Patents by Inventor Chih-Hsien Chiu
Chih-Hsien Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20170201023Abstract: An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute an antenna structure. Since the second metal layer is formed on a portion of a surface of the packaging layer, a propagating wave emitted by the first metal layer cannot pass through the second metal layer, but a surface of the packaging layer not covered by the second metal layer. Therefore, the propagating wave can be transmitted to a predetermined target, and the electronic package performs the function of an antenna.Type: ApplicationFiled: March 29, 2016Publication date: July 13, 2017Inventors: Chih-Hsien Chiu, Chia-Yang Chen, Ying-Wei Lu, Jyun-Yuan Jhang, Ming-Fan Tsai
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Publication number: 20170187117Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.Type: ApplicationFiled: March 10, 2017Publication date: June 29, 2017Inventors: Chih-Hsien Chiu, Heng-Cheng Chu, Cheng-Yu Chiang
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Patent number: 9673151Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.Type: GrantFiled: August 27, 2015Date of Patent: June 6, 2017Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen, Chun-Chi Ke
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Patent number: 9627748Abstract: An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.Type: GrantFiled: January 9, 2014Date of Patent: April 18, 2017Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Heng-Cheng Chu, Cheng-Yu Chiang
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Publication number: 20170103953Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.Type: ApplicationFiled: October 20, 2016Publication date: April 13, 2017Inventors: Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang
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Patent number: 9508656Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.Type: GrantFiled: August 20, 2014Date of Patent: November 29, 2016Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang
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Patent number: 9502377Abstract: A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module.Type: GrantFiled: August 20, 2013Date of Patent: November 22, 2016Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen, Chih-Ming Cheng, Yude Chu
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Patent number: 9502758Abstract: An electronic package is disclosed, which includes: a substrate; at least an electronic element disposed on the substrate; an encapsulant formed on the substrate and encapsulating the electronic element; and an antenna body embedded in the encapsulant without contacting with the substrate and exposed from a surface of the encapsulant. Since the antenna body is not disposed on the substrate, the surface area of the substrate can be reduced to meet the miniaturization requirement of the electronic package.Type: GrantFiled: January 2, 2014Date of Patent: November 22, 2016Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Hsin-Lung Chung, Hao-Ju Fang, Chih-Hsien Chiu, Yude Chu, Tsung-Hsien Tsai
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Publication number: 20160300660Abstract: An electronic device is provided, which includes: a magnetically conductive element having at least a through hole; a conductor structure formed on the magnetically conductive element and in the through hole; and a base body encapsulating the magnetically conductive element and the conductor structure, thereby allowing the electronic device to generate a higher magnetic flux and thus cause an increase in inductance.Type: ApplicationFiled: May 21, 2015Publication date: October 13, 2016Inventors: Chih-Hsien Chiu, Chi-Pin Tsai, Ming-Fan Tsai, Jyun-Yuan Jhang, Chi-Liang Shih
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Publication number: 20160225728Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.Type: ApplicationFiled: April 8, 2016Publication date: August 4, 2016Inventors: Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Chih-Hsien Chiu, Hsin-Lung Chung, Yude Chu
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Publication number: 20160172762Abstract: An electronic module is provided, which includes: a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body. A portion of the antenna body is exposed from the encapsulant. As such, the invention increases the arrangement area of the antenna body without increasing the size of the substrate, and also reduces the height of the encapsulant. Therefore, the electronic module of the present invention meets the miniaturization requirement.Type: ApplicationFiled: April 24, 2015Publication date: June 16, 2016Inventors: Chih-Hsien Chiu, Chi-Liang Shih
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Publication number: 20160155559Abstract: An electronic package is provided, including a substrate body, a ferromagnetic material embedded in the substrate body, and a conductor structure disposed around the conductor structure. Therefore, the conductor structure generates high magnetic flux and thus increases inductance.Type: ApplicationFiled: April 24, 2015Publication date: June 2, 2016Inventors: Chih-Hsien Chiu, Ming-Fan Tsai, Chia-Yang Chen, Chao-Ya Yang
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Patent number: 9337250Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes: a substrate having a plurality of conductive lands and a plurality of bonding pads surrounding the conductive lands formed on a surface thereof; a plurality of passive devices mounted on the conductive lands; an insulation layer formed on the surface and having a portion of the passive devices embedded therein; a semiconductor chip mounted on a top surface of the insulation layer; a plurality of bonding wires electrically connecting the semiconductor chip and the bonding pads; an encapsulant formed on the surface of the substrate to encapsulate the insulation layer, the bonding wires and the semiconductor chip, wherein a region of the semiconductor chip projected onto the substrate covers a portion of an outermost one of the passive devices. Therefore, the mounting density of the passive devices is improved.Type: GrantFiled: November 22, 2013Date of Patent: May 10, 2016Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Tsung-Hsien Tsai, Heng-Cheng Chu, Chien-Cheng Lin, Chih-Hsien Chiu, Hsin-Lung Chung, Yude Chu
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Publication number: 20160093576Abstract: A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.Type: ApplicationFiled: August 27, 2015Publication date: March 31, 2016Inventors: Chih-Hsien Chiu, Hao-Ju Fang, Hsin-Lung Chung, Cho-Hsin Chang, Tsung-Hsien Tsai, Chia-Yang Chen, Chun-Chi Ke
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Publication number: 20160081234Abstract: A package structure is provided, including an electronic element with a low frequency, a shielding member connected to the electrosnic element, and an encapsulant covering the electronic element and the shielding member, such that the electronic element is shielded from erroneous signals.Type: ApplicationFiled: January 28, 2015Publication date: March 17, 2016Inventors: Chih-Hsien Chiu, Hsin-Lung Chung, Chia-Yang Chen, Chao-Ya Yang, Yude Chu, Chih-Ming Cheng
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Publication number: 20160027740Abstract: A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are made of different materials. With the multiple shielding layers formed on the encapsulating layer, the electronic component is protected from electromagnetic interferences. The present invention also provides a method for fabricating the package structure.Type: ApplicationFiled: August 20, 2014Publication date: January 28, 2016Inventors: Chih-Hsien Chiu, Hsin-Lung Chung, Cho-Hsin Chang, Chia-Yang Chen, Chao-Ya Yang
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Patent number: 9221873Abstract: A short-chain peptide capable of controlling spermatozoa fertilization performance is supplied in an in vitro culture medium of spermatozoa and oocytes to increase the success rates of in vitro fertilization. The short-chain peptide comprises an amino acid sequence H-Tyr-Asn-Trp-Asn-Ser-Phe-Gly-Leu-Arg-X-NH2 (SEQ ID NO: 1), where X denotes Tyr or Phe, and the sequence ends with an amide. The short-chain peptide is conducive to adjustment of the concentration of free calcium ions inside the cells of the spermatozoa and thus enhancement of the success rates of in vitro fertilization.Type: GrantFiled: September 24, 2014Date of Patent: December 29, 2015Assignee: NATIONAL TAIWAN UNIVERSITYInventors: Chih-Hsien Chiu, Meng-Chieh Hsu
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Publication number: 20150340248Abstract: A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.Type: ApplicationFiled: August 4, 2015Publication date: November 26, 2015Inventors: Tsung-Hsien Tsai, Chih-Hsien Chiu, Hsin-Lung Chung, Chien-Cheng Lin
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Publication number: 20150263421Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure provided on the substrate, wherein the antenna structure has at least a supporting portion and an extending portion supported by the supporting portion over the substrate and surrounding the electronic element; and a shielding structure provided on the substrate and overlapping with the antenna structure, thereby saving the surface area of the substrate so as to meet the miniaturization requirement of the electronic package.Type: ApplicationFiled: May 29, 2014Publication date: September 17, 2015Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Chih-Hsien Chiu, Tsung-Hsien Tsai, Chi-Pin Tsai, Chih-Ming Cheng
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Patent number: 9111945Abstract: A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.Type: GrantFiled: January 10, 2011Date of Patent: August 18, 2015Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Tsung-Hsien Tsai, Chih-Hsien Chiu, Hsin-Lung Chung, Chien-Cheng Lin