Patents by Inventor Chih-Hsien Chiu

Chih-Hsien Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11572438
    Abstract: A liquid-crystal polymer includes at least one repeating unit having a spiro structure, and the repeating unit occupies 1 mol % to 20 mol % of the liquid-crystal polymer. The liquid-crystal polymer is composed of the following repeating units: 1 mol % to 20 mol % of 10 mol % to 35 mol % of 10 mol % to 35 mol % of 10 mol % to 50 mol % of and 10 mol % to 40 mol % of AR1 is wherein each of ring R and ring S is independently a C3-20 ring, ring R and ring S share a carbon atom, and each of K1 and K2 is independently a C5-20 conjugated system. Each of AR2, AR3, AR4, and AR5 is independently AR6 or AR6—Z—AR7.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: February 7, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Lin Chu, Jen-Chun Chiu, Zu-Chiang Gu, Po-Hsien Ho, Meng-Hsin Chen, Chih-Hsiang Lin
  • Publication number: 20230027120
    Abstract: An electronic package is provided, in which a carrier structure provided with electronic components is disposed onto an antenna structure, where a stepped portion is formed at an edge of the antenna structure, so that a shielding body is arranged along a surface of the stepped portion. Therefore, the shielding body only covers a part of the surface of the antenna structure to prevent the shielding body from interfering with operation of the antenna structure.
    Type: Application
    Filed: August 25, 2021
    Publication date: January 26, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Shao-Tzu Tang, Wen-Jung Tsai, Chih-Hsien Chiu, Ko-Wei Chang, Yu-Wei Yeh, Yu-Cheng Pai, Chuan-Yi Pan, Chi-Rui Wu
  • Patent number: 11562968
    Abstract: The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: January 24, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hu-Wei Lin, Chih-Hsien Hsu, Yu-Wei Chiu, Hai-Yin Chen, Ying-Hao Wang, Yu-Hen Wu
  • Publication number: 20230019511
    Abstract: A system and method for reducing thermal transfer in a dual ampoule system. The dual ampoule system includes a first ampoule, a second ampoule, and a planar heat shield. The planar heat shield is positioned between the first ampoule and the second ampoule, where the planar heat shield is configured to resist thermal transfer between the first ampoule and the second ampoule.
    Type: Application
    Filed: February 15, 2022
    Publication date: January 19, 2023
    Inventors: Chi-Wen CHIU, Chih-Chang WU, Che-Wei TUNG, Chiang Hsien SHIH, Chin-Szu LEE
  • Publication number: 20220418095
    Abstract: ESD suppressor and manufacturing method thereof. The ESD suppressor include at least two printed circuit boards, one insulating frame, two terminal electrodes and two or more interior electrodes. The insulating frame is positioned between the two printed circuit boards, so as to form a main structure with a cavity. For each printed circuit board, at least one interior electrode is positioned on the surface facing the cavity and separated from other interior electrode(s). Two terminal electrodes are positioned on two different surfaces of the main structure and electrically connected to different interior electrodes respectively. Optionally, the insulating frame is a hallowed out printed circuit board or a frame formed by printing insulating material.
    Type: Application
    Filed: August 9, 2021
    Publication date: December 29, 2022
    Inventors: CHING HOHN LIEN, HUNG TSUNG HSU, CHIH HSIEN HSU, CHENG HSIEN CHIU, HSING-TSAI HUANG
  • Patent number: 11532568
    Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: December 20, 2022
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai, Yu-Wei Yeh, Tsung-Hsien Tsai, Chi-Liang Shih, Sheng-Ming Yang, Ping-Hung Liao
  • Publication number: 20220375822
    Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.
    Type: Application
    Filed: July 19, 2021
    Publication date: November 24, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Siang-Yu Lin, Wen-Jung Tsai, Chia-Yang Chen, Chien-Cheng Lin
  • Patent number: 11501510
    Abstract: A thermal image positioning method for determining a heat source location of the thermal image is disclosed. The thermal image positioning method includes obtaining a temperature array corresponding to the thermal image and determining a region of interest (ROI) of the temperature array. The thermal image positioning method further includes determining an ROI center reference point of the ROI, determining a plurality of corner points corresponding to the ROI, and determining the heat source location according to at least one of the plurality of corner points. A thermal image positioning system is also disclosed herein.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: November 15, 2022
    Assignee: Wistron Corporation
    Inventors: Chih-Hao Chiu, Hsiu-Mei Lin, Kuo-Hsien Lu
  • Publication number: 20220330835
    Abstract: A hybrid body temperature measurement system and a hybrid body temperature measurement method are provided. In the method, position sensing data is obtained. The position sensing data includes an azimuth of one or more to-be-detected objects relative to a reference position. The position sensing data is mapped to a thermal image so as to generate a mapping result. The thermal image is formed in response to a temperature. A position of the to-be-detected object in the thermal image is determined according to the mapping result. Accordingly, the detection accuracy is improved.
    Type: Application
    Filed: June 15, 2021
    Publication date: October 20, 2022
    Applicant: Wistron Corporation
    Inventors: Chih-Hao Chiu, Kuo-Hsien Lu
  • Patent number: 11476572
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: October 18, 2022
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Publication number: 20220317408
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 6, 2022
    Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
  • Publication number: 20220269894
    Abstract: A thermal image positioning method for determining a heat source location of the thermal image is disclosed. The thermal image positioning method includes obtaining a temperature array corresponding to the thermal image and determining a region of interest (ROI) of the temperature array. The thermal image positioning method further includes determining an ROI center reference point of the ROI, determining a plurality of corner points corresponding to the ROI, and determining the heat source location according to at least one of the plurality of corner points. A thermal image positioning system is also disclosed herein.
    Type: Application
    Filed: May 17, 2021
    Publication date: August 25, 2022
    Inventors: Chih-Hao Chiu, Hsiu-Mei Lin, Kuo-Hsien Lu
  • Publication number: 20220262747
    Abstract: An electronic package is provided, including at least an electronic element and at least an antenna structure disposed on a carrier structure. The antenna structure includes a base portion configured with an antenna body and a plurality of support portions disposed on the base portion. As such, the base portion is disposed over the carrier structure through the support portions and a plurality of open areas are formed between the base portion and the carrier structure to serve as an air gap, thereby effectively improving the performance gain and efficiency of the antenna body.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 18, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai, Chia-Chu Lai
  • Patent number: 11397302
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: July 26, 2022
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20220166076
    Abstract: The present invention relates to a pitch-variable battery fixture and a battery cell formation apparatus having the same. A pitch of clamping plates of a plurality of clamping blocks is increased by a slide actuator of the pitch-variable battery fixture, and then the clamping plates are inserted into a plurality of compartments of a battery tray. The clamping plates are urged to clamp batteries by the slide actuator. The battery tray is provided for placement of the batteries, and a compressing force is exerted for shaping the batteries during a battery cell formation. The pitch-variable battery fixture is provided for clamping batteries having different thicknesses. According to the actual thickness of each battery, the thickness of the formed battery can be shaped.
    Type: Application
    Filed: November 11, 2021
    Publication date: May 26, 2022
    Inventors: CHIH HSIEN CHIU, JUI HUNG WENG, CHIEN-HAO MA, CHENG CHIH HSIEH
  • Patent number: 11328419
    Abstract: A portable biological microscopic image analysis system is suitable for analyzing a sample on a slide in real time, and the sample comes from an animal. The portable biological microscopic image analysis system includes a handheld electronic device and a microscope kit; the handheld electronic device includes an image capture unit, an image analysis module electrically connected to the image capture unit, and a real-time state analysis module electrically connected to the image analysis module; the microscope kit is detachably mounted on the handheld electronic device; wherein the image capture unit is used to obtain an image related to the sample through the microscope kit, the image analysis module is used to obtain cell information corresponding to the animal according to the image, and the real-time state analysis module is used to obtain state information corresponding to the animal according to the cell information.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: May 10, 2022
    Assignee: National Applied Research Laboratories
    Inventors: Chih-Hsien Chiu, Chia-Yung Jui, Shu-Hui Hung, Peggy Joy Lu
  • Publication number: 20220093538
    Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
    Type: Application
    Filed: January 27, 2021
    Publication date: March 24, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Ko-Wei CHANG
  • Publication number: 20220059475
    Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.
    Type: Application
    Filed: November 3, 2021
    Publication date: February 24, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai
  • Patent number: 11233324
    Abstract: Provided is a packaging structure, which includes a carrier and an electronic component, an antenna module and a connector disposed on the carrier, and a packaging layer encapsulating the electronic component and the connector. A portion of a surface of the connector is exposed from the packaging layer so as to facilitate the electrical connection with a motherboard of an electronic product. A method for fabricating the packaging structure is also provided.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: January 25, 2022
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wen-Jung Tsai, Chih-Hsien Chiu
  • Patent number: 11222852
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: January 11, 2022
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Chia-Yang Chen