Patents by Inventor Chien-Yuan Huang
Chien-Yuan Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230187406Abstract: A method includes forming a first dielectric layer on a first wafer, and forming a first bond pad penetrating through the first dielectric layer. The first wafer includes a first semiconductor substrate, and the first bond pad is in contact with a first surface of the first semiconductor substrate. The method further includes forming a second dielectric layer on a second wafer and forming a second bond pad extending into the second dielectric layer. The second wafer includes a second semiconductor substrate. The first wafer is sawed into a plurality of dies, with the first bond pad being in a first die in the plurality of dies. The first bond pad is bonded to the second bond pad.Type: ApplicationFiled: February 16, 2022Publication date: June 15, 2023Inventors: Chen-Hua Yu, Shih-Chang Ku, Chien-Yuan Huang, Chuei-Tang Wang, Sey-Ping Sun
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Patent number: 11676943Abstract: A semiconductor structure includes a first die, second dies coupled to and on the first die, a dielectric layer on the first die and covering each second die, and through dielectric vias (TDVs) coupled to and on the first die. The first die includes a bonding dielectric layer and bonding features embedded in and leveled with the bonding dielectric layer. An array of second dies is arranged in a first region of the first die. Each second die includes a bonding dielectric layer and a bonding feature embedded in and leveled with the bonding dielectric layer. The bonding dielectric layer and the bonding feature of each second die are respectively bonded to those of the first die. The TDVs are laterally covered by the dielectric layer in a second region of the first die which is connected to the first region and arranged along a periphery of the first die.Type: GrantFiled: April 23, 2021Date of Patent: June 13, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Yuan Huang, Shih-Chang Ku, Tsung-Shu Lin
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Systems and methods for dynamic interworking function selection for dual connectivity user equipment
Patent number: 11672040Abstract: A system described herein may provide a technique for a selection of an Interworking Function (“IWF”) that facilitates an interworking between a licensed wireless network and another wireless network, such as an unlicensed wireless network, based on a geographical location of a User Equipment (“UE”) that is connected to the licensed wireless network and the other wireless network. The IWF may be selected from a set of candidate IWFs based on respective locations of the candidate IWFs and the UE and/or a wireless access point associated with the other wireless network. The IWF may communicate with the UE, via the other wireless network, using one or more tunnels. The IWF may identify control plane and user plane traffic received via the tunnel(s), and may forward such communications to appropriate network devices of the licensed wireless network.Type: GrantFiled: June 1, 2021Date of Patent: June 6, 2023Assignee: Verizon Patent and Licensing Inc.Inventors: Chien-Yuan Huang, Suzann Hua, Parry Cornell Booker -
Publication number: 20230025094Abstract: An integrated circuit package includes first and second dies bonded to each other. The first die includes first die pads over a first device, first bonding pads over the first die pads, a first conductive via disposed between and electrically connected to a first one of the first die pads and a first one of the first bonding pads, and a first thermal via disposed between a second one of the first die pads and a second one of the first bonding pads and electrically insulated from the second one of the first die pads or the second one of the first bonding pads. The second die includes second bonding pads. The first one of the first bonding pads is connected to a first one of the second bonding pads. The second one of the first bonding pads is connected to a second one of the second bonding pads.Type: ApplicationFiled: February 22, 2022Publication date: January 26, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Yuan Huang, Shih-Chang Ku, Chuei-Tang Wang, Chen-Hua Yu
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Publication number: 20230020413Abstract: A device may include a processor configured to detect that an Internet Protocol Security (IPsec) tunnel from a user equipment (UE) device connected via a WiFi connection has become idle, based on the IPsec tunnel meeting an idleness criterion, and instruct the UE device to tear down the IPsec tunnel, in response to detecting that the IPsec tunnel from the UE device connected via the WiFi connection meets the idleness criterion. The device may be further configured to receive a mobile terminating call for the UE device; establish a new IPsec tunnel to the UE device via the WiFi connection, in response to receiving the mobile terminating call for the UE device; and forward the received mobile terminating call to the UE device via the established new IPsec tunnel.Type: ApplicationFiled: September 22, 2022Publication date: January 19, 2023Inventors: Chien-Yuan Huang, Suzann Hua, Parry Cornell Booker
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SYSTEMS AND METHODS FOR DYNAMIC INTERWORKING FUNCTION SELECTION FOR DUAL CONNECTIVITY USER EQUIPMENT
Publication number: 20220386399Abstract: A system described herein may provide a technique for a selection of an Interworking Function (“IWF”) that facilitates an interworking between a licensed wireless network and another wireless network, such as an unlicensed wireless network, based on a geographical location of a User Equipment (“UE”) that is connected to the licensed wireless network and the other wireless network. The IWF may be selected from a set of candidate IWFs based on respective locations of the candidate IWFs and the UE and/or a wireless access point associated with the other wireless network. The IWF may communicate with the UE, via the other wireless network, using one or more tunnels. The IWF may identify control plane and user plane traffic received via the tunnel(s), and may forward such communications to appropriate network devices of the licensed wireless network.Type: ApplicationFiled: June 1, 2021Publication date: December 1, 2022Applicant: Verizon Patent and Licensing Inc.Inventors: Chien-Yuan Huang, Suzann Hua, Parry Cornell Booker -
Publication number: 20220375806Abstract: A method of fabricating a semiconductor structure includes providing a first substrate comprising a first side and a second side opposite to the first side. A package is attached to the first side of the first substrate. A second substrate is attached to the second side of the first substrate. A plurality of electrical connectors is bonded between the second side of the first substrate and the second substrate. A lid is attached to the first substrate and the second substrate. The lid includes a ring part and a plurality of overhang parts. The ring part is over the first side of the first substrate. The plurality of overhang parts extends from corner sidewalls of the ring part toward the second substrate. The plurality of overhang parts are laterally aside the plurality of electrical connectors.Type: ApplicationFiled: July 27, 2022Publication date: November 24, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang
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Publication number: 20220344305Abstract: A semiconductor structure includes a first die, second dies coupled to and on the first die, a dielectric layer on the first die and covering each second die, and through dielectric vias (TDVs) coupled to and on the first die. The first die includes a bonding dielectric layer and bonding features embedded in and leveled with the bonding dielectric layer. An array of second dies is arranged in a first region of the first die. Each second die includes a bonding dielectric layer and a bonding feature embedded in and leveled with the bonding dielectric layer. The bonding dielectric layer and the bonding feature of each second die are respectively bonded to those of the first die. The TDVs are laterally covered by the dielectric layer in a second region of the first die which is connected to the first region and arranged along a periphery of the first die.Type: ApplicationFiled: April 23, 2021Publication date: October 27, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Yuan Huang, Shih-Chang Ku, Tsung-Shu Lin
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Patent number: 11477829Abstract: A device may include a processor configured to detect that an Internet Protocol Security (IPsec) tunnel from a user equipment (UE) device connected via a WiFi connection has become idle, based on the IPsec tunnel meeting an idleness criterion, and instruct the UE device to tear down the IPsec tunnel, in response to detecting that the IPsec tunnel from the UE device connected via the WiFi connection meets the idleness criterion. The device may be further configured to receive a mobile terminating call for the UE device; establish a new IPsec tunnel to the UE device via the WiFi connection, in response to receiving the mobile terminating call for the UE device; and forward the received mobile terminating call to the UE device via the established new IPsec tunnel.Type: GrantFiled: December 8, 2020Date of Patent: October 18, 2022Assignee: Verizon Patent and Licensing Inc.Inventors: Chien-Yuan Huang, Suzann Hua, Parry Cornell Booker
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Publication number: 20220312210Abstract: Systems and method are provided for a temporary network slice usage barring service within a core network. A network device in the core network receives a slice barring information message for an application function (AF). The slice barring information message includes a unique subscriber identifier associated with a user equipment (UE) device to be barred from a network slice and indicates a barring expiration time. The network device stores barring parameters based on the slice barring information message. The barring parameters include a slice identifier associated with the AF, the unique subscriber identifier, and the barring expiration time. The network device sends a barring instruction message to another network device associated with the network slice. The barring instruction message includes the unique subscriber identifier and the barring expiration time. The other network device enforces temporary barring of the UE device from the network slice based on the barring instruction message.Type: ApplicationFiled: May 20, 2022Publication date: September 29, 2022Inventors: Suzann Hua, Ye Huang, Chien-Yuan Huang, Parry Cornell Booker
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Patent number: 11450580Abstract: A semiconductor structure and a method for fabricating the same are disclosed. A semiconductor structure includes a first substrate, a package, a second substrate, and a lid. The package is attached to a first side of the first substrate. The second substrate is attached to a second side of the first substrate. The lid is connected to the first substrate and the second substrate. The lid includes a ring part over the first side of the first substrate. The ring part and the first substrate define a space and the package is accommodated in the space. The lid further includes a plurality of overhang parts which extend from corner sidewalls of the ring part toward the second substrate to cover corner sidewalls of the first substrate.Type: GrantFiled: July 2, 2020Date of Patent: September 20, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang
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Patent number: 11375374Abstract: Systems and method are provided for a temporary network slice usage barring service within a core network. A network device in the core network receives a slice barring information message for an application function (AF). The slice barring information message includes a unique subscriber identifier associated with a user equipment (UE) device to be barred from a network slice and indicates a barring expiration time. The network device stores barring parameters based on the slice barring information message. The barring parameters include a slice identifier associated with the AF, the unique subscriber identifier, and the barring expiration time. The network device sends a barring instruction message to another network device associated with the network slice. The barring instruction message includes the unique subscriber identifier and the barring expiration time. The other network device enforces temporary barring of the UE device from the network slice based on the barring instruction message.Type: GrantFiled: March 24, 2021Date of Patent: June 28, 2022Assignee: Verizon Patent and Licensing Inc.Inventors: Suzann Hua, Ye Huang, Chien-Yuan Huang, Parry Cornell Booker
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Publication number: 20220189844Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.Type: ApplicationFiled: March 8, 2022Publication date: June 16, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Yu Chen, Tsung-Shu Lin, Chien-Yuan Huang, Chen-Hsiang Lao
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Publication number: 20220183088Abstract: A device may include a processor configured to detect that an Internet Protocol Security (IPsec) tunnel from a user equipment (UE) device connected via a WiFi connection has become idle, based on the IPsec tunnel meeting an idleness criterion, and instruct the UE device to tear down the IPsec tunnel, in response to detecting that the IPsec tunnel from the UE device connected via the WiFi connection meets the idleness criterion. The device may be further configured to receive a mobile terminating call for the UE device; establish a new IPsec tunnel to the UE device via the WiFi connection, in response to receiving the mobile terminating call for the UE device; and forward the received mobile terminating call to the UE device via the established new IPsec tunnel.Type: ApplicationFiled: December 8, 2020Publication date: June 9, 2022Inventors: Chien-Yuan Huang, Suzann Hua, Parry Cornell Booker
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Patent number: 11302600Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.Type: GrantFiled: December 18, 2019Date of Patent: April 12, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wensen Hung, Ping-Kang Huang, Sao-Ling Chiu, Tsung-Shu Lin, Tsung-Yu Chen, Chien-Yuan Huang, Chen-Hsiang Lao
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Publication number: 20220052907Abstract: Systems and methods described herein include receiving, from a first network function, a request to receive a notification when a second network function becomes available after a failure. A status update may be received from the second network function indicating that the second network function is available. It may be determined that the second network function is in a stable state. A notification may be sent, to the first network function, that the second network function is available along with an indication of a time period in which to switch from accessing a third network function to accessing the second network function.Type: ApplicationFiled: July 19, 2021Publication date: February 17, 2022Inventors: Suzann Hua, Chien-Yuan Huang, Emerando M. Delos Reyes, Parry Cornell Booker
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Publication number: 20210384154Abstract: A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.Type: ApplicationFiled: August 23, 2021Publication date: December 9, 2021Inventors: Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang
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Patent number: 11102058Abstract: Systems and methods described herein include receiving, from a first network function, a request to receive a notification when a second network function becomes available after a failure. A status update may be received from the second network function indicating that the second network function is available. It may be determined that the second network function is in a stable state. A notification may be sent, to the first network function, that the second network function is available along with an indication of a time period in which to switch from accessing a third network function to accessing the second network function.Type: GrantFiled: August 13, 2020Date of Patent: August 24, 2021Assignee: Verizon Patent and Licensing Inc.Inventors: Suzann Hua, Chien-Yuan Huang, Emerando M. Delos Reyes, Parry Cornell Booker
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Patent number: 11101236Abstract: A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.Type: GrantFiled: June 19, 2019Date of Patent: August 24, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang
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Publication number: 20210193538Abstract: A semiconductor structure and a method for fabricating the same are disclosed. A semiconductor structure includes a first substrate, a package, a second substrate, and a lid. The package is attached to a first side of the first substrate. The second substrate is attached to a second side of the first substrate. The lid is connected to the first substrate and the second substrate. The lid includes a ring part over the first side of the first substrate. The ring part and the first substrate define a space and the package is accommodated in the space. The lid further includes a plurality of overhang parts which extend from corner sidewalls of the ring part toward the second substrate to cover corner sidewalls of the first substrate.Type: ApplicationFiled: July 2, 2020Publication date: June 24, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuan-Yu Huang, Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang