includes a casing, a base, a thermal conduction structure and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The pump includes a fixing element, a shaft and an impeller. After the fixing element is fixed, the fixing element is contacted with the base or contacted with the thermal conduction structure, and the shaft is fixed on the fixing element. Consequently, the impeller is stably rotated about the shaft, and the performance and the reliability of the water-cooling head are enhanced.

Abstract: A water-cooling head includes a casing, a base, an input channel, an output channel and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The heat absorbed by the base is transferred to the working medium. The input channel is in communication with the active space. The cooled working medium is introduced into the active space through the input channel. The output channel is in communication with the active space. The heated working medium is outputted from the active space through the output channel. The pump is installed on the casing, and includes an impeller. The impeller is disposed within the active space and located near the output channel. The impeller is driven to guide the working medium to be outputted from the active space through the output channel.

Abstract: A dual-impeller driving device and a liquid-cooling heat dissipation device with the dual-impeller driving device are provided. The dual-impeller driving device includes a double-sided circuit board, a first stator, a first magnetic element, a first impeller, a second stator, a second magnetic element, a second impeller and a shaft. The first stator is located beside a first active surface of the double-sided circuit board. The first magnetic element is located near the first stator. The first impeller is combined with the first magnetic element. The second stator is located beside a second active surface of the double-sided circuit board. The second magnetic element is located near the second stator. The second impeller is combined with the second magnetic element. The shaft is penetrated through the double-sided circuit board. The first impeller and the second impeller are rotated about the shaft.

Abstract: A switching regulator includes a power stage circuit and a control circuit. The power stage circuit operates a high-side switch and a low-side switch therein according to a high-side signal and a low-side signal respectively to generate an inductor current flowing through an inductor therein. The adjustment signal generation circuit in the control circuit generates an adjustment level according to the high-side signal, the low-side signal, and/or the inductor current, wherein the adjustment level is switched between a reverse recovery level and an anti-latch-up level, and is electrically connected to a low-side isolation region of the low-side switch. The reverse recovery level is lower than the input voltage. The anti-latch-up level is higher than the reverse recovery level to avoid a latch-up effect.

Abstract: A photo-detecting apparatus includes an absorption layer configured to absorb photons and to generate photo-carriers from the absorbed photons, wherein the absorption layer includes germanium. A carrier guiding unit is electrically coupled to the absorption layer, wherein the carrier guiding unit includes a first switch including a first gate terminal.

Abstract: A switching regulator includes a power stage circuit and a control circuit. The power stage circuit operates a high-side switch and a low-side switch therein according to a high-side signal and a low-side signal respectively to generate an inductor current flowing through an inductor therein. The adjustment signal generation circuit in the control circuit generates an adjustment level according to the high-side signal, the low-side signal, and/or the inductor current, wherein the adjustment level is switched between a reverse recovery level and an anti-latch-up level, and is electrically connected to a low-side isolation region of the low-side switch. The reverse recovery level is lower than the input voltage. The anti-latch-up level is higher than the reverse recovery level to avoid a latch-up effect.

Abstract: A direct current (DC) to alternating current (AC) converter in accordance with an embodiment includes a battery array module, a battery control module and a polarity converter, wherein the battery array module and the magnetic converter are respectively coupled to the battery control module. The battery array module is used to receive DC signals. The battery array module is controlled by the battery control module to reconfigure and generate a multi-phase step signal. The multi-phase step signal is sent to the polarity converter. The multi-phase step signal is converted into an AC signal output by the polarity converter.

Abstract: A heat dissipation device includes a storage structure, plural pipes, plural heat sink fin groups and a vaporization-enhancing structure. The heat sink fin groups are disposed on outer surfaces of the pipes. The storage structure includes a chamber. The storage structure is in thermal contact with a heat source. Each pipe has a channel. A first end of the channel is in fluid communication with the chamber. A working medium is filled in the chamber and the channels of the pipes. The vaporization-enhancing structure is disposed within the chamber and in thermal contact with at least a portion of the working medium. After the vaporization-enhancing structure receives heat energy from the heat source, the heat energy is transferred to the working medium. The vaporization-enhancing structure facilitates liquid-gas transformation of the working medium. Consequently, the working medium moves toward a second end of the first channel.

Abstract: A photo-detecting apparatus includes a semiconductor substrate. A first germanium-based light absorption material is supported by the semiconductor substrate and configured to absorb a first optical signal having a first wavelength greater than 800 nm. A first metal line is electrically coupled to a first region of the first germanium-based light absorption material. A second metal line is electrically coupled to a second region of the first germanium-based light absorption material. The first region is un-doped or doped with a first type of dopants. The second region is doped with a second type of dopants. The first metal line is configured to control an amount of a first type of photo-generated carriers generated inside the first germanium-based light absorption material to be collected by the second region.

Abstract: The present invention discloses a Wireless Local Area Network (WLAN) and Bluetooth (BT) device including a WLAN circuit and a BT circuit. The WLAN circuit starts a WLAN slot according to a beacon of a beacon signal from an access point and executes WLAN communication. The WLAN slot ends after a measured reception time point of the beacon so as to prevent missing the beacon. The BT circuit starts a BT slot after the end of the WLAN slot and executes BT communication. If the BT slot is shorter than the period of the beacon signal minus the WLAN slot, the WLAN circuit earns additional time to start an extended WLAN slot after the end of the BT slot for carrying on the WLAN communication. The extended WLAN slot is not longer than the period of the beacon signal minus the sum of the WLAN and BT slots.

Abstract: A water-cooling heat dissipating system includes a pump and a water-cooling head. The water-cooling head includes a base, a first chamber and a second chamber. The base is in contact with an electronic component. The first chamber and the second chamber are located over the base and separated from each other. The first chamber includes a first inlet and a first outlet. The first inlet is in fluid communication with the pump. The second chamber includes a second inlet and a second outlet. The second inlet is fluid communication with the first outlet. The liquid continuously flows through the first chamber and the second chamber. The heat from the electronic component is transferred to the liquid within the first chamber and the second chamber through the base, and released through the first outlet and the second outlet.

Abstract: A pump module includes a main body, a first pump and a second pump. The main body includes a fluid channel, a first mounting hole and a second mounting hole. The fluid channel is exposed through the first mounting hole and the second mounting hole. The first pump is installed in the first mounting hole and sealedly coupled with the first mounting hole. The second pump is installed in the second mounting hole and sealedly coupled with the second mounting hole. A working liquid in the fluid channel is transferred through the first pump and the second pump sequentially. Even if one of the first pump and the second pump is damaged, the other of the first pump and the second pump is normally operated to move the working liquid in the fluid channel.

Abstract: A coolant distribution unit includes plural fluid inlets, plural fluid outlets and a piping channel. The piping channel is connected with the fluid inlets and the fluid outlets. The sensed temperature or the measured pressure or flowrate of a working fluid in the piping channel is transmitted to an adaptive control module. The sensed temperature or the measured pressure or flowrate is further transmitted to an external monitoring center. Consequently, the supervisor of the monitoring center can manage and control the operating situation of the coolant distribution unit.

Abstract: A clustered heat dissipation device and a chassis are provided. The clustered heat dissipation device includes a heat-absorbing manifold, plural heat-absorbing heads and plural connection pipes. The heat-absorbing manifold includes an inlet chamber and an outlet chamber. The inlet chamber includes at least one first liquid inlet and plural first liquid outlets. The outlet chamber includes plural second liquid inlets and at least one second liquid outlet. The heat-absorbing manifold is in thermal contact with a first heat source. The plural connection pipes are connected with the heat-absorbing heads and the corresponding first liquid outlets and connected with the heat-absorbing heads and the corresponding second liquid inlets.

Abstract: A rack cooling system includes plural cold plates, a radiator, a coolant distribution unit, a fan and a manifold device. The plural cold plates correspond to plural electronic computing devices. The fan is used for driving the airflow. The manifold device is connected between the plural cold plates, the radiator and the coolant distribution unit. The fluid medium is circulated along a fluid loop that is defined by the plural cold plates, the radiator, the coolant distribution unit and the manifold device. Consequently, the heat from the plural electronic computing devices is dissipated away. The rack cooling system of the present invention has the elastically-changed architecture. Consequently, the rack cooling system can be applied to the racks with different heat dissipation demands while achieving the power-saving efficacy.