Abstract: A semiconductor device includes a circuit substrate, a semiconductor package, and a metallic cover. The semiconductor package is disposed on the circuit substrate. The metallic cover is disposed over the semiconductor package and over the circuit substrate. The metallic cover comprises a lid and outer flanges. The lid overlies the semiconductor package. The outer flanges are disposed at edges of the lid, are connected with the lid, extend from the lid towards the circuit substrate, and face side surfaces of the semiconductor package. The lid has a first region that is located over the semiconductor package and is thicker than a second region that is located outside a footprint of the semiconductor package.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: A viewing method and apparatus are provided for inspecting a cleaned pipeline. The method comprises providing the viewing apparatus of a cleaned pipeline and pushing the viewing apparatus to an outlet end of the pipeline. During traverse of the pipeline a camera captures pictures of the interior of the pipeline and stores the pictures on an onboard memory. The captured pictures can be viewed on a screen to show the interior of the pipeline to provide a reference for cleaning, replacement or repair of the pipeline.

Abstract: A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: A viewing method and apparatus are provided for inspecting a cleaned pipeline. The method comprises providing the viewing apparatus of a cleaned pipeline and pushing the viewing apparatus to an outlet end of the pipeline. During traverse of the pipeline a camera captures pictures of the interior of the pipeline and stores the pictures on an onboard memory. The captured pictures can be viewed on a screen to show the interior of the pipeline to provide a reference for cleaning, replacement or repair of the pipeline.

Abstract: One or more devices are configured to receive a request, from a point of sale terminal, to verify a status of a user device being used to settle a transaction with the point of sale terminal. The status may indicate whether the user device has been reported stolen to an operator network. The one or more device may receive a user device identifier, from the point of sale terminal, that identifies the user device. The one or more devices may determine the status of the user device based on the user device identifier. The one or more devices may generate a response indicating the status of the user device. The one or more devices may send the response indicating the status of the user device to the point of sale terminal to permit the point of sale terminal to selectively settle the transaction.

Abstract: A device may receive, from a mobile device and via a first radio access network, a request for a service. The device may receive a mobile device identifier that identifies the mobile device on a second radio access network. The second radio access network may be a different type of radio access network than the first radio access network. The device may provide the mobile device identifier to an equipment identity register. The device may receive, from the equipment identity register, an authentication indicator that indicates whether to permit or deny access to the service by the mobile device and via the first radio access network. The device may selectively permit or deny the mobile device access to the service, via the first radio access network, based on the authentication indicator.

Abstract: A device may receive, from an access network, a mobile device identifier. The mobile device identifier may identify a mobile device that is connected to the access network. The device may receive or determine subscriber information associated with the mobile device identifier. The subscriber information may identify one or more users associated with the mobile device. The device may provide the mobile device identifier and the subscriber information for determination of an action indicator. The action indicator may indicate an action to perform with respect to the mobile device identifier. The device may receive the action indicator based on providing the mobile device identifier and the subscriber information. The device may provide the action indicator for routing toward the mobile device for performance of the action.

Abstract: A device may receive, from an access network, a mobile device identifier. The mobile device identifier may identify a mobile device that is connected to the access network. The device may receive or determine subscriber information associated with the mobile device identifier. The subscriber information may identify one or more users associated with the mobile device. The device may provide the mobile device identifier and the subscriber information for determination of an action indicator. The action indicator may indicate an action to perform with respect to the mobile device identifier. The device may receive the action indicator based on providing the mobile device identifier and the subscriber information. The device may provide the action indicator for routing toward the mobile device for performance of the action.

Abstract: A system may receive call setup information associated with a call to be received by a terminating device via a particular untrusted wireless local area network (WLAN). The system may determine location information, associated with the terminating device, based on receiving the call setup information. The location information may include information that identifies the particular untrusted WLAN to which the terminating device is connected. The system may provide the call setup information to the terminating device via the particular untrusted WLAN. The call setup information may be provided to the terminating device based on the location information associated with the terminating device and may be provided to cause a tunnel to be created. The tunnel, when created, may allow the terminating device to receive the call via the particular untrusted WLAN. The system may cause the call to be received by the terminating device via the tunnel and the particular untrusted WLAN.

Abstract: A device may receive, from a mobile device and via a first radio access network, a request for a service. The device may receive a mobile device identifier that identifies the mobile device on a second radio access network. The second radio access network may be a different type of radio access network than the first radio access network. The device may provide the mobile device identifier to an equipment identity register. The device may receive, from the equipment identity register, an authentication indicator that indicates whether to permit or deny access to the service by the mobile device and via the first radio access network. The device may selectively permit or deny the mobile device access to the service, via the first radio access network, based on the authentication indicator.

Abstract: A system may receive call setup information associated with a call to be received by a terminating device via a particular untrusted wireless local area network (WLAN). The system may determine location information, associated with the terminating device, based on receiving the call setup information. The location information may include information that identifies the particular untrusted WLAN to which the terminating device is connected. The system may provide the call setup information to the terminating device via the particular untrusted WLAN. The call setup information may be provided to the terminating device based on the location information associated with the terminating device and may be provided to cause a tunnel to be created. The tunnel, when created, may allow the terminating device to receive the call via the particular untrusted WLAN. The system may cause the call to be received by the terminating device via the tunnel and the particular untrusted WLAN.

Abstract: One or more devices are configured to receive a request, from a point of sale terminal, to verify a status of a user device being used to settle a transaction with the point of sale terminal. The status may indicate whether the user device has been reported stolen to an operator network. The one or more device may receive a user device identifier, from the point of sale terminal, that identifies the user device. The one or more devices may determine the status of the user device based on the user device identifier. The one or more devices may generate a response indicating the status of the user device. The one or more devices may send the response indicating the status of the user device to the point of sale terminal to permit the point of sale terminal to selectively settle the transaction.

Abstract: A fluid analysis method is provided. A gradient distribution of a first scalar property of a calibration fluid in a space is obtained. A calibration schlieren image of the calibration fluid is acquired and processed to obtain an intensity distribution of the calibration schlieren image. The gradient distribution of the first scalar property of the calibration fluid in the space is mapped to the intensity distribution of the calibration schlieren image, so as to obtain a corresponding relation between the gradients of the first scalar property and the intensities. A test schlieren image of a test fluid is acquired and processed to obtain intensity distribution of the test schlieren image. The intensity distribution of the test schlieren image is converted to the gradient distribution of the first scalar property of the test fluid according to the corresponding relation. Moreover, a fluid analysis system is also provided.

Abstract: A fluid analysis method is provided. A gradient distribution of a first scalar property of a calibration fluid in a space is obtained. A calibration schlieren image of the calibration fluid is acquired and processed to obtain an intensity distribution of the calibration schlieren image. The gradient distribution of the first scalar property of the calibration fluid in the space is mapped to the intensity distribution of the calibration schlieren image, so as to obtain a corresponding relation between the gradients of the first scalar property and the intensities. A test schlieren image of a test fluid is acquired and processed to obtain intensity distribution of the test schlieren image. The intensity distribution of the test schlieren image is converted to the gradient distribution of the first scalar property of the test fluid according to the corresponding relation. Moreover, a fluid analysis system is also provided.

Abstract: A flat panel display device includes a housing, a display panel, a main frame, a power supply module, and a circuit board assembly. The housing is for receiving the display panel, the main frame, the power supply module, and the circuit board assembly. The main frame is fixed on the housing and is integrated with the housing. The display panel is secured on the main frame. The power supply module is secured on the main frame and is electrically connected to the display panel. The circuit board assembly is secured on the main frame and is electrically connected to the display panel and the power supply module.

Abstract: The present invention pertains to an electronic data processor with a plug-and-charge device, which the plug-and-charge device is directly connected to local supplying power so as to recharge a rechargeable battery located inside the electronic data processor. The present invention designs an electric linking unit capable of connecting with an interior system-power-supplying unit in system and capable of connecting with outside local supplying power. The electric linking unit is also able to adjust the voltage of the local supplying power to fit the work voltage of the rechargeable battery and then achieve the job of charging.