Abstract: An optical image lens assembly includes a plurality of optical lens elements. The optical lens elements include a plurality of plastic optical lens elements having refractive power and aspheric surfaces. The plastic optical lens elements are formed by an injection molding method and include at least one defined-wavelength light absorbing optical lens element, and the defined-wavelength light absorbing optical lens element includes at least one defined-wavelength light absorbent.

Abstract: A magnetoresistive sensor and a manufacturing method thereof are provided. The method includes: forming an initial reference layer in an annular shape, wherein the initial reference layer includes an anti-ferromagnetic layer and a ferromagnetic layer; performing a heat treatment on the initial reference layer, wherein the ferromagnetic layer is magnetized to have a magnetization direction oriented along a vortex path during a heating step of the heat treatment, and an exchange bias oriented along the vortex path is induced at an interface of the anti-ferromagnetic layer and the ferromagnetic layer during a cooling step of the heat treatment; patterning the initial reference layer to form separated reference layers, wherein the reference layers are respectively formed in a annular sector shape, and the reference layers are arranged along the vortex path; forming spacer layers and free layers to form magnetoresistive devices; routing the magnetoresistive devices to form the magnetoresistive sensor.

Abstract: A diode test module and method applicable to the diode test module are provided. A substrate having first conductivity type and an epitaxial layer having second conductivity type on the substrate are formed. A well region having first conductivity type is formed in the epitaxial layer. A first and second heavily doped region having second conductivity type are theoretically formed in the well and connected to a first and second I/O terminal, respectively. Isolation trench is formed there in between for electrical isolation. A monitor cell comprising a third and fourth heavily doped region is provided in a current conduction path between the first and second I/O terminal when inputting an operation voltage. By employing the monitor cell, the invention achieves to determine if the well region is missing by measuring whether a leakage current is generated without additional testing equipment and time for conventional capacitance measurements.

Abstract: A method includes forming a first etch stop layer (ESL) over a conductive feature, forming a first dielectric layer on the first ESL, forming a second ESL on the first dielectric layer, forming a second dielectric layer on the second ESL, forming a trench in the second dielectric layer, forming a first opening in a bottom surface of the trench extending through the second dielectric layer, and forming a second opening in a bottom surface of the first opening. The second opening extends through the first dielectric layer and the first ESL. The second opening exposes a top surface of the conductive feature. The method further includes widening the first opening to a second width, filling the trench with a conductive material to form a conductive line, and filling the second opening and the first opening with the conductive material to form a conductive via.

Abstract: A blood pressure measurement device and a calculation method thereof are disclosed. The blood pressure measurement device includes a pressurizing motor unit and an exhaust valve unit in communication with an airbag unit. The blood pressure calculation method includes steps of controlling the pressurizing motor unit to pressurize the airbag unit; measuring pressurized measurement data from the airbag unit in a pressurization process; controlling the pressurizing motor unit to stop pressurizing the airbag unit, and controlling the exhaust valve unit to depressurize the airbag unit; measuring depressurized measurement data from the airbag unit in a depressurization process; extracting blood pressure parameters from the pressurized measurement data and the depressurized measurement data; calculating an average of the blood pressure parameters extracted from the pressurized measurement data and the depressurized measurement data, to obtain a blood pressure measurement result.

Abstract: A fingerprint sensor includes a die, a plurality of conductive structures, an encapsulant, a plurality of conductive patterns, a first dielectric layer, a second dielectric layer, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The conductive patterns are over the die and are electrically connected to the die and the conductive structures. Top surfaces of the conductive patterns are flat. The first dielectric layer is over the die and the encapsulant. A top surface of the first dielectric layer is coplanar with top surfaces of the conductive patterns. The second dielectric layer covers the first dielectric layer and the conductive patterns. The redistribution structure is over the rear surface of the die.

Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.

Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

Abstract: An electronic lock includes a latch mechanism and a rotation assembly. The rotation assembly includes a rotator, a single sensor and a processor, the rotator can be rotated toward a first direction or a second direction to drive a latch of the latch mechanism to be extended or retracted. The sensor is provided to sense a protrusion, an auxiliary protrusion, a recess and an auxiliary recess of the rotator to output a sensing signal. The processor is electrically connected to the sensor to receive the sensing signal and is provided to distinguish whether an actuation of extension or retraction of the latch is complete according to a potential variation of the sensing signal.

Abstract: Embodiments of the present disclosure relate to methods for defect inspection. After pattern features are formed in a structure layer, a dummy filling material having dissimilar optical properties from the structure layer is filled in the pattern features. The dissimilar optical properties between materials in the pattern features and the structure layer increase contrast in images captured by an inspection tool, thus increasing the defect capture rate.

Abstract: An end cap for a carriage of a linear guide. The end cap has a closed lubrication port which is openable by operatively connecting a lubrication fitting to the lubrication port. The is formed by injection molding and the closed lubrication port of the end cap is formed by rotary demolding.

Abstract: A plug fixing structure is applied to fixing a power plug inserted into a power socket of an electronic device. The power plug has a plug portion and a main body portion. A first engaging structure is formed on an outer periphery of the power socket. The plug fixing structure includes a sleeve casing jacketing the main body portion to expose the plug portion and a first resilient arm having a first arm portion and a first front hook. The first arm portion protrudes from an outer surface of the sleeve casing. The first front hook extends from the first arm portion toward the first engaging structure. The first front hook is engaged with the first engaging structure when the plug portion is inserted into the power socket along a first axis, so as to constrain movement of the power plug along the first axis relative to the power socket.

Abstract: Some embodiments relate to a memory device. The memory device includes a first electrode overlying a substrate. A data storage layer is disposed on the first electrode. A second electrode overlies the data storage layer. A buffer layer is disposed between the data storage layer and the second electrode.

Abstract: A motor drive system includes a rectifier circuit, a controller, a modulator circuit and a direct current (DC) motor. The rectifier circuit is configured to convert an alternating current (AC) voltage to a DC voltage. The controller is configured to output a control signal. The modulator circuit includes a pulse generation module, a feedback determination module, a pulse modulation module and a driving module, and is configured to generate a modulated DC driving signal based on the DC voltage and the control signal generated by the rectifier circuit and the controller. The DC motor is configured to operate in accordance with the modulated DC driving signal generated by the modulator circuit.

Abstract: Systems and methods of conducting a bar code scan using an imaging-based bar code scan device are provided. In one exemplary embodiment, a method is performed by an imaging-based bar code device that includes processing circuitry, an optical lens assembly having an image sensor and an optical lens with a focused region at a certain distance in front of the optical lens along an optical axis of the optical lens, a plurality of light emitting elements configured proximate the optical lens and laterally offset from the optical axis. The method includes sending, by the processing circuitry, to each light emitting element, an indication to enable that light emitting element to project a light beam towards the optical axis in the focused region so that the light beams overlap when a target bar code is in the focused region and non-overlap when a target bar code is outside the focused region.

Abstract: A disposable eggshell eco-friendly material and manufacturing method are disclosed. The disposable eggshell eco-friendly material, for volume ratio, includes 50%-80% of calcined eggshell powder, 10%-48% of biodegradable polymer, 1%-5% of natural degradation agent, and 1%-5% of natural binding agent, which are subjected to a mixing and stirring step according to such ratios, and then subjected to a pelletizing step to be first prepared as a plurality of disposable eggshell eco-friendly material pellets, and the disposable eggshell eco-friendly material pellets being then subjected to a shaping and forming step by means of one of film blowing, extruding, vacuum forming, bottle blowing, injecting, and drawing, to obtain a disposable eggshell eco-friendly material product that is disposed of after one time of use.

Abstract: In an example implementation according to aspects of the present disclosure, a system includes a thermal sensor and a processor. The processor determines that a workload surpasses a high workload threshold. The processor determines that the workload transcends a low workload threshold after the workload abates. The processor determines a measured thermolysis curve based on a reading from the thermal sensor. The processor compares the measured thermolysis curve against a target thermolysis curve and generates a filter event based on the comparing.

Abstract: A window blind includes a headrail, a controller, a rotating rod, a pivoting member, a blind body, a bottom rail, two lift cord sets, two tilt cord sets and two cord winding assemblies. With the technical feature that the rotating rod and the tilt members of the cord winding assemblies are arranged in the same axial direction in sequence, the effect of almost synchronous rotation can be achieved, thereby optimizing the complexity of the overall blind window components or related parts.

Abstract: A motion simulator includes a base plate, a motion platform, a first actuator, a base, a second actuator and a carrying platform. The motion platform is arranged on the base plate and movably connected to the base plate. The first actuator is arranged on the motion platform, movably connected to the motion platform. The base has a base body extending in a length direction and a base extension surface extending in a width direction. The first actuator is movably connected to the base extension surface. The second actuator is movably arranged on the base. The carrying platform is movably connected to the second actuator. Through a connection relationship between the base and the second actuator, the first actuator performs a left-right movement of the carrying platform relative to the motion platform and the second actuator performs the forward-backward movement of the carrying platform relative to the motion platform.

Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.