Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least large particle count (LPC) value of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the LPC value, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.

Abstract: The present disclosure is directed to various methods and systems for monitoring real time efficiency of filters as well as testing the filters with tests that are similar to real world use of the filters to update technical specifications of the filters. The methods and systems monitoring the real time efficiency of the filters may utilize one or more particle counters to monitor their efficiency in real time. The data collected by the particle counters may be utilized to determine whether respective ones of the filters need to be replaced or regenerated by a backwash regeneration process. The updated technical specifications from the real world testing of the filters may be utilized in determining whether respective ones of the filters need to be replaced or regenerated. These real world testing and real time monitoring reduces the likelihood that workpieces are exposed to contaminant particles reducing scrap costs.

Abstract: A filter device includes one or more filter membranes, and a filter housing enclosing the one or more filter membranes. Each of the filter membranes includes a base membrane and a plurality of through holes.

Abstract: A filter device includes one or more filter membranes, and a filter housing enclosing the one or more filter membranes. Each of the filter membranes includes a base membrane and a plurality of through holes.

Abstract: A system includes a chemical storage tank, a pipeline, a pump, a first electrostatic probe, and a control unit. The pipeline is connected to the chemical storage tank. The pump is connected to the pipeline and configured to pump a chemical solution from the chemical storage tank into the pipeline. The first electrostatic probe is coupled to the pump and configured to measure an electrostatic voltage of the pump. The control unit is coupled to the first electrostatic probe and configured to obtain a measurement of an electrostatic voltage from the first electrostatic probe.

Abstract: A system includes a chemical storage tank, a pipeline, a pump, a first electrostatic probe, and a control unit. The pipeline is connected to the chemical storage tank. The pump is connected to the pipeline and configured to pump a chemical solution from the chemical storage tank into the pipeline. The first electrostatic probe is coupled to the pump and configured to measure an electrostatic voltage of the pump. The control unit is coupled to the first electrostatic probe and configured to obtain a measurement of an electrostatic voltage from the first electrostatic probe.

Abstract: A filter device includes one or more filter membranes, and a filter housing enclosing the one or more filter membranes. Each of the filter membranes includes a base membrane and a plurality of through holes.

Abstract: A method includes: delivering a slurry to a semiconductor tool through a piping network of a slurry delivery system; coupling an electrode pair to an outer wall of a pipe of the piping network; measuring one or more capacitance values associated with the electrode pair with the slurry being an insulting layer between the electrode pair; and deriving a quality metric of the slurry according to the one or more capacitance values.

Abstract: A system includes a chemical storage tank, a pipeline, a pump, a first electrostatic probe, and a control unit. The pipeline is connected to the chemical storage tank. The pump is connected to the pipeline and configured to pump a chemical solution from the chemical storage tank into the pipeline. The first electrostatic probe is coupled to the pump and configured to measure an electrostatic voltage of the pump. The control unit is coupled to the first electrostatic probe and configured to obtain a measurement of an electrostatic voltage from the first electrostatic probe.

Abstract: A filter device includes one or more filter membranes, and a filter housing enclosing the one or more filter membranes. Each of the filter membranes includes a base membrane made of a ceramic material, and a plurality of through holes. The base membrane is coated with a coating material.

Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.

Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.

Abstract: An apparatus includes a production tool and a pipe connected to the production tool. The pipe includes an inner pipe formed of a metal-free material, an outer pipe encircling the inner pipe, and an inlet connected to a channel between the inner pipe and the outer pipe. The apparatus further includes a chemical supply system connected to the pipe. The chemical supply system is configured to supply a chemical through a channel encircled by the inner pipe to the production tool.

Abstract: An apparatus includes a production tool and a pipe connected to the production tool. The pipe includes an inner pipe formed of a metal-free material, an outer pipe encircling the inner pipe, and an inlet connected to a channel between the inner pipe and the outer pipe. The apparatus further includes a chemical supply system connected to the pipe. The chemical supply system is configured to supply a chemical through a channel encircled by the inner pipe to the production tool.

Abstract: An apparatus includes a production tool and a pipe connected to the production tool. The pipe includes an inner pipe formed of a metal-free material, an outer pipe encircling the inner pipe, and an inlet connected to a channel between the inner pipe and the outer pipe. The apparatus further includes a chemical supply system connected to the pipe. The chemical supply system is configured to supply a chemical through a channel encircled by the inner pipe to the production tool.

Abstract: A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.

Abstract: Systems and methods are provided for preparing a plurality of slurry particles. The system includes: a tank configured to contain and provide the slurry particles, a sampling module configured to sample at least one slurry particle within the tank and obtain at least one parameter related to a particle size, and a controller coupled to the tank and the sampling module, configured to vibrate the slurry particles within the tank based on the at least one parameter.

Abstract: Systems and methods are provided for preparing a plurality of slurry particles. The system includes: a tank configured to contain and provide the slurry particles, a sampling module configured to sample at least one slurry particle within the tank and obtain at least one parameter related to a particle size, and a controller coupled to the tank and the sampling module, configured to vibrate the slurry particles within the tank based on the at least one parameter.

Abstract: A pixel structure including a first switching transistor, a setting unit, a capacitor, a driving transistor, a second switching transistor and a luminous element is disclosed. The capacitor is coupled between a first and a second node. The first switching transistor transmits a data signal to the first node according to a scan signal. The driving transistor includes a threshold voltage and a gate coupled to the second node. The second switching transistor includes a gate receiving an emitting signal. The luminous element is coupled to the driving transistor and the second switching transistor in series between a first operation voltage and a second operation voltage. The setting unit controls the voltage levels of the first and the second nodes to compensate the threshold voltage of the driving transistor.

Abstract: A slurry feed system suitable for chemical mechanical planarization (CMP) processes in a semiconductor fabrication facility and related method. The slurry feed system includes a valve manifold box having a discharge piping header fluidly connected to at least one CMP station and a first slurry supply train. The first slurry supply train may include a slurry mixing tank, day tank, and at least two slurry feed pumps arranged in series pumping relationship. The first slurry supply train defines a first slurry piping loop. In one embodiment, a second slurry supply train defining a second slurry piping loop is provided. The valve manifold box is operable to supply slurry from either or both of the first and second slurry piping loops to the CMP station.