Patents by Inventor Chih-Chiang Tseng

Chih-Chiang Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a probe card
    Patent number: 6864105
    Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
    Type: Grant
    Filed: March 1, 2002
    Date of Patent: March 8, 2005
    Assignee: FormFactor, Inc.
    Inventors: Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng
  • High performance probe system
    Publication number: 20040046579
    Abstract: A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC's pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC's pads. A flex strip may alternatively be disposed behind a substrate with probes.
    Type: Application
    Filed: May 5, 2003
    Publication date: March 11, 2004
    Applicant: FormFactor, Inc.
    Inventors: Matthew Chraft, Roy J. Henson, Charles A. Miller, Chih-Chiang Tseng
  • Method of manufacturing a probe card
    Publication number: 20030025172
    Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
    Type: Application
    Filed: March 1, 2002
    Publication date: February 6, 2003
    Applicant: FormFactor, Inc.
    Inventors: Gary W. Grube, Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, Poya Lotfizadeh, Chih-Chiang Tseng