Abstract: A metformin tablet, a metformin tablet for relieving pain and reducing inflammation, and a manufacturing method thereof. The tablet for relieving pain and reducing inflammation comprises: a filler, a diluent, an excipient, a binder, a slow-release agent, a sweetener, and a medicinal powder; the excipient comprises: at least one of PVP, PEG, and polymer; the medicinal powder comprises: at least one of metformin and the excipient. The metformin tablet comprises: a hollow part, a thick colloidal layer formed on an outer side of the hollow part, and a powder colloidal layer formed on an outer side of the thick colloidal layer. The tablet for relieving pain and reducing inflammation comprises: a thick colloidal layer, a powder colloidal layer formed on an outer side of the thick colloidal layer, and a hollow part located at a center of the tablet and on an inner side of the thick colloidal layer.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: A magnetic powder dispensing structure for tablet printing comprises a powder collecting device, a printing device, a guide rod device and a printing platform, the powder collecting device comprises a powder collecting box, a powder feeding device, a plurality of stirring rods, a plurality of rocker arms, a pressing rod, a driving motor and a first electromagnetic attraction device; the printing device comprises a second electromagnetic attraction device. The printing device and the powder collecting device are capable of moving laterally through the guide rod device, and capable of being magnetically attracted with each other or detached from each other by energizing or de-energizing the first electromagnetic attraction device and the second electromagnetic attraction device, thereby the powder collecting device can be driven when dispensing powder, and the printing device is capable of operating independently during printing.

Abstract: A magnetic powder dispensing structure for tablet printing comprises a powder collecting device, a printing device, a guide rod device and a printing platform, the powder collecting device comprises a powder collecting box, a powder feeding device, a plurality of stirring rods, a plurality of rocker arms, a pressing rod, a driving motor and a first electromagnetic attraction device; the printing device comprises a second electromagnetic attraction device. The printing device and the powder collecting device are capable of moving laterally through the guide rod device, and capable of being magnetically attracted with each other or detached from each other by energizing or de-energizing the first electromagnetic attraction device and the second electromagnetic attraction device, thereby the powder collecting device can be driven when dispensing powder, and the printing device is capable of operating independently during printing.

Abstract: An oral drug tablet manufacturing device and a manufacturing method thereof comprise a tablet manufacturing area, a micro-control unit, and a collecting area. The tablet manufacturing area comprises a tablet spraying device having a roller and a piezoelectric nozzle, a medicine powder filling container is communicated to the piezoelectric nozzle, the medicine powder filling container contains a plurality of medicine powders, the medicine powders are sprayed and printed through the piezoelectric nozzle, and then the medicine powders are pressed and flattened through the roller to cause the medicine powders to form a drug tablet. The micro-control unit is disposed in the piezoelectric nozzle, the micro-control unit has a storage module and an execution control module. The storage module stores a tablet spray information, the execution control module controls the tablet spraying device through the tablet spray information, and the collecting area is used to collect the drug tablet.

Abstract: A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape.

Abstract: A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an encapsulant. In the manufacturing method, a heating step is first performed to heat a first transparent plastic material to be a sticky member. Thereafter a connecting step is performed to connect the lead frame to the sticky member. Then a chip-bonding step is performed to bond the LED chips on the sticky member. Thereafter a wire-bonding step is performed to electrically connect the transparent LED chip to the lead frame. Then an encapsulating step is performed to encapsulate the transparent LED chips with a second transparent plastic material. Thereafter a drying step is performed to form the shapes of the sticky member and the second transparent plastic material.

Abstract: A light emitting diode (LED) package and a manufacturing method therefore are disclosed. The LED package comprises: a transparent substrate, a transparent LED chip, a transparent adhesive for bonding the transparent LED chip, a lead frame, conductive wires, and an encapsulant. In the manufacturing method, a heating step is first performed to heat a first transparent plastic material to be a sticky member. Thereafter a connecting step is performed to connect the lead frame to the sticky member. Then a chip-bounding step is performed to bond the LED chips on the sticky member. Thereafter a wire-bonding step is performed to electrically connect the transparent LED chip to the lead frame. Then an encapsulating step is performed to encapsulate the transparent LED chips with a second transparent plastic material. Thereafter a drying step is performed to form the shapes of the sticky member and the second transparent plastic material.

Abstract: A backlight module includes a light source, a light guide plate, and a reflection film is provided. The light guide plate has alight-incident surface, a first light-emitting surface, and a second light-emitting surface. The light emitted by the light source enters the light guide plate via the light-incident surface, then is emitted out from the light guide plate via the first light-emitting surface and the second light-emitting surface. The reflection film is able to move between a first location and a second location. The reflection film is adjacent to the first light-emitting surface of the light guide plate for reflecting the light emitted from the first light-emitting surface while the reflection film is at the first location, and the light reflected by the reflection film is emitted out from the second light-emitting surface.

Abstract: A surface mounting optoelectronic device is provided. The surface mounting optoelectronic device comprises a circuit board, a conductive layer, an auto-focus LED chip, a flash LED chip, a reflector and an encapsulant. The auto-focus LED chip and the flash LED chip are located on the conductive layer. The reflector is located on the edge of the circuit board. The encapsulant is filled into the reflector to hermetically seal the auto-focus LED chip and the flash LED chip.

Abstract: A method for backing up data stored in a mobile electronic device is disclosed. The claimed method includes checking a plurality of data sets stored in the mobile electronic device according to a first predetermined rule to determine whether the data sets have been backed up into a remote storage unit; and processing at least one of the data sets that has not been backed up into the remote storage unit according to a second predetermined rule. The method of the present invention improves the security of mobile electronic devices without requiring users to perform complicated operations manually.