Abstract: A translaminar pedicle anchor suspension system (referred as T-PAS system) applicable to vertebral surgeries is disclosed. The T-PAS system comprises: at least one pedicle anchor capable of being fixed to a pedicle of a lower vertebral segment, at least one suspension ligament having one end thereof fixed to the pedicle anchor, and at least one washer capable of fixing the other end of the suspension ligament to a contralateral side of a lamina of an upper vertebral segment. By using the suspension ligament to suspend the upper vertebral segment via a tunnel drilled on the lamina, not only the spine can be dynamically stabilized, but also the use of traditional pedicle screws and bone fusion can be avoided.

Abstract: A direct current (DC) to alternating current (AC) converter in accordance with an embodiment includes a battery array module, a battery control module and a polarity converter, wherein the battery array module and the magnetic converter are respectively coupled to the battery control module. The battery array module is used to receive DC signals. The battery array module is controlled by the battery control module to reconfigure and generate a multi-phase step signal. The multi-phase step signal is sent to the polarity converter. The multi-phase step signal is converted into an AC signal output by the polarity converter.

Abstract: A motor includes a motor body, a first cover covering at least one part of the motor body on the radial outer side of the motor body, and a second cover covering at least one part of the motor body on one axial side and the radial outer side of the motor body. The first and second covers make contact on the radial outer side of the motor body. The second cover includes first and second parts, the first part is in a disk shape, the second part is located on the radial outer side of at least one part of the first part and includes a wall part and an eave part, the wall part is formed in the axial direction, and the eave part is formed in the radial direction from one axial end of the radial outer side of the wall part.

Abstract: A water cooling head includes water cooling head includes a casing, a base and a pump. The casing includes an inlet and an outlet. An outer side of the base has a heat-absorbing surface. A thermal conduction structure is disposed on an inner side of the base. An active space is defined by the base and the casing collaboratively. The pump includes a first magnetic element, a second magnetic element, an impeller and a pivotal part. The first magnetic element is located outside the active space. The first magnetic element is arranged between the impeller and the base along a direction perpendicular to the base. The pivotal part, the second magnetic element and the impeller are disposed within the active space. The pivotal part is connected with the impeller and arranged between the impeller and the base. The second magnetic element is installed on the pivotal part.

Abstract: A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.

Abstract: A liquid cooling head includes a chassis, an inlet channel, a thermally-conducting structure, a liquid gathering structure, a drain channel and a pump set. The chassis includes a lower chamber and an upper chamber communicated with the lower chamber through a connection opening. The inlet channel is disposed on one side of the chassis, and communicated with the upper chamber for radiating the heat of the working fluid away. The thermally-conducting structure is disposed in the lower chamber for gathering the working fluid passed through the thermally-conducting structure. The drain channel is disposed on one side of the chassis to be communicated with the lower chamber. The pump set for pushing the working fluid in the lower chamber to discharge the working fluid outwards from the drain channel.

Abstract: A liquid cooling head device includes a base, a cover covering the base, an inlet portion disposed on the base, an outlet portion formed on the cover, and a fluid pump having a housing and a fan blade. The base includes a diversion channel, an opening and a first chamber connected to the diversion channel and the opening. A second chamber is formed between the cover and the base, and connected to the first chamber through the opening. The inlet portion is connected to the first chamber through the diversion channel. The housing covers one surface of the cover, so that a third chamber is collectively defined by the housing and the cover, and connected with the second chamber and the outlet portion. The fan blade is located in the third chamber, and the diversion channel is located between the fan blade and the first chamber.

Abstract: A dissipating device configured to dissipate the heat energy generated by the heat sources in the electronic devices. When the dissipating device contacts the heat sources, the heat energy can be absorbed by the dissipating device. The working fluid is stored within the dissipating device such that the working fluid can undergo a phase transition after the dissipating device absorbs heat energy. Then the working fluid can circulate inside the dissipating device. Accordingly, the heat-dissipation mechanism, which is applied to the dissipating device contacting the electronic devices, can be effectively sped up. The dissipating device is formed into a thin structure to achieve an excellent heat-dissipation effect with a limited heat-dissipation area.

Abstract: A dissipating device applied to an electronic device and configured to absorb the heat source generated by the electronic device. A thermal conductive fluid is filled in the dissipating device of the present disclosure. The thermal conductive fluid is a mixture of two immiscible fluid mediums. When the thermal conductive fluid contacts the heat source of the electronic device, the thermal conductive fluid will continuously undergo a phase transition cycle to speed up the heat dissipation effect of the dissipating device on the electronic device and achieve an excellent heat dissipation effect.

Abstract: A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, and a fluid driving module. The power supply module is electrically connected to the control module, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, and fluid driving module are all arranged in the casing. In addition, the control module controls the power supply module to output a corresponding electrical power to the fluid driving module according to an operation status of the fluid driving module.

Abstract: A photo-detecting apparatus is provided. The photo-detecting apparatus includes: a substrate made by a first material or a first material-composite; an absorption layer made by a second material or a second material-composite, the absorption layer being supported by the substrate and the absorption layer including: a first surface; a second surface arranged between the first surface and the substrate; and a channel region having a dopant profile with a peak dopant concentration equal to or more than 1×1015 cm?3, wherein a distance between the first surface and a location of the channel region having the peak dopant concentration is less than a distance between the second surface and the location of the channel region having the peak dopant concentration, and wherein the distance between the first surface and the location of the channel region having the peak dopant concentration is not less than 30 nm.

Abstract: Disclosures of the present invention describe a halide semiconductor memristor that is suitable for being as an artificial synapse. The halide semiconductor memristor comprises a first electrode layer, an active layer and a second electrode layer, wherein the active layer comprises a first oxide semiconductor film formed on the first electrode layer, a halide semiconductor film formed on the first oxide semiconductor film, and a second oxide semiconductor film formed on the halide semiconductor film Moreover, a variety of experimental data have proved that, this halide semiconductor memristor is indeed suitable for being adopted as a plurality of artificial synapses that are used in manufacture of a neuromorphic device, and exhibits many advantages, including: capable of being driven by a low operation voltage, having a multi-stage adjustable resistance state, and a wide dynamic range of the switching resistance states.

Abstract: A driving apparatus of a light emitting diode (LED) display device is provided. The driving apparatus includes a timing control circuit. The timing control circuit outputs a plurality of driving control signals to a gate driving circuit on an LED display panel of the LED display device. Wherein, the plurality of driving control signals includes a first driving control signal and a second driving control signal, and the pulse width of the first driving control signal in a first horizontal line period is different from the pulse width of a second driving control signal in a second horizontal line period preceding to the first horizontal line period.

Abstract: A holographic display system includes a light source that emits coherent light; a lateral displacement beam splitter that optically receives the coherent light and generates first reference light and second reference light; a first spatial light modulator (SLM) and a second SLM that optically receive the first reference light and the second reference light respectively, and construct first phase-only function (POF) light and second POF light respectively; a first beam splitter and a second beam splitter that optically receive the first POF light and the second POF light respectively, and generate first split light and second split light respectively; and a plurality of polarizers disposed between the first SLM and the first beam splitter, and between the second SLM and the second beam splitter, respectively.

Abstract: A display apparatus and an operation method for a display panel thereof are provided. The display apparatus includes a display panel and a voltage supply circuit. The display panel includes a pixel circuit and a common voltage line. The pixel circuit includes an organic light emitting diode (OLED), wherein a cathode of the OLED is coupled to the common voltage line. The voltage supply circuit is coupled to the common voltage line of the display panel. The voltage supply circuit supplies a common voltage to the common voltage line during a normal operation period. The voltage supply circuit supplies a reverse bias voltage higher than the common voltage to the common voltage line during a recovery period to reversely bias the OLED.

Abstract: A firmware updating method and a firmware updating system are provided. A host can individually transmit firmware update files to a terminal device, and the host checks by an algorithm whether each of the firmware update files needs to be compressed before each of the firmware update files is transmitted. For the firmware update file that needs to be compressed, the host uses a compression algorithm to reduce a file size of the firmware update file.

Abstract: A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.

Abstract: A deceleration device includes a reduction assembly that reduces speed, a motor attached to the reduction assembly, the motor being rotatable about a central axis line, and a heat insulator having a heat conduction coefficient of about 0.04 W/mK or less, the heat insulator being positioned between the motor and the reduction assembly. A surface temperature of an exposed portion of the motor is maintained at a low level, with a simple structure, that prevents burns to human skin in contact with the motor.

Abstract: A water-cooling head includes a casing, a base, a thermal conduction structure and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The pump includes a fixing element, a shaft and an impeller. After the fixing element is fixed, the fixing element is contacted with the base or contacted with the thermal conduction structure, and the shaft is fixed on the fixing element. Consequently, the impeller is stably rotated about the shaft, and the performance and the reliability of the water-cooling head are enhanced.

Abstract: A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.