Abstract: The present disclosure discloses a multi-eye analog smart timekeeping apparatus, comprising: a dial, comprising a dial substrate comprising a plurality of view regions; an arm positioned above the dial; a display panel positioned below the dial and comprising a plurality of display regions, each of the display regions corresponding to one of at least two of the view regions; and a shaft connected to the arm and being through the dial and the display panel. The present disclosure also discloses a method of making a display panel that may be used with the timekeeping apparatus, comprising: providing a first substrate comprising a first area; forming a display layer on the first substrate outside the first area; applying encapsulation material on the first area and around the display layer; sealing the display layer between the first substrate and a second substrate; and drilling a hole in the first area, wherein a size of the hole is smaller than a size of the first area.

Abstract: A multiple bits per cell memory is operated by applying a one-pass, multiple-level programming, using a single pulse sequence one time (or in one-pass), such as an incremental pulse program sequence, with program verify steps for multiple target program levels, to program multiple bits per cell in a plurality of memory cells. Using these techniques, the number of program pulses required, and the time required for programming the data can be reduced. As a result, an improvement in programming throughput and a reduction in disturbance conditions are achieved. Variants of the one-pass, multiple-level programming operation can be adopted for a variety of memory cell types, memory architectures, programming speeds, and data storage densities.

Abstract: This disclosure provides a memory device. The memory device includes a plurality of memory cells and a control circuit coupled to the memory cells. The control circuit is configured to provide a first programming voltage to the memory cells; verify the memory cells against an interim level verify voltage to divide the memory cells into a first group of memory cells and a second group of memory cells according to whether the memory cells do not reach or do reach the interim level verify voltage, respectively; provide a second programming voltage to the first group of memory cells and inhibit the second group of memory cells from receiving the second programming voltage, the second programming voltage being greater than or equal to the first programming voltage; and verify the first group of memory cells and the second group of memory cells against a desired level voltage.

Abstract: A memory device and an erase method for the memory device are provided. The memory device includes plural blocks and a controller. The plural blocks include at least one first block and at least one second block. The erase method is controlled by the controller and includes the following steps. A first stage erase operation and a second stage erase operation are sequentially performed on the at least one first block in a first time interval and a second time interval. The first stage erase operation and the second stage erase operation are sequentially performed on the at least one second block in the second time interval and a third time interval.

Abstract: A memory device and an erase method for the memory device are provided. The memory device includes plural blocks and a controller. The plural blocks include at least one first block and at least one second block. The erase method is controlled by the controller and includes the following steps. A first stage erase operation and a second stage erase operation are sequentially performed on the at least one first block in a first time interval and a second time interval. The first stage erase operation and the second stage erase operation are sequentially performed on the at least one second block in the second time interval and a third time interval.

Abstract: This disclosure provides a memory device. The memory device includes a plurality of memory cells and a control circuit coupled to the memory cells. The control circuit is configured to provide a first programming voltage to the memory cells; verify the memory cells against an interim level verify voltage to divide the memory cells into a first group of memory cells and a second group of memory cells according to whether the memory cells do not reach or do reach the interim level verify voltage, respectively; provide a second programming voltage to the first group of memory cells and inhibit the second group of memory cells from receiving the second programming voltage, the second programming voltage being greater than or equal to the first programming voltage; and verify the first group of memory cells and the second group of memory cells against a desired level voltage.

Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.

Abstract: Operation methods for a memory device is provided. An operation method for the memory device comprises programming the memory device as described in follows. Data are provided. The data comprise a plurality of codes. Each number of the codes is counted. Then, a mapping rule is generated according to each number of the codes. In the mapping rule, each of the codes is mapped to one of a plurality of verifying voltage levels which are sequentially arranged from low to high. After that, the data are programmed into the memory device according to the mapping rule.

Abstract: A method of operating a memory array is disclosed. The memory array includes a plurality of memory cells arranged in rows and columns, wherein a plurality of parallel memory strings correspond to respective ones of the columns, and a plurality of word lines are arranged orthogonal to the plurality of memory strings, each word line being connected to gate electrodes of a corresponding one of the rows of memory cells. The method includes performing a program operation that programs all of the memory cells on edge word lines located at opposite edges of the memory array, and that programs selected memory cells between the edge word lines in the memory array according to input data to be stored in the memory array. Each programmed memory cell has a threshold voltage at a program verify (PV) level.

Abstract: The present invention discloses an antenna apparatus. The antenna apparatus includes a first antenna array and a second antenna array. The first antenna array includes multiple first radiating elements for transmitting radio signals of a first frequency. The second antenna array includes multiple second radiating elements for transmitting radio signals of a second frequency, wherein the first and second radiating elements are arranged in a staggered manner; wherein each of the first radiating elements is disposed between two of the second radiating elements; and wherein each of the second radiating elements is disposed between two of the first radiating elements.

Abstract: An integrated circuit and an operating method for the same are provided. The integrated circuit comprises a stacked structure and a conductive structure. The stacked structure comprises a conductive strip. The conductive structure is disposed above the stacked structure and electrically connected to the conductive strip. The conductive structure and the conductive strip have various gap distances between corresponding points of different pairs according to a basic axis.

Abstract: A lithography mask and method for manufacturing such mask that includes optically isolated via features and proximity correction features. The via patterns that include via features that define vias are positioned on the mask in rows and columns with a row and a column pitch between each row and column on the mask. The via patterns are positioned such that via features that are in adjacent columns are separated by at least one intervening row between them. The via patterns can also be positioned such that the via patterns that are in adjacent rows are separated by at least one intervening column between them. As a result, the via feature of each via pattern and the associated optical proximity correction features that are positioned around each via feature do not overlap with the optical proximity correction features and the via features of the surrounding via patterns.

Abstract: An integrated circuit and an operating method for the same are provided. The integrated circuit comprises a stacked structure and a conductive structure. The stacked structure comprises a conductive strip. The conductive structure is disposed above the stacked structure and electrically connected to the conductive strip. The conductive structure and the conductive strip have various gap distances between corresponding points of different pairs according to a basic axis.

Abstract: An apparatus and method for processing semiconductor substrates provides a substrate stage being a rotatable disc with a solid surface and a terraced edge with upper, intermediate and lower portions of increasing diameter. A hollow edge ring rests on the intermediate edge portion and a substrate disposed on the rotatable disc is lifted and transported by robot blades positioned beneath the edge ring and which lift the edge ring which holds the substrate around its edges. The rotatable disc and edge ring find application in MOCVD and other semiconductor manufacturing tools.

Abstract: A multiple bits per cell memory is operated by applying a one-pass, multiple-level programming, using a single pulse sequence one time (or in one-pass), such as an incremental pulse program sequence, with program verify steps for multiple target program levels, to program multiple bits per cell in a plurality of memory cells. Using these techniques, the number of program pulses required, and the time required for programming the data can be reduced. As a result, an improvement in programming throughput and a reduction in disturbance conditions are achieved. Variants of the one-pass, multiple-level programming operation can be adopted for a variety of memory cell types, memory architectures, programming speeds, and data storage densities.

Abstract: A programming bias technique is described for programming a stacked memory structure with a plurality of layers of memory cells. The technique includes the controller circuitry responsive to a program instruction to program data in target cells in a stack of cells at a particular multibit address. The circuitry is configured to use an assignment of cells in the stack of cells to a plurality of sets of cells, and to iteratively execute a set program operation selecting each of the plurality of sets in sequence. Each iteration includes applying inhibit voltages to all of the cells in others of the plurality of sets. Also, each set of layers includes subsets of one or two, and there are at least two layers from other sets separating each of the subsets in one set.

Abstract: A charge storage memory is configured in a NAND array, and includes NAND strings coupled to bit lines via string select switches and includes word lines. A controller is configured to produce a bias for performing an operation on a selected cell of the NAND array. The bias includes charging the bit line while the string select switches are closed, such as to not introduce noise into the strings caused by such bit line charging. The semiconductor body regions in memory cells that are on both sides of the memory cells in the NAND strings that are coupled to a selected word line are coupled to reference voltages such that they are pre-charged while the word lines of the strings in the array are transitioned to various voltages during the operation.

Abstract: A lithography mask and method for manufacturing such mask that includes optically isolated via features and proximity correction features. The via patterns that include via features that define vias are positioned on the mask in rows and columns with a row and a column pitch between each row and column on the mask. The via patterns are positioned such that via features that are in adjacent columns are separated by at least one intervening row between them. The via patterns can also be positioned such that the via patterns that are in adjacent rows are separated by at least one intervening column between them. As a result, the via feature of each via pattern and the associated optical proximity correction features that are positioned around each via feature do not overlap with the optical proximity correction features and the via features of the surrounding via patterns.

Abstract: A charge storage memory is configured in a NAND array, and includes NAND strings coupled to bit lines via string select switches and includes word lines. A controller is configured to produce a bias for performing an operation on a selected cell of the NAND array. The bias includes charging the bit line while the string select switches are closed, such as to not introduce noise into the strings caused by such bit line charging. The semiconductor body regions in memory cells that are on both sides of the memory cells in the NAND strings that are coupled to a selected word line are coupled to reference voltages such that they are pre-charged while the word lines of the strings in the array are transitioned to various voltages during the operation.

Abstract: A memory device includes an array of dielectric charge trapping structures memory cells including word lines and bit lines. Control circuitry is coupled to the array arranged to control read, program and erase operations. A controller is arranged with supporting circuitry thermally annealing charge trapping structures in the memory cells in the array. Word line drivers and word line termination circuits can be used to induce current flow on the word lines to induce heat for the annealing. The thermal annealing can be applied interleaved with normal operations for recover from cycling damage. Also, the thermally annealing can be applied during mission functions like erase, to improve performance of the function.