Connector

- Molex, LLC
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Description

FIG. 1 is a front perspective view of connector showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines depicting the remainder of the connector form no part of the claimed design.

Claims

The ornamental design for connector, as shown and described.

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Other references
  • 400G-QSFP-DD-500, Posted date Oct. 29, 2020 [Online], [Retrieved Nov. 20, 2023]. Retrieved From Internet, https://edgeoptic.com/products/400g-qsfp-dd/400g-qsfp-dd-500/ (Year: 2020).
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  • Hybrid Optical—Electrical Interconnects for Co-Packaged Optics, Posted Date Sep. 8, 2022 [Online], [Retrieved Dec. 20, 2023]. Retrieved From Internet, https://www.hpcwire.com/off-the-wire/molex-introduces-hybrid-optical-electrical-interconnects-for-co-packaged-optics/, Year: 2022, 3 pages.
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Patent History
Patent number: D1036388
Type: Grant
Filed: Apr 29, 2022
Date of Patent: Jul 23, 2024
Assignee: Molex, LLC (Lisle, IL)
Inventors: Thomas R. Marrapode (Naperville, IL), Jesus Enrique Fung (Westmont, IL), Andrew Kolak (Villa Park, IL), Wenzong Chen (Naperville, IL), Sung-Ping Huang (Hsinchu), Chih Chung Wu (Hsinchu), Sheng-Pin Su (Hsinchu County), Chien-Lang Tai (Hsinchu)
Primary Examiner: Leanne Was-Englehart
Assistant Examiner: Devin Kelly
Application Number: 29/837,002
Classifications
Current U.S. Class: Connector, Conductor Or Housing Therefor (10) (D13/133)