Abstract: Different embodiments of local redundancy decoder circuits that can be used in a memory device are disclosed. The different types of local redundancy decoder circuits are operably connected to the columns of memory cells in a memory array.

Abstract: A sunk-type package structure includes a substrate, an optical sensing chip, and a housing. The substrate has a cavity with a first depth. The optical sensing chip is disposed inside the cavity and electrically connected with the substrate. A surface of the optical sensing chip has a first sensing area for sensing light. The housing covers the substrate and the optical sensing chip. The housing has a light-permeable portion disposed above the first sensing area.

Abstract: A light source assembly, a method for making same, and a display device using same are disclosed. The light source assembly includes a circuit substrate, an opaque and light-reflecting colloidal layer on the circuit substrate, micro light-emitting elements electrically connected to the circuit substrate, a base layer, a layer of convex lenses, and a layer of immediately-adjacent concave lenses. The colloidal layer defines grooves. At least two micro light-emitting elements each emitting light of a different color are arranged in each groove. The base layer is infilled into each groove and covers each micro light-emitting element. Each groove is covered by a convex lens which converges the emitted light. Each concave lens, covering one convex lens, substantially corrects optical path deviations of light of different wavelengths (that is, different colors), so reducing chromatic aberrations.

Abstract: A micro light-emitting diode (micro LED) display and a package method thereof are described. The micro LED display includes a substrate, various micro LED chips, and an encapsulation film. The substrate includes a wire. The micro LED chips are disposed on a surface of the substrate and are electrically connected to the wire. A light-emitting surface of each of the micro LED chips is set with at least one micro structure, and each micro structure has a top end. The encapsulation film encapsulates the micro LED chips, and covers the surface of the substrate. The top ends of the micro structures are located in a light-emitting surface of the encapsulation film.

Abstract: The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.

Abstract: Systems and methods are provided that may be implemented in a real time manner by an information handling system (the “client system”) to monitor one or more characteristics of a voice over internet protocol (VOIP) discussion, to use these monitored VOIP characteristics to identify one or more condition/s in real time as they are identified to occur during the current VOIP discussion, and to determine to take one or more automatic actions based on the identified VOIP condition/s so as to inform and/or alert a current human user of the client system to the occurrence of the identified VOIP condition/s as they occur.

Abstract: Different embodiments of local redundancy decoder circuits that can be used in a memory device are disclosed. The different types of local redundancy decoder circuits are operably connected to the columns of memory cells in a memory array.

Abstract: A display device integrates a driver IC and a micro-LED into a micro-LED module to encapsulate the related circuitry together. The stretchable conductive material is disposed on the flexible substrate to effectively reduce the problem of rising resistances caused by stretching. Specifically, both the driver IC and the micro-LED are disposed on the substrate, or the driver IC is served as a substrate to carry the micro-LEDs to encapsulate into the micro-LED module. Then, the stretchable conductive material is utilized to dispose on the flexible substrate to form the display device adapted for non-plane surface.

Abstract: A micro light-emitting diode (micro LED) display and a package method thereof are described. The micro LED display includes a substrate, various micro LED chips, and an encapsulation film. The substrate includes a wire. The micro LED chips are disposed on a surface of the substrate and are electrically connected to the wire. A light-emitting surface of each of the micro LED chips is set with at least one micro structure, and each micro structure has a top end. The encapsulation film encapsulates the micro LED chips, and covers the surface of the substrate. The top ends of the micro structures are located in a light-emitting surface of the encapsulation film.

Abstract: A light source assembly, a method for making same, and a display device using same are disclosed. The light source assembly includes a circuit substrate, an opaque and light-reflecting colloidal layer on the circuit substrate, micro light-emitting elements electrically connected to the circuit substrate, a base layer, a layer of convex lenses, and a layer of immediately-adjacent concave lenses. The colloidal layer defines grooves. At least two micro light-emitting elements each emitting light of a different color are arranged in each groove. The base layer is infilled into each groove and covers each micro light-emitting element. Each groove is covered by a convex lens which converges the emitted light. Each concave lens, covering one convex lens, substantially corrects optical path deviations of light of different wavelengths (that is, different colors), so reducing chromatic aberrations.

Abstract: The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.

Abstract: Different embodiments of local redundancy decoder circuits that can be used in a memory device are disclosed. The different types of local redundancy decoder circuits are operably connected to the columns of memory cells in a memory array.

Abstract: Systems and methods are provided for fabricating a static random access memory (SRAM) cell in a multi-layer semiconductor device structure. An example SRAM device includes a first array of SRAM cells, a second array of SRAM cells, a processing component, and one or more inter-layer connection structures. The first array of SRAM cells are formed in a first device layer of a multi-layer semiconductor device structure. The second array of SRAM cells are formed in a second device layer of the multi-layer semiconductor device structure, the second device layer being formed on the first device layer. The processing component is configured to process one or more input signals and generate one or more access signals. One or more inter-layer connection structures are configured to transmit the one or more access signals to activate the first device layer or the second device layer for allowing access to a target SRAM cell.

Abstract: Systems and methods are provided that may be implemented in a real time manner by an information handling system (the “client system”) to monitor one or more characteristics of a voice over internet protocol (VOIP) discussion, to use these monitored VOIP characteristics to identify one or more condition/s in real time as they are identified to occur during the current VOIP discussion, and to determine to take one or more automatic actions based on the identified VOIP condition/s so as to inform and/or alert a current human user of the client system to the occurrence of the identified VOIP condition/s as they occur.

Abstract: In some examples, a computing device may include one or more planar speakers. Individual planar speakers may include damping material adhered to either a top surface of a front pole or a bottom surface of a cone. The damping material may reduce a noise caused by the cone hitting the front pole (e.g., when reproducing loud passages in media content) to an inaudible (e.g., 30 db or less) level. The noise may be reduced by up to 35 decibels between about 250 Hertz to about 450 Hertz. The damping material may comprise a polyurethane foam and may have a height of between about 0.1 millimeters to about 1.0 millimeters and preferably about 0.2 millimeters.

Abstract: In some examples, a computing device may include one or more planar speakers. Individual planar speakers may include damping material adhered to either a top surface of a front pole or a bottom surface of a cone. The damping material may reduce a noise caused by the cone hitting the front pole (e.g., when reproducing loud passages in media content) to an inaudible (e.g., 30 db or less) level. The noise may be reduced by up to 35 decibels between about 250 Hertz to about 450 Hertz. The damping material may comprise a polyurethane foam and may have a height of between about 0.1 millimeters to about 1.0 millimeters and preferably about 0.2 millimeters.

Abstract: The disclosure provides stable antimicrobial (e.g., antibacterial or antifungal or both) peptides (SAMPs) that may be used in methods of preventing or treating a bacterial disease (e.g., a Liberibacter disease, such as citrus greening disease (also called Huanglongbing (HLB)) or potato Zebra Chip disease, and other bacterial diseases such as those caused by Agrobacterium tumefaciens (also known as Rhizobium radiobacter) and Pseudomonas syringae) in plants (e.g., citrus plants or potato plants). SAMPs disclosed herein may be heat stable, as well as stable in plant extracts and/or in plant lysates (e.g., citrus lysates).

Abstract: Different embodiments of local redundancy decoder circuits that can be used in a memory device are disclosed. The different types of local redundancy decoder circuits are operably connected to the columns of memory cells in a memory array.

Abstract: An information handling system audio system includes a library of noise reduction filters associated with cooling fan speeds to isolate out cooling fan noise. Changed cooling fan settings communicated to the audio system trigger application of a library noise reduction filter for the selected cooling fan setting to isolate out cooling fan noise while an adaptive filter defines a noise reduction filter from recorded sounds. The library noise reduction filter reduces cooling fan noises during the time used to determine the adaptive noise reduction filter. In one embodiment, changes in cooling fan settings prioritize definition of noise reduction filters by the adaptive filter.

Abstract: A memory device and an electronic device are provided. Different embodiments of local redundancy decoder circuits that can be used in the memory device and the electronic device are disclosed.