Abstract: Provided are an electrolytic copper foil, an electrode and a lithium-ion cell comprising the same. The electrolytic copper foil has a first surface and a second surface, which are analyzed by grazing incidence X-ray diffraction (GIXRD), and each have an intensity of a characteristic peak of (111) plane denoted by I1, an intensity of a characteristic peak of (200) plane denoted by I2, an intensity of a characteristic peak of (220) plane denoted by I3, an FWHM of the characteristic peak of (111) plane denoted by W1, and an FWHM of the characteristic peak of (200) plane denoted by W2. The first and second surfaces each have a ratio of (I1+I2)/(I1+I2+I3) of 0.83 or more and a value of (W1+W2) of 0.80° or less. By controlling the features, it can improve the corrosion resistance of the electrolytic copper foil and further increase the safety of the lithium-ion cell.

Abstract: Provided are an electrolytic copper foil, an electrode and a lithium-ion cell comprising the same. The electrolytic copper foil has a first surface and a second surface, which are analyzed by grazing incidence X-ray diffraction (GIXRD), and each have an intensity of a characteristic peak of (111) plane denoted by I1, an intensity of a characteristic peak of (200) plane denoted by I2, an intensity of a characteristic peak of (220) plane denoted by I3, an FWHM of the characteristic peak of (111) plane denoted by W1, and an FWHM of the characteristic peak of (200) plane denoted by W2. The first and second surfaces each have a ratio of (I1+I2)/(I1+I2+I3) of 0.83 or more and a value of (W1+W2) of 0.80° or less. By controlling the features, it can improve the corrosion resistance of the electrolytic copper foil and further increase the safety of the lithium-ion cell.

Abstract: The present disclosure provides a photonic integrated circuit chip. The photonic integrated circuit chip comprises a plurality of connection ports, multiple polarization beam splitting structures, a photodetector structure, an interleaver and a modulator. The plurality of connection ports are used to receive a plurality of first optical signals to the photonic integrated circuit chip. The multiple polarization beam splitting structures each are used to split the first optical signal passing through the polarization beam splitting structure into a first mode optical signal and a second mode optical signal. The photodetector structure comprises a first component for split beam and a second component for split beam. The interleaver is used to transfer the first mode optical signal or the second mode optical signal to the second component for split beam. The modulator is used to transfer second optical signals with different wavelengths to the interleaver.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: Provided are an electrolytic copper foil, an electrode and a lithium-ion cell comprising the same. The electrolytic copper foil has a first surface and a second surface, which are analyzed by grazing incidence X-ray diffraction (GIXRD), and each have an intensity of a characteristic peak of (111) plane denoted by I1, an intensity of a characteristic peak of (200) plane denoted by I2, an intensity of a characteristic peak of (220) plane denoted by I3, an FWHM of the characteristic peak of (111) plane denoted by W1, and an FWHM of the characteristic peak of (200) plane denoted by W2. The first and second surfaces each have a ratio of (I1+I2)/(I1+I2+I3) of 0.83 or more and a value of (W1+W2) of 0.80 or less. By controlling the features, it can improve the corrosion resistance of the electrolytic copper foil and further increase the safety of the lithium-ion cell.

Abstract: A method of fabricating a thin film with a varying thickness includes the steps of providing a shadow mask with an opening, providing a carrier plate, arranging a substrate on the carrier plate, and coating the substrate through the opening whilst rotating the carrier plate relative to the shadow mask. A plurality of zones of the substrates is swept and exposed from arcuate portions of the opening per each turn by a plurality of predetermined exposure times, respectively. The varying thickness of the thin film corresponds to variation of the predetermined exposure times.

Abstract: Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 ?m3/?m2 to 1.17 ?m3/?m2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 ?m.

Abstract: The present disclosure provides a photonic integrated circuit chip. The photonic integrated circuit chip comprises a plurality of connection ports, multiple polarization beam splitting structures, a photodetector structure, an interleaver and a modulator. The plurality of connection ports are used to receive a plurality of first optical signals to the photonic integrated circuit chip. The multiple polarization beam splitting structures each are used to split the first optical signal passing through the polarization beam splitting structure into a first mode optical signal and a second mode optical signal. The photodetector structure comprises a first component for split beam and a second component for split beam. The interleaver is used to transfer the first mode optical signal or the second mode optical signal to the second component for split beam. The modulator is used to transfer second optical signals with different wavelengths to the interleaver.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: A method of fabricating a thin film with a varying thickness includes the steps of providing a shadow mask with an opening, providing a carrier plate, arranging a substrate on the carrier plate, and coating the substrate through the opening whilst rotating the carrier plate relative to the shadow mask. A plurality of zones of the substrates is swept and exposed from arcuate portions of the opening per each turn by a plurality of predetermined exposure times, respectively. The varying thickness of the thin film corresponds to variation of the predetermined exposure times.

Abstract: Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 ?m3/?m2 to 1.17 ?m3/?m2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 ?m.

Abstract: Automated painting of a shoe sole portion of a shoe is enhanced by use of a jig. The shoe sole portion may be secured between top and bottom plates of the jig such that a side surface of the shoe sole portion is left exposed. Additionally, the jig is adapted to create configurable masking lines along the side surface of the shoe sole portion using multi-layer deforming layers.

Abstract: An automated system for painting a shoe sole portion of a shoe is provided. The automated painting system is adapted to use a variety of stations and components to automatically paint a side surface of the shoe sole portion while it is secured in a jig, transition the jig to an open position, and remove the painted shoe sole portion from the jig.