Patents by Inventor Chih-Hsien Chiu

Chih-Hsien Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12388062
    Abstract: An electronic package is provided and includes at least one electronic element, at least one first conductive structure and a second conductive structure disposed on one side of a carrier structure with at least one circuit layer, and an encapsulation layer covering the electronic element, the first conductive structure and the second conductive structure, where the first conductive structure is exposed from the encapsulation layer to externally connect required elements according to functional requirements.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: August 12, 2025
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Wen-Jung Tsai, Chih-Hsien Chiu, Chin-Chiang He, Ko-Wei Chang, Chien-Cheng Lin
  • Publication number: 20250226326
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a first carrier structure and a second carrier structure with a thickness less than that of the first carrier structure are provided, at least a first electronic component is disposed on the first carrier structure, and at least a second electronic component is disposed on the second carrier structure, wherein the first electronic component and the second electronic component are covered by an encapsulating layer, such that the second electronic component can be disposed on the second carrier structure by using a packaging module to avoid excessive height of the packaging module from occurrence.
    Type: Application
    Filed: October 1, 2024
    Publication date: July 10, 2025
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chih-Chiang HE, Ko-Wei CHANG, Chien-Wei HSIEH, Chia-Yang CHEN
  • Publication number: 20250183109
    Abstract: The present disclosure discloses an electronic package and a manufacturing method thereof. An electronic component is disposed on a substrate, an encapsulation layer covers the electronic component, and a frame that is not in contact with the substrate is embedded in the encapsulation layer, thereby preventing the electronic package from warping by the frame resisting thermal stress.
    Type: Application
    Filed: September 3, 2024
    Publication date: June 5, 2025
    Inventors: Chien-Wei HSIEH, Ko-Wei CHANG, Wen-Yang LI, Chih-Hsien CHIU, Chia-Yang CHEN, Chin-Wen LAI
  • Publication number: 20250174582
    Abstract: An electronic package is provided, in which a package module is disposed on a first surface of a carrier structure, and the package module is covered by a shielding layer, so that the shielding layer is formed on one part of a side surface of the carrier structure without being formed on the other part of the side surface, and thus a second surface of the carrier structure can be used as an antenna transmitting surface and/or an antenna receiving surface to prevent the shielding layer from interfering with the reception and the transmission of the carrier structure.
    Type: Application
    Filed: May 24, 2024
    Publication date: May 29, 2025
    Inventors: Wen-Yang LI, Chih-Hsien CHIU, Chin-Wen LAI, Ko-Wei CHANG, Chien-Min CHENG, Shih-Shiung KUO, Wen-Jung TSAI
  • Publication number: 20250149471
    Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
    Type: Application
    Filed: January 13, 2025
    Publication date: May 8, 2025
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien CHIU, Ko-Wei CHANG
  • Publication number: 20250132273
    Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.
    Type: Application
    Filed: January 2, 2025
    Publication date: April 24, 2025
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai
  • Publication number: 20250125237
    Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.
    Type: Application
    Filed: December 20, 2024
    Publication date: April 17, 2025
    Inventors: Chih-Hsien Chiu, Ko-Wei Chang, Wen-Jung Tsai, Che-Wei Yu, Chia-Yang Chen
  • Publication number: 20250096153
    Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic component is disposed on a substrate and covered with an encapsulation layer, and a frame body is embedded in the encapsulation layer and protrudes from the substrate. Therefore, the frame body can disperse thermal stress, thereby preventing warping from occurring to the electronic package.
    Type: Application
    Filed: January 30, 2024
    Publication date: March 20, 2025
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chien-Cheng LIN, Chun-Chong CHIEN, Shih-Shiung KUO
  • Patent number: 12230590
    Abstract: An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: February 18, 2025
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Ko-Wei Chang
  • Patent number: 12224255
    Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.
    Type: Grant
    Filed: March 18, 2024
    Date of Patent: February 11, 2025
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai
  • Publication number: 20250038061
    Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic component and a heat dissipation structure having an opening are arranged on a carrier structure, a heat sink is arranged in the opening and bonded to the electronic component, and the electronic component, the heat dissipation structure and the heat sink are covered with an encapsulation layer, such that the heat sink can be arranged according to a heat source of a specific part of the electronic component so as to effectively dissipate heat.
    Type: Application
    Filed: January 12, 2024
    Publication date: January 30, 2025
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chia-Yang CHEN, Chien-Ming CHANG, Po-Hsin TSAI
  • Patent number: 12211776
    Abstract: Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: January 28, 2025
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Ko-Wei Chang, Wen-Jung Tsai, Che-Wei Yu, Chia-Yang Chen
  • Publication number: 20250022809
    Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, then a cladding layer is formed to cover the electronic element, and a shielding layer is formed on the cladding layer to cover the electronic element. The cladding layer is bonded to a shielding structure, and the shielding structure is located between the shielding layer and the electronic element, so as to prevent the electronic element from being subjected to external electromagnetic interference via multiple shielding mechanisms of the shielding structure and the shielding layer.
    Type: Application
    Filed: October 12, 2023
    Publication date: January 16, 2025
    Inventors: Wen-Jung TSAI, Chih-Hsien CHIU, Chien-Cheng LIN, Shao-Tzu TANG, Ko-Wei CHANG
  • Publication number: 20240421023
    Abstract: An electronic package is provided, in which an electronic element and a heat dissipation member are disposed on different areas of a carrier structure having a heat dissipation layer, where the electronic element is covered by an encapsulation layer, and the heat dissipation member is thermally connected to the electronic element via the heat dissipation layer, so that the heat energy generated by the electronic element can be prevented from conducting into the encapsulation layer during the heat dissipation process, such that the problem of overheating around the electronic element can be avoided.
    Type: Application
    Filed: September 12, 2023
    Publication date: December 19, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chin-Chiang HE, Wan-Chin CHUNG, Che-Wei YU
  • Publication number: 20240364001
    Abstract: An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.
    Type: Application
    Filed: July 10, 2024
    Publication date: October 31, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Shao-Tzu TANG, Chih-Hsien CHIU, Wen-Jung TSAI, Ko-Wei CHANG, Chia-Chu LAI
  • Publication number: 20240321784
    Abstract: An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.
    Type: Application
    Filed: March 18, 2024
    Publication date: September 26, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai
  • Publication number: 20240321769
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a plurality of electronic components and a shielding part are disposed on a carrier structure, the shielding part is located between two of the electronic components, and the plurality of electronic components and the shielding part are covered by an encapsulating layer, where a surface of the shielding part has a protruding portion. Therefore, a periphery surface of the shielding part is a non-straight surface, so as to prevent the reflection of electromagnetic waves in the encapsulating layer from interfering with the signal transmission of the electronic components.
    Type: Application
    Filed: July 12, 2023
    Publication date: September 26, 2024
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Wan-Chin CHUNG, Chih-Chiang HE, Chun-Chong CHIEN
  • Patent number: 12100641
    Abstract: An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.
    Type: Grant
    Filed: July 18, 2023
    Date of Patent: September 24, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Siang-Yu Lin, Wen-Jung Tsai, Chia-Yang Chen, Chien-Cheng Lin
  • Publication number: 20240297126
    Abstract: An electronic package is provided in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure is embedded in the packaging layer. Therefore, thermal stress is dispersed through the frame body to avoid warpage of the electronic package, so as to facilitate the arrangement of other electronic components around the electronic component.
    Type: Application
    Filed: May 10, 2024
    Publication date: September 5, 2024
    Inventors: Chih-Hsien CHIU, Wen-Jung TSAI, Chien-Cheng LIN, Ko-Wei CHANG, Yu-Wei YEH, Shun-Yu CHIEN, Chia-Yang CHEN
  • Publication number: 20240290728
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a cover is disposed on a carrier structure having an electronic element, and the electronic element is covered by the cover. A magnetic conductive member is arranged between the cover and the electronic element, and an air gap is formed between the magnetic conductive member and the cover to enhance the shielding effect of the electronic package.
    Type: Application
    Filed: June 14, 2023
    Publication date: August 29, 2024
    Inventors: Wen-Jung TSAI, Chih-Hsien CHIU, Chien-Cheng LIN, Ming-Fan TSAI, Cheng-You JENG, Hui-Jing CHANG