Abstract: A circuit includes stacked memory arrays and a control circuit. The stacked memory arrays includes a first layer and a second layer. The control circuit is configured to receive a first address in the first layer; cause the second layer to be enabled for accessing; and provide a second row address for accessing the second layer.

Abstract: Disclosed is a novel static random access memory (SRAM) device. The SRAM device comprises a plurality of memory array layers vertically disposed one above another, a layer decoder circuit disposed on each memory array layer, a word line driver circuit disposed on each memory array layer, and a plurality of complementary bit line pairs wherein each complementary bit line pair extends vertically to couple a memory cell in each memory array layer. Each memory array layer comprises a plurality of memory cells and a word line disposed thereon. Each word line is connected to the plurality of memory cells disposed on its memory array layer. The number of memory cells in a layer corresponds to a predetermined memory page size. Each layer decoder circuit is configured to decode a portion of an SRAM address to select its memory array layer if the SRAM address corresponds to memory cells on its memory array layer. Each word line driver circuit is configured to drive the word line disposed on its memory array layer.

Abstract: Systems and methods are provided for fabricating a static random access memory (SRAM) cell in a multi-layer semiconductor device structure. The SRAM cell includes two pull-up transistors, two pull-down transistors, a plurality of operation-assistance transistors, and two pass-gate transistors. The first pull-up transistor and the second pull-up transistor are formed in a first device layer of the multi-layer semiconductor device structure. The first pull-down transistor and the second pull-down transistor are formed in a second device layer of the multi-layer semiconductor device structure. The plurality of operation-assistance transistors are formed in the first device layer and configured to provide local supply voltages to the first pull-up transistor and the second pull-up transistor respectively. The first pass-gate transistor and the second pass-gate transistor are formed in the second device layer and configured to provide access to the data bit.

Abstract: The present invention discloses an audio playing system for protecting a storage medium of an electrical device. The audio playing system includes a detecting unit, a processing unit, an adjusting module and a playing module. The detecting unit detects vibration of the electrical device to generate a detection signal corresponding to the vibration. The processing unit compares the detection signal with the tolerable vibration value of the storage medium to generate a comparison result, and generates an adjustment signal according to the comparison result. The adjusting module adjusts an audio file according to the adjustment signal to generate an adjusted audio file. The playing module plays the adjusted audio file. The present invention also discloses an audio playing method for protecting a storage medium of an electrical device.

Abstract: A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference.

Abstract: An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.

Abstract: An article of footwear may have an upper and a sole structure secured to the upper. The sole structure includes a midsole and an outsole. The midsole has an upper surface and an opposite lower surface. The upper surface defines a plurality of depressions, and the lower surface defines a plurality of indentations extending toward the depressions. The outsole forms projections that extend into the indentations of the midsole, and the outsole has grooves located opposite the projections.

Abstract: The invention provides a method of turning over a three-dimensional graphic object by use of a touch sensitive input device. In particular, the method according to the invention provides a user with intuitive operation on a touch sensitive surface of the touch sensitive input device to turn over whole or a portion (e.g., a page sub-object) of the three-dimensional graphic object.

Abstract: An article of footwear with a sole system including a transparent heel portion is disclosed. The transparent heel portion includes a cavity configured to receive a support member comprising a plurality of support columns and an indicia member associated with the support member. The indicia and the support member are both visible along a bottom surface of the heel portion.

Abstract: An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.

Abstract: A shielding structure for electronic components includes a circuit board, at least one electronic module disposed on the circuit board and electrically connected thereto, at least one first covering layer, at least one shielding layer, and one second covering layer. Each first covering layer covers one electronic module and each first covering layer is covered by the shielding layer. The second covering layer covers the shielding layers. In the above-mentioned structure, the shielding layer is formed by coating or printing on the first covering layer in order to shield the electromagnetic radiation emitted by the function module. The time and the costs required for the manufacture of the above invention are reduced compared to the prior art.

Abstract: A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference.

Abstract: An article of footwear with a sole system including a transparent heel portion is disclosed. The transparent heel portion includes a cavity configured to receive a support member comprising a plurality of support columns and an indicia member associated with the support member. The indicia and the support member are both visible along a bottom surface of the heel portion.

Abstract: An article of footwear may have an upper and a sole structure secured to the upper. The sole structure includes a midsole and an outsole. The midsole has an upper surface and an opposite lower surface. The upper surface defines a plurality of depressions, and the lower surface defines a plurality of indentations extending toward the depressions. The outsole forms projections that extend into the indentations of the midsole, and the outsole has grooves located opposite the projections.

Abstract: A method and apparatus are described for converting a number from a floating point format to an integer format or from an integer format to a floating point format responsive to a control signal of a control signal format. Numbers are stored in the floating point format in a register of a first set of architectural registers in a packed format. One or more numbers in the floating point format are converted to the integer format and placed in a register of a second set of architectural registers in a packed format. Conversion from integer format to floating point format is performed in a similar manner. A floating point arithmetic apparatus is described that provides for converting a plurality of numbers between integer formats and a floating point formats, further providing for conversion operations that require a greater data path width than floating-point arithmetic operations.

Abstract: A method and machine-readable medium provide flags to commonly derived objects so that redundant method calls are avoided.

Abstract: A method and apparatus are described for converting a number from a floating point format to an integer format or from an integer format to a floating point format responsive to a control signal of a control signal format.

Abstract: A method and machine-readable medium provide flags to commonly derived objects so that redundant method calls are avoided.