Patents by Inventor Chih-Chung Wu

Chih-Chung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11499219
    Abstract: A method of fabricating a thin film with a varying thickness includes the steps of providing a shadow mask with an opening, providing a carrier plate, arranging a substrate on the carrier plate, and coating the substrate through the opening whilst rotating the carrier plate relative to the shadow mask. A plurality of zones of the substrates is swept and exposed from arcuate portions of the opening per each turn by a plurality of predetermined exposure times, respectively. The varying thickness of the thin film corresponds to variation of the predetermined exposure times.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: November 15, 2022
    Assignee: National Chiao Tung University
    Inventors: Cheng-Sheng Huang, Chi-Yung Hsieh, Yu-Chi Lin, Chih-Chung Wu, Chi-Fang Huang
  • Patent number: 11362337
    Abstract: Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 ?m3/?m2 to 1.17 ?m3/?m2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 ?m.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: June 14, 2022
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Huei-Fang Huang, Chih-Chung Wu, Yao-Sheng Lai, Jui-Chang Chou
  • Publication number: 20220082770
    Abstract: The present disclosure provides a photonic integrated circuit chip. The photonic integrated circuit chip comprises a plurality of connection ports, multiple polarization beam splitting structures, a photodetector structure, an interleaver and a modulator. The plurality of connection ports are used to receive a plurality of first optical signals to the photonic integrated circuit chip. The multiple polarization beam splitting structures each are used to split the first optical signal passing through the polarization beam splitting structure into a first mode optical signal and a second mode optical signal. The photodetector structure comprises a first component for split beam and a second component for split beam. The interleaver is used to transfer the first mode optical signal or the second mode optical signal to the second component for split beam. The modulator is used to transfer second optical signals with different wavelengths to the interleaver.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 17, 2022
    Applicant: Molex, LLC
    Inventors: Li-Chi YANG, Bing-Hao SHIH, Chih-Chung WU, Zuon-Min CHUANG
  • Publication number: 20220050245
    Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.
    Type: Application
    Filed: August 6, 2021
    Publication date: February 17, 2022
    Applicant: Molex, LLC
    Inventors: Chih-Wei PENG, Chih-Chung HSU, Chih-Chung WU, Zuon-Min CHUANG
  • Publication number: 20220033954
    Abstract: A method of fabricating a thin film with a varying thickness includes the steps of providing a shadow mask with an opening, providing a carrier plate, arranging a substrate on the carrier plate, and coating the substrate through the opening whilst rotating the carrier plate relative to the shadow mask. A plurality of zones of the substrates is swept and exposed from arcuate portions of the opening per each turn by a plurality of predetermined exposure times, respectively. The varying thickness of the thin film corresponds to variation of the predetermined exposure times.
    Type: Application
    Filed: November 10, 2020
    Publication date: February 3, 2022
    Inventors: Cheng-Sheng Huang, Chi-Yung Hsieh, Yu-Chi Lin, Chih-Chung Wu, Chi-Fang Huang
  • Publication number: 20210305580
    Abstract: Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 ?m3/?m2 to 1.17 ?m3/?m2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 ?m.
    Type: Application
    Filed: January 15, 2020
    Publication date: September 30, 2021
    Inventors: Huei-Fang HUANG, Chih-Chung WU, Yao-Sheng LAI, Jui-Chang CHOU
  • Patent number: 10376019
    Abstract: Automated painting of a shoe sole portion of a shoe is enhanced by use of a jig. The shoe sole portion may be secured between top and bottom plates of the jig such that a side surface of the shoe sole portion is left exposed. Additionally, the jig is adapted to create configurable masking lines along the side surface of the shoe sole portion using multi-layer deforming layers.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: August 13, 2019
    Assignee: NIKE, Inc.
    Inventors: Patrick Conall Regan, Feng-Ming Ou, Hao-Zhen Chen, Chih-Chung Wu
  • Patent number: 9675140
    Abstract: An automated system for painting a shoe sole portion of a shoe is provided. The automated painting system is adapted to use a variety of stations and components to automatically paint a side surface of the shoe sole portion while it is secured in a jig, transition the jig to an open position, and remove the painted shoe sole portion from the jig.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: June 13, 2017
    Assignee: NIKE, Inc.
    Inventors: Patrick Conall Regan, Feng-Ming Ou, Hao-Zhen Chen, Chih-Chung Wu
  • Publication number: 20160150856
    Abstract: An automated system for painting a shoe sole portion of a shoe is provided. The automated painting system is adapted to use a variety of stations and components to automatically paint a side surface of the shoe sole portion while it is secured in a jig, transition the jig to an open position, and remove the painted shoe sole portion from the jig.
    Type: Application
    Filed: February 8, 2016
    Publication date: June 2, 2016
    Inventors: PATRICK CONALL REGAN, FENG-MING OU, HAO-ZHEN CHEN, CHIH-CHUNG WU
  • Patent number: 9283583
    Abstract: An automated system for painting a shoe sole portion of a shoe is provided. The automated painting system is adapted to use a variety of stations and components to automatically paint a side surface of the shoe sole portion while it is secured in a jig, transition the jig to an open position, and remove the painted shoe sole portion from the jig.
    Type: Grant
    Filed: January 7, 2014
    Date of Patent: March 15, 2016
    Assignee: NIKE, Inc.
    Inventors: Patrick Conall Regan, Feng-Ming Ou, Hao-Zhen Chen, Chih-Chung Wu
  • Patent number: 9128708
    Abstract: A power saving method and a power saving system are applied in an optical disk drive. The power saving system comprises a power controlling unit for differentiating the specific sets of circuits not being used at a specific operation rate and powering them down. The sets of circuits not being used will be powered up while the associated operation rate at which they are required to operate is nearly started.
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: September 8, 2015
    Assignee: MEDIATEK INC.
    Inventors: Kuo-jung Lan, Hao-hui Yin, Chih-chung Wu, Tysh-bin Liu
  • Publication number: 20150228510
    Abstract: A whipsaw for carrying a wafer in wafer cleaning is disclosed. The whipsaw may include a cleaning tank, an annular groove around a peripheral of the cleaning tank, a discharge chute disposed between the cleaning tank and the annular groove, at least one first flow channel communicative of the cleaning tank and the discharge chute, and at least one second flow channel communicative of the annular groove and the discharge chute. When the wafer with a tape is placed in the whipsaw, the wafer may correspond to the cleaning tank, and a portion of the tape unmasked by the wafer may correspond to the annular groove. The first flow channel provides a first fluid into the cleaning tank with the first fluid cleaning the wafer, and the second flow channel provides a second fluid into the annular groove with the second fluid isolating the first fluid from the tape.
    Type: Application
    Filed: February 12, 2014
    Publication date: August 13, 2015
    Applicant: Kingyoup Optronics Co., Ltd.
    Inventors: Chih-Chung WU, Chang-Pei Ou, Feng-Po Liang, Chih-Yang Lee
  • Publication number: 20150189951
    Abstract: Automated painting of a shoe sole portion of a shoe is enhanced by use of a jig. The shoe sole portion may be secured between top and bottom plates of the jig such that a side surface of the shoe sole portion is left exposed. Additionally, the jig is adapted to create configurable masking lines along the side surface of the shoe sole portion using multi-layer deforming layers.
    Type: Application
    Filed: January 7, 2014
    Publication date: July 9, 2015
    Applicant: NIKE, INC.
    Inventors: PATRICK CONALL REGAN, FENG-MING OU, HAO-ZHEN CHEN, CHIH-CHUNG WU
  • Publication number: 20150190830
    Abstract: An automated system for painting a shoe sole portion of a shoe is provided. The automated painting system is adapted to use a variety of stations and components to automatically paint a side surface of the shoe sole portion while it is secured in a jig, transition the jig to an open position, and remove the painted shoe sole portion from the jig.
    Type: Application
    Filed: January 7, 2014
    Publication date: July 9, 2015
    Applicant: NIKE, INC.
    Inventors: PATRICK CONALL REGAN, FENG-MING OU, HAO-ZHEN CHEN, CHIH-CHUNG WU
  • Patent number: 9040315
    Abstract: A method for planarizing semiconductor devices, wherein the method comprises steps as follows: At least one patterned metal layer is formed on a substrate. A material layer having a first area and a second area is provided on the patterned metal layer and the substrate, in which there is a step height existing between the first area and the second area. A first polishing process having a first selection ratio of relative speeds for removing the material layer at the first area to that at the second area is then performed on the material layer. Subsequently, a second polishing process having a second selection ratio of relative speeds for removing the material layer at the first area to that at the second area is performed on the material layer, and the second selection ratio is greater than the first selection ratio.
    Type: Grant
    Filed: June 19, 2013
    Date of Patent: May 26, 2015
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Yi-Ching Wu, Tzu-Hung Yang, Chih-Chung Wu
  • Publication number: 20150134843
    Abstract: A method of establishing network connection for peer-to-peer connection between a first network device and a second network device includes a first server receiving a connection request package from the first network device according to a first match table. The first server confirms the second network device being connected thereto. The first server confirms the address type of the first network device and the second network device and transmits a connection signaling package to the second network device. The first server receives a connection response package sent by the second network device according to a second match table and the first server confirms connection according to the connection request package and the connection response package. Then, the first network device and the second network device establish connection.
    Type: Application
    Filed: November 10, 2014
    Publication date: May 14, 2015
    Inventors: CHING-CHANG HSIEH, YU-CHUAN KAO, CHIH-CHUNG WU
  • Publication number: 20140377887
    Abstract: A method for planarizing semiconductor devices, wherein the method comprises steps as follows: At least one patterned metal layer is formed on a substrate. A material layer having a first area and a second area is provided on the patterned metal layer and the substrate, in which there is a step height existing between the first area and the second area. A first polishing process having a first selection ratio of relative speeds for removing the material layer at the first area to that at the second area is then performed on the material layer. Subsequently, a second polishing process having a second selection ratio of relative speeds for removing the material layer at the first area to that at the second area is performed on the material layer, and the second selection ratio is greater than the first selection ratio.
    Type: Application
    Filed: June 19, 2013
    Publication date: December 25, 2014
    Inventors: Yi-Ching WU, Tzu-Hung Yang, Chih-Chung Wu
  • Patent number: 8824252
    Abstract: The invention discloses a signal clamping device capable of clamping a signal with a clamp level that is set according to a frequency characteristic of the signal and a method thereof and a related optical storage system. The signal clamping device includes an equalizing unit, a determining unit, and a clamping unit. The equalizing unit is utilized for equalizing the signal and generating an equalized signal. The determining unit is utilized for generating an indication signal according to the equalized signal. The clamping unit is utilized for determining a clamp level according to the indication signal and clamping the signal with the clamp level.
    Type: Grant
    Filed: September 29, 2007
    Date of Patent: September 2, 2014
    Assignee: Mediatek Inc.
    Inventors: Jia-Hau Lin, Chih-Chung Wu, Hung-Yen Chen, Hao-Hui Yin
  • Patent number: 8815123
    Abstract: A method for fabricating an IBIIIAVIA-group amorphous compound used for thin-film solar cells is provided. A mixture solution including elements of Group IB, IIIA, VIA or combinations thereof is provided. The mixture solution is heated and filtered. IBIIIAVIA-group amorphous powders are acquired after drying the heated and filtered mixture solution.
    Type: Grant
    Filed: April 4, 2009
    Date of Patent: August 26, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yu Huang, Chiou Yen Chiou, Bing Joe Hwang, Hsuan-Fu Wang, Shih-Hong Chang, Chih-Lung Lin, Chih-Chung Wu
  • Patent number: D962473
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: August 30, 2022
    Assignee: SCHWEITZER BIOTECH COMPANY LTD.
    Inventor: Chih-Chung Wu