Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.

Abstract: A method of manufacturing a semiconductor device includes forming a first dielectric layer over a substrate, forming a metal layer in the first dielectric layer, forming an etch stop layer on a surface of the first dielectric layer and the metal layer, removing portions of the metal layer and the etch stop layer to form a recess in the metal layer, and forming a tungsten plug in the recess. The recess is spaced apart from a bottom surface of the etch stop layer.

Abstract: A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. In the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. The elastic material is disposed over the chuck surface. The elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.

Abstract: A pump health analysis method and a pump health analysis device using the same are provided. A standard vibration curve of a standard pump is obtained. The standard vibration curve is converted from a time domain to a frequency domain to obtain a first frequency distribution curve. A sample vibration curve of a sample pump is obtained. The sample vibration curve is converted from the time domain to the frequency domain to obtain a second frequency distribution curve. The first frequency distribution curve is compared with the second frequency distribution curve by using a cosine similarity algorithm to obtain a health index of the sample pump.

Abstract: A system including a processor configured to perform generating a plurality of different layout blocks; selecting, among the plurality of layout blocks, layout blocks corresponding to a plurality of blocks in a floorplan of a circuit; combining the selected layout blocks in accordance with the floorplan into a layout of the circuit; and storing the layout of the circuit in a cell library or using the layout of the circuit to generate a layout for an integrated circuit (IC) containing the circuit. Each of the plurality of layout blocks satisfies predetermined design rules and includes at least one of a plurality of different first block options associated with a first layout feature, and at least one of a plurality of different second block options associated with a second layout feature different from the first layout feature.

Abstract: Provided are an electrolytic copper foil, an electrode and a lithium-ion cell comprising the same. The electrolytic copper foil has a first surface and a second surface, which are analyzed by grazing incidence X-ray diffraction (GIXRD), and each have an intensity of a characteristic peak of (111) plane denoted by I1, an intensity of a characteristic peak of (200) plane denoted by I2, an intensity of a characteristic peak of (220) plane denoted by I3, an FWHM of the characteristic peak of (111) plane denoted by W1, and an FWHM of the characteristic peak of (200) plane denoted by W2. The first and second surfaces each have a ratio of (I1+I2)/(I1+I2+I3) of 0.83 or more and a value of (W1+W2) of 0.80 or less. By controlling the features, it can improve the corrosion resistance of the electrolytic copper foil and further increase the safety of the lithium-ion cell.

Abstract: A method of fabricating a thin film with a varying thickness includes the steps of providing a shadow mask with an opening, providing a carrier plate, arranging a substrate on the carrier plate, and coating the substrate through the opening whilst rotating the carrier plate relative to the shadow mask. A plurality of zones of the substrates is swept and exposed from arcuate portions of the opening per each turn by a plurality of predetermined exposure times, respectively. The varying thickness of the thin film corresponds to variation of the predetermined exposure times.

Abstract: Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 ?m3/?m2 to 1.17 ?m3/?m2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 ?m.

Abstract: The present disclosure provides a photonic integrated circuit chip. The photonic integrated circuit chip comprises a plurality of connection ports, multiple polarization beam splitting structures, a photodetector structure, an interleaver and a modulator. The plurality of connection ports are used to receive a plurality of first optical signals to the photonic integrated circuit chip. The multiple polarization beam splitting structures each are used to split the first optical signal passing through the polarization beam splitting structure into a first mode optical signal and a second mode optical signal. The photodetector structure comprises a first component for split beam and a second component for split beam. The interleaver is used to transfer the first mode optical signal or the second mode optical signal to the second component for split beam. The modulator is used to transfer second optical signals with different wavelengths to the interleaver.

Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.

Abstract: A method of fabricating a thin film with a varying thickness includes the steps of providing a shadow mask with an opening, providing a carrier plate, arranging a substrate on the carrier plate, and coating the substrate through the opening whilst rotating the carrier plate relative to the shadow mask. A plurality of zones of the substrates is swept and exposed from arcuate portions of the opening per each turn by a plurality of predetermined exposure times, respectively. The varying thickness of the thin film corresponds to variation of the predetermined exposure times.

Abstract: Provided are an electrodeposited copper foil, an electrode comprising the same, and a lithium-ion secondary battery comprising the same. The electrodeposited copper foil has a drum side and a deposited side opposing the drum side, wherein at least one of the drum side and the deposited side exhibits a void volume value (Vv) in the range of 0.17 ?m3/?m2 to 1.17 ?m3/?m2; and an absolute value of a difference between a maximum height (Sz) of the drum side and a Sz of the deposited side is in the range of less than 0.60 ?m.

Abstract: Automated painting of a shoe sole portion of a shoe is enhanced by use of a jig. The shoe sole portion may be secured between top and bottom plates of the jig such that a side surface of the shoe sole portion is left exposed. Additionally, the jig is adapted to create configurable masking lines along the side surface of the shoe sole portion using multi-layer deforming layers.

Abstract: An automated system for painting a shoe sole portion of a shoe is provided. The automated painting system is adapted to use a variety of stations and components to automatically paint a side surface of the shoe sole portion while it is secured in a jig, transition the jig to an open position, and remove the painted shoe sole portion from the jig.

Abstract: An automated system for painting a shoe sole portion of a shoe is provided. The automated painting system is adapted to use a variety of stations and components to automatically paint a side surface of the shoe sole portion while it is secured in a jig, transition the jig to an open position, and remove the painted shoe sole portion from the jig.

Abstract: An automated system for painting a shoe sole portion of a shoe is provided. The automated painting system is adapted to use a variety of stations and components to automatically paint a side surface of the shoe sole portion while it is secured in a jig, transition the jig to an open position, and remove the painted shoe sole portion from the jig.

Abstract: A power saving method and a power saving system are applied in an optical disk drive. The power saving system comprises a power controlling unit for differentiating the specific sets of circuits not being used at a specific operation rate and powering them down. The sets of circuits not being used will be powered up while the associated operation rate at which they are required to operate is nearly started.

Abstract: A whipsaw for carrying a wafer in wafer cleaning is disclosed. The whipsaw may include a cleaning tank, an annular groove around a peripheral of the cleaning tank, a discharge chute disposed between the cleaning tank and the annular groove, at least one first flow channel communicative of the cleaning tank and the discharge chute, and at least one second flow channel communicative of the annular groove and the discharge chute. When the wafer with a tape is placed in the whipsaw, the wafer may correspond to the cleaning tank, and a portion of the tape unmasked by the wafer may correspond to the annular groove. The first flow channel provides a first fluid into the cleaning tank with the first fluid cleaning the wafer, and the second flow channel provides a second fluid into the annular groove with the second fluid isolating the first fluid from the tape.

Abstract: An automated system for painting a shoe sole portion of a shoe is provided. The automated painting system is adapted to use a variety of stations and components to automatically paint a side surface of the shoe sole portion while it is secured in a jig, transition the jig to an open position, and remove the painted shoe sole portion from the jig.