Abstract: A multi-gate semiconductor device is formed including a semiconductor substrate. The multi-gate semiconductor device also includes a first transistor including a first fin portion extending above the semiconductor substrate. The first transistor has a first channel region formed therein. The first channel region includes a first channel region portion doped at a first concentration of a first dopant type and a second channel region portion doped at a second concentration of the first dopant type. The second concentration is higher than the first concentration. The first transistor further includes a first gate electrode layer formed over the first channel region. The first gate electrode layer may be of a second dopant type. The first dopant type may be N-type and the second dopant type may be P-type. The second channel region portion may be formed over the first channel region portion.

Abstract: System and method for controlling the channel thickness and preventing variations due to formation of small features. An embodiment comprises a fin raised above the substrate and a capping layer is formed over the fin. The channel carriers are repelled from the heavily doped fin and confined within the capping layer. This forms a thin-channel that allows greater electrostatic control of the gate.

Abstract: A multi-gate semiconductor device and method for forming the same. A multi-gate semiconductor device is formed including a first fin of a first transistor formed on a semiconductor substrate having a first dopant type. The first transistor has a doped channel region of the first dopant type. The device also includes a second fin of a second transistor formed on the first dopant type semiconductor substrate. The second transistor has a doped channel region of a second dopant type. The device further includes a gate electrode layer of the second dopant type formed over the channel region of the first fin and a gate electrode layer of the first dopant type formed over the channel region of the second fin.

Abstract: A method of forming an integrated circuit comprises forming a first doped region in a substrate using a first angle ion implantation performed on a first side of a gate structure. The gate structure has a length in a first direction and a width in a second direction. The method also comprises forming a second doped region in the substrate using a second angle ion implantation performed on a second side of the gate structure. The first angle ion implantation has a first implantation angle with respect to the second direction and the second angle ion implantation has a second implantation angle with respect to the second direction. Each of the first implantation angle and the second implantation angle is substantially larger than 0° and less than 90°.

Abstract: System and method for controlling the channel thickness and preventing variations due to formation of small features. An embodiment comprises a fin raised above the substrate and a capping layer is formed over the fin. The channel carriers are repelled from the heavily doped fin and confined within the capping layer. This forms a thin-channel that allows greater electrostatic control of the gate.

Abstract: A method of forming an integrated circuit includes forming a plurality of gate structures longitudinally arranged along a first direction over a substrate. A plurality of angle ion implantations are performed to the substrate. Each of the angle ion implantations has a respective implantation angle with respect to a second direction. The second direction is substantially parallel with a surface of the substrate and substantially orthogonal to the first direction. Each of the implantation angles is substantially larger than 0°.

Abstract: A multi-gate semiconductor device and method for forming the same. A multi-gate semiconductor device is formed including a first fin of a first transistor formed on a semiconductor substrate having a first dopant type. The first transistor has a doped channel region of the first dopant type. The device also includes a second fin of a second transistor formed on the first dopant type semiconductor substrate. The second transistor has a doped channel region of a second dopant type. The device further includes a gate electrode layer of the second dopant type formed over the channel region of the first fin and a gate electrode layer of the first dopant type formed over the channel region of the second fin.

Abstract: A male connector having an electrostatic discharge (ESD) function includes a metal portion, an insulating portion and a cable. The metal portion is inserted into a female connector. One end of the insulating portion is connected to the metal portion and another end of the insulating portion is connected to the cable. The cable includes a plurality of sub-cables and a grounded metal layer. The metal layer surrounds the sub-cables, and is in electrical contact with the metal portion. Static electricity on the metal portion is conducted to ground via the metal layer.

Abstract: A multi-gate semiconductor device and method for forming the same. A multi-gate semiconductor device is formed including a first fin of a first transistor formed on a semiconductor substrate having a first dopant type. The first transistor has a doped channel region of the first dopant type. The device also includes a second fin of a second transistor formed on the first dopant type semiconductor substrate. The second transistor has a doped channel region of a second dopant type. The device further includes a gate electrode layer of the second dopant type formed over the channel region of the first fin and a gate electrode layer of the first dopant type formed over the channel region of the second fin.

Abstract: A multi-gate semiconductor device is formed including a semiconductor substrate. The multi-gate semiconductor device also includes a first transistor including a first fin portion extending above the semiconductor substrate. The first transistor has a first channel region formed therein. The first channel region includes a first channel region portion doped at a first concentration of a first dopant type and a second channel region portion doped at a second concentration of the first dopant type. The second concentration is higher than the first concentration. The first transistor further includes a first gate electrode layer formed over the first channel region. The first gate electrode layer may be of a second dopant type. The first dopant type may be N-type and the second dopant type may be P-type. The second channel region portion may be formed over the first channel region portion.

Abstract: A multi-gate semiconductor device and method for forming the same. A multi-gate semiconductor device is formed including a first fin of a first transistor formed on a semiconductor substrate having a first dopant type. The first transistor has a doped channel region of the first dopant type. The device also includes a second fin of a second transistor formed on the first dopant type semiconductor substrate. The second transistor has a doped channel region of a second dopant type. The device further includes a gate electrode layer of the second dopant type formed over the channel region of the first fin and a gate electrode layer of the first dopant type formed over the channel region of the second fin.

Abstract: System and method for controlling the channel thickness and preventing variations due to formation of small features. An embodiment comprises a fin raised above the substrate and a capping layer is formed over the fin. The channel carriers are repelled from the heavily doped fin and confined within the capping layer. This forms a thin-channel that allows greater electrostatic control of the gate.

Abstract: A method of forming an integrated circuit includes forming a plurality of gate structures longitudinally arranged along a first direction over a substrate. A plurality of angle ion implantations are performed to the substrate. Each of the angle ion implantations has a respective implantation angle with respect to a second direction. The second direction is substantially parallel with a surface of the substrate and substantially orthogonal to the first direction. Each of the implantation angles is substantially larger than 0°.

Abstract: The present invention discloses a method for single-wire transmission without clock synchronization, comprising: providing three states; defining a spacing bit by a first state of the three states; and defining data signals, a start signal and an end signal by combinations of the second and third states of the three states.

Abstract: The packet forwarding device and method of the invention assign a virtual port number to each peripheral interface. The device and method can recognize and process the packets coming from or transferred to the virtual port according to the packet direct forward function of the forward device. Thus, the device and method can process the packets that are inputted to or outputted from the peripheral interface and the network device connected to the peripheral interface in a manner similar to the typical method for processing the packets that are only inputted to or outputted from the physical port.

Abstract: The present invention discloses a method for single-wire transmission without clock synchronization, comprising: providing three states; defining a spacing bit by a first state of the three states; and defining data signals, a start signal and an end signal by combinations of the second and third states of the three states.

Abstract: A method and networking apparatus for providing fault tolerance to memory are disclosed. The networking apparatus contains a first memory for storing host/port relationships, a second memory for indicating the status of the first memory, and a processor coupled to the memories for manipulating the memories. Furthermore, the claimed invention may also include an optional third memory for serving as a secondary site for storing information regarding host/port relationships.

Abstract: A method for forming a linked list with defective memory in an electronic device is disclosed. The method includes the steps of: performing at least a built-in self test (BIST) on a memory of the electronic device; and forming or updating the linked list of the electronic device according to at least a result of the BIST; whereby the linked list of the electronic device does not correspond to any defective memory sections.

Abstract: A method and networking apparatus for providing fault tolerance to memory are disclosed. The networking apparatus contains a first memory for storing host/port relationships, a second memory for indicating the status of the first memory, and a processor coupled to the memories for manipulating the memories. Furthermore, the claimed invention may also include an optional third memory for serving as a secondary site for storing information regarding host/port relationships.

Abstract: The packet forwarding device and method of the invention assign a virtual port number to each peripheral interface. The device and method can recognize and process the packets coming from or transferred to the virtual port according to the packet direct forward function of the forward device. Thus, the device and method can process the packets that are inputted to or outputted from the peripheral interface and the network device connected to the peripheral interface in a manner similar to the typical method for processing the packets that are only inputted to or outputted from the physical port.