Patents by Inventor Chih-An Huang

Chih-An Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fingerprint Sensor Device and Method
    Publication number: 20230343133
    Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
    Type: Application
    Filed: June 28, 2023
    Publication date: October 26, 2023
    Inventors: Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Bicyclic-Fused Heteroaryl or Aryl Compounds
    Publication number: 20230339960
    Abstract: Compounds, tautomers and pharmaceutically acceptable salts of the compounds are disclosed, wherein the compounds have the structure of Formula Ia, as defined in the specification. In an embodiment, a pharmaceutical composition can be in a liquid dosage form and can comprise a therapeutically effective amount of the compound or a pharmaceutically acceptable salt thereof as an adjuvant and a therapeutic agent. In another embodiment, a method of adjuvant treating a disorder or condition can comprising administering the pharmaceutical composition to a patient.
    Type: Application
    Filed: June 28, 2023
    Publication date: October 26, 2023
    Inventors: JOHN DAVID TRZUPEK, KATHERINE LIN LEE, MARK EDWARD BUNNAGE, SEUNGIL HAN, DAVID HEPWORTH, FRANK ELDRIDGE LOVERING, JOHN PAUL MATHIAS, NIKOLAOS PAPAIOANNOU, BETSY SUSAN PIERCE, JOSEPH WALTER STROHBACH, STEPHEN WAYNE WRIGHT, CHRISTOPH WOLFGANG ZAPF, LORI KRIM GAVRIN, ARTHUR LEE, DAVID RANDOLPH ANDERSON, KEVIN JOSEPH CURRAN, CHRISTOPH MARTIN DEHNHARDT, EDDINE SAIAH, JOEL ADAM GOLDBERG, XIAOLUN WANG, HORNG-CHIH HUANG, RICHARD VARGAS, MICHAEL DENNIS LOWE, AKSHAY PATNY
  • BIT LINE AND WORD LINE CONNECTION FOR MEMORY ARRAY
    Publication number: 20230326522
    Abstract: Various embodiments of the present application are directed towards an integrated chip including a first conductive interconnect structure overlying a substrate. A first memory stack is disposed on the first conductive interconnect structure. A second conductive interconnect structure overlies the first memory stack. The second conductive interconnect structure is spaced laterally between opposing sidewalls of the first conductive interconnect structure. A third conductive interconnect structure is disposed on the first conductive interconnect structure. A top surface of the third conductive interconnect structure is vertically above the second conductive interconnect structure.
    Type: Application
    Filed: June 9, 2023
    Publication date: October 12, 2023
    Inventors: Chang-Chih Huang, Jui-Yu Pan, Kuo-Chyuan Tzeng
  • ELECTRONIC PACKAGE AND SUCTION DEVICE
    Publication number: 20230317502
    Abstract: A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic component with the suction device, wherein an edge of the at least one recess does not overlap the at least one conductive stud from a top view while moving the electronic component with the suction device.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 5, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun Hung TSAI, Chenghan SHE, Kuo-Chih HUANG, Kuan-Lin YEH
  • Foldable Display Support Systems for Thinner Foldable Devices and Improved User Experience
    Publication number: 20230315154
    Abstract: This document describes foldable display support systems for thinner computing devices and improved user experience. In aspects, a device includes a foldable display coupled to the foldable display support system. The foldable display includes one or more primary folding regions of a first folding radius and one or more secondary folding regions of a second folding radius different than the first folding radius. The foldable display support system includes a support plate coupled to at least one other support plate by an adhesive layer. The support plate includes one or more flexible regions that correspond to the one or more primary folding regions of the foldable display, and the at least one other support plate includes one or more flexible regions that correspond to the one or more secondary folding regions of the foldable display.
    Type: Application
    Filed: June 5, 2023
    Publication date: October 5, 2023
    Applicant: Google LLC
    Inventors: Adrian Gheorghe Manea, Chu-Chun Lo, Yu-Chih Huang
  • Fan assembly
    Patent number: 11773860
    Abstract: A fan assembly including a base, a fan, a light-emitting unit, and a lighting effect component is provided. The fan is rotatably disposed above the base, and includes a central part and multiple blades extending outwards from the central part, and each of the blades has a top surface away from the base. The light-emitting unit is disposed on the base and located between the base and the central part of the fan. The lighting effect component is disposed on the base and surrounds the light-emitting unit. A projection of the lighting effect component projected onto the base is greater than a projection of the fan projected onto the base. A height of the lighting effect component protruding from the base is less than a distance between the top surface of one of the blades and the base. The lighting effect component includes an inclined inner surface.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: October 3, 2023
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Shun-Chih Huang, Ching-Yu Lu, Kai-Yan Huang, Liang Yu Wu, Jeffrey Lee
  • Die Bonding Pads and Methods of Forming the Same
    Publication number: 20230307392
    Abstract: In an embodiment, a device includes: a dielectric layer over an active surface of a semiconductor substrate; a conductive via in the dielectric layer, the conductive via including a first copper layer having a non-uniform grain orientation; and a bonding pad over the conductive via and in the dielectric layer, the bonding pad including a second copper layer having a uniform grain orientation, a top surface of the bonding pad being coplanar with a top surface of the dielectric layer.
    Type: Application
    Filed: June 15, 2022
    Publication date: September 28, 2023
    Inventors: Wen-Hsiung Lu, Ming-Da Cheng, Chia-Li Lin, Yu-Chih Huang, Chen-Shien Chen
  • Pistonless rotary motor for air compressor
    Patent number: 11767759
    Abstract: A pistonless rotary motor for air compressor includes a triangular rotor rotatably disposed in a rotor cavity of a housing. The housing further includes two opposite, radially spaced first grooves in the peripheral wall and two opposite, radially spaced second grooves in the peripheral wall. The first groove is proximate the intake and the second groove is proximate the exhaust. The first grooves are disposed at a top dead center of the rotor relative to the rotor cavity and configured to release air having a first pressure when the rotor revolves eccentrically. The second grooves are disposed the top dead center of the rotor relative to the rotor cavity when the rotor revolves eccentrically and configured to release air having a second pressure which is less than the first pressure.
    Type: Grant
    Filed: May 23, 2022
    Date of Patent: September 26, 2023
    Inventors: Hung-Chih Huang, Huang-Ming Liu
  • Systems and methods of conducting a bar code scan using an imaging-based bar code scan device
    Patent number: 11763114
    Abstract: Systems and methods of conducting a bar code scan using an imaging-based bar code scan device are provided. In one exemplary embodiment, a method is performed by an imaging-based bar code device that includes processing circuitry, an optical lens assembly having an image sensor and an optical lens with a focused region at a certain distance in front of the optical lens along an optical axis of the optical lens, a plurality of light emitting elements configured proximate the optical lens and laterally offset from the optical axis. The method includes sending, by the processing circuitry, to each light emitting element, an indication to enable that light emitting element to project a light beam towards the optical axis in the focused region so that the light beams overlap when a target bar code is in the focused region and non-overlap when a target bar code is outside the focused region.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: September 19, 2023
    Assignee: TOSHIBA GLOBAL COMMERCE SOLUTIONS, INC.
    Inventors: Wei-Yi Hsuan, Yi-Sheng Lee, Te-Chia Tsai, Chih-Huang Wang
  • Through via structure and method
    Patent number: 11756883
    Abstract: A method comprises forming a trench extending through an interlayer dielectric layer over a substrate and partially through the substrate, depositing a photoresist layer over the trench, wherein the photoresist layer partially fills the trench, patterning the photoresist layer to remove the photoresist layer in the trench and form a metal line trench over the interlayer dielectric layer, filling the trench and the metal line trench with a conductive material to form a via and a metal line, wherein an upper portion of the trench is free of the conductive material and depositing a dielectric material over the substrate, wherein the dielectric material is in the upper portion of the trench.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: September 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yung-Chi Lin, Hsin-Yu Chen, Lin-Chih Huang, Tsang-Jiuh Wu, Wen-Chih Chiou
  • MACHINE FOR CLEANING SOLAR PANELS
    Publication number: 20230283230
    Abstract: A machine for cleaning solar panels includes a first X-axis device, a second X-axis device, and a Y-axis cleaning device. The first X-axis device includes a first track and a first moving device. The first moving device moves on the first track. The second X-axis device includes a second track and a second moving device. The second moving device moves on the second track. The Y-axis cleaning device includes a third track, a water tank, a slipway, a remover, and a sprayer. The third track moves along with the first moving device and the second moving device. The slipway slides on the third track. The remover and the sprayer are disposed on the slipway. The remover is configured to remove dirt from the solar panel, and the sprayer is connected to the water tank to spray water from the tank onto the solar panel.
    Type: Application
    Filed: February 27, 2023
    Publication date: September 7, 2023
    Inventors: YEN-CHIH HUANG, CHIH-KAI CHUANG
  • Substrate stage, substrate processing system using the same, and method for processing substrate
    Patent number: 11747741
    Abstract: A semiconductor substrate stage for carrying a substrate is provided. The semiconductor substrate stage includes a base layer, a magnetic shielding layer disposed on the base layer, a carrier layer disposed on the magnetic shielding layer, and a receiver disposed on the carrier layer. The receiver is configured to receive a microwave signal from a signal source electrically isolated from the receiver, and the microwave signal is used for controlling the movement of the semiconductor substrate stage.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: September 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Huan Chen, Yu-Chih Huang, Ya-An Peng, Shang-Chieh Chien, Li-Jui Chen, Heng-Hsin Liu
  • Sensor package and method
    Patent number: 11742254
    Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: August 29, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng, Chi-Hui Lai, Chiahung Liu, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Fingerprint sensor in info structure and formation method
    Patent number: 11741737
    Abstract: A package includes a sensor die, and an encapsulating material encapsulating the sensor die therein. A top surface of the encapsulating material is substantially coplanar with or higher than a top surface of the sensor die. A plurality of sensing electrodes is higher than the sensor die and the encapsulating material. The plurality of sensing electrodes is arranged as a plurality of rows and columns, and the plurality of sensing electrodes is electrically coupled to the sensor die. A dielectric layer covers the plurality of sensing electrodes.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: August 29, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang
  • CHARGING SYSTEM AND CONTROL METHOD THEREOF WHERE A SINK TERMINAL TRANSMITS A REQUEST MESSAGE TO A SOURCE TERMINAL WHILE THE SOURCE TERMINAL TRANSMITS A SOURCE MESSAGE
    Publication number: 20230267090
    Abstract: A charging system includes a source terminal and a sink terminal. The control method of the charging system includes transmitting a bus voltage by the source terminal, determining whether the sink terminal has entered a sink attached state when the sink terminal receives the bus voltage, enabling a message transceiver of the sink terminal if the sink terminal has entered the sink attached state, transmitting a source message to the transceiver of the sink terminal by the source terminal, transmitting a request message to the source terminal by the message transceiver of the sink terminal while the source terminal transmits the source message, and continuing to enable a communication function for communicating with the sink terminal and continuing to transmit the bus voltage to the sink terminal by the source terminal when the source terminal receives the request message.
    Type: Application
    Filed: July 18, 2022
    Publication date: August 24, 2023
    Applicant: RICHTEK TECHNOLOGY CORP.
    Inventors: Tzu-Hsuan Tseng, Tzu-Hsien Chuang, Sheng-Chun Lin, Hao-Chun Yang, Chien-Chih Huang, Heng-Min Chang, Tsung-Jung Wu, Yen-Tung Hung
  • METHOD FOR RECOVERING METALS FROM TUNGSTEN-CONTAINING METALLIC MATERIAL
    Publication number: 20230265574
    Abstract: A method for recovering metals from tungsten-containing metallic materials includes the steps of: providing a cathode and the tungsten-containing metallic material as an anode in an electrolyte solution which has a neutral, acidic or basic pH value; and subjecting the tungsten-containing metallic material to an electrolysis process under a power density that is greater than 3 W/cm2 on the anode so that a passivation layer formed on the anode during the electrolysis process is broken down to permit the tungsten-containing metallic material to be continuously dissolved and oxidized, and a tungsten-containing compound is formed in the electrolyte solution.
    Type: Application
    Filed: July 7, 2022
    Publication date: August 24, 2023
    Inventors: Chih-Huang LAI, Shao-Chi LO, Tzu-Min CHENG
  • IN-SITU FORMATION OF A SPACER LAYER FOR PROTECTING SIDEWALLS OF A PHASE CHANGE MEMORY ELEMENT AND METHODS FOR FORMING THE SAME
    Publication number: 20230263079
    Abstract: An embodiment phase-change memory device includes a first electrode formed over an interconnect layer, a phase-change memory element formed over the first electrode, a second electrode formed over the phase-change memory element, and an oxygen-free spacer layer formed over sidewalls of the phase-change memory element. The phase-change memory element may include a germanium-antimony-tellurium alloy or an aluminum-antimony alloy. The phase-change memory device may include a carbon layer, configured as a heater element, formed between the first electrode and the phase-change memory element. The oxygen-free spacer layer may include SiN, SiC, or SiCN and may further include chlorine, fluorine, argon, chlorine and argon, fluorine and argon, or a mixture of chlorine, fluorine, and argon. The oxygen-free spacer layer may further include a composition that varies with position within the oxygen-free spacer layer.
    Type: Application
    Filed: February 17, 2022
    Publication date: August 17, 2023
    Inventors: Tsung-Hsueh Yang, Chang-Chih Huang, Fu-Ting Sung
  • Fingerprint sensor device and method
    Patent number: 11727714
    Abstract: A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Interconnect structure and method of forming same
    Patent number: 11728296
    Abstract: A device includes a first side interconnect structure over a first side of a substrate, wherein active circuits are in the substrate and adjacent to the first side of the substrate, a dielectric layer over a second side of the substrate, a pad embedded in the dielectric layer, the pad comprising an upper portion and a bottom portion formed of two different materials and a passivation layer over the dielectric layer.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: August 15, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsiao Yun Lo, Lin-Chih Huang, Tasi-Jung Wu, Hsin-Yu Chen, Yung-Chi Lin, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Mobile device accessory
    Patent number: D998617
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: September 12, 2023
    Assignee: Symbol Technologies, LLC
    Inventors: Mu-Kai Shen, Huang Chih Huang, Michael A. Charpin