Light emitting diode package

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Description

FIG. 1 is a perspective view of a light emitting diode package with the new design, with a slot structured circuit board incorporated;

FIG. 2 is a front view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof, wherein a slot structured circuit board is disposed on the bottom of the light emitting diode package; and,

FIG. 6 is a bottom plan view thereof.

Claims

The ornamental design for a light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
6777719 August 17, 2004 Fujii
7049639 May 23, 2006 Wang et al.
D576571 September 9, 2008 Itai
D590356 April 14, 2009 Takano et al.
D590358 April 14, 2009 Miyashita et al.
D599303 September 1, 2009 Seo et al.
20060113906 June 1, 2006 Ogawa
20060214273 September 28, 2006 Wang et al.
Foreign Patent Documents
D1066550-004 July 2000 JP
Patent History
Patent number: D624886
Type: Grant
Filed: Mar 26, 2010
Date of Patent: Oct 5, 2010
Assignee: Everlight Electronics Co., Ltd. (Tucheng, Taipei Hsien)
Inventors: Chun-Yao Ni (Taipei Hsien), Chih-Chia Tsai (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Winston Hsu
Application Number: 29/358,359
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)