Abstract: A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Subsequently, the supporting plate is removed. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulation layer encapsulates the electronic component and the conductive elements. The encapsulation layer has concave portions corresponding in position to the conductive elements. Each of the conductive elements is in no contact with corresponding one of the concave portions.

Abstract: An electronic package and a method for fabricating the same are provided. An antenna frame, a first electronic component, and a second electronic component electrically connected to the antenna frame are disposed on a lower side of a carrying structure. An antenna structure is disposed on an upper side of the carrying structure and is electrically connected to the first electronic component. Therefore, two different types of antennas are integrated into an identical electronic package. Such the electronic package bonded to a circuit can transmit signals with two different wavelengths, even if the electronic package does not have any area increased.

Abstract: The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.

Abstract: An electronic package is provided. An electronic component and a plurality of conductive pillars electrically connected with the electronic component are embedded in an encapsulating layer. Each of the conductive pillars has a circumferential surface and two end surfaces wider than the circumferential surface in width. The encapsulating layer encapsulates and protects the electronic component effectively, so as to improve the reliability of the electronic package. A method for fabricating the electronic package is also provided.

Abstract: An electronic package is provided. An electronic component and a plurality of conductive pillars electrically connected with the electronic component are embedded in an encapsulating layer. Each of the conductive pillars has a circumferential surface and two end surfaces wider than the circumferential surface in width. The encapsulating layer encapsulates and protects the electronic component effectively, so as to improve the reliability of the electronic package. A method for fabricating the electronic package is also provided.

Abstract: An electronic structure and a method for fabricating the same are provided. An electronic component and conductive elements are disposed on a carrier. An encapsulating layer encapsulates the electronic component and the conductive elements. The encapsulating layer is formed with recessed portions corresponding in position to the conductive elements. A gap is formed between the conductive elements and the recessed portions.

Abstract: An electronic package and a method for fabricating the same are provided. An antenna frame, a first electronic component, and a second electronic component electrically connected to the antenna frame are disposed on a lower side of a carrying structure. An antenna structure is disposed on an upper side of the carrying structure and is electrically connected to the first electronic component. Therefore, two different types of antennas are integrated into an identical electronic package. Such the electronic package bonded to a circuit can transmit signals with two different wavelengths, even if the electronic package does not have any area increased.

Abstract: A method for fabricating an electronic package includes providing a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Subsequently, the supporting plate is removed. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

Abstract: An electronic package structure is provided, which includes: a first carrier having an opening; at least a first electronic component and a plurality of conductive elements disposed on the first carrier; a second carrier bonded to the conductive elements; at least a second electronic component disposed on the second carrier and received in the opening of the first carrier; and an encapsulant formed on the first carrier and the second carrier and encapsulating the first electronic component, the second electronic component and the conductive elements. By receiving the second electronic component in the opening of the first carrier, the present disclosure reduces the height of the electronic package structure. The present disclosure further provides a method for fabricating the electronic package structure.

Abstract: An electronic package includes a metal member including a supporting plate and a plurality of conductive pillars disposed on the supporting plate. A circuit structure is coupled to the conductive pillars. An electronic component is disposed on the metal member and electrically connected to the circuit structure. An encapsulant encapsulates the conductive pillars and the electronic component. Any mold can be used for fabricating the electronic package, no matter what the size of the electronic package is. Therefore, the fabricating cost of the electronic package is reduced.

Abstract: The present disclosure provides an electronic package and a method for fabricating the same. A protective layer is formed on a carrier of the electronic component. The electronic component and the protective layer are covered by a covering layer. A through hole is formed in the covering layer and extends through the protective layer, such that a portion of a surface of the carrier is exposed to the through hole. A conductive structure is disposed in the through hole and electrically connected with the carrier. Through the formation of the protective layer, the buffering effect of the protective layer can prevent the laser from directly burning through the covering layer and the protective layer to avoid damages to the carrier.

Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

Abstract: An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.

Abstract: An electronic package structure is provided, which includes: a first carrier having an opening; at least a first electronic component and a plurality of conductive elements disposed on the first carrier; a second carrier bonded to the conductive elements; at least a second electronic component disposed on the second carrier and received in the opening of the first carrier; and an encapsulant formed on the first carrier and the second carrier and encapsulating the first electronic component, the second electronic component and the conductive elements. By receiving the second electronic component in the opening of the first carrier, the present disclosure reduces the height of the electronic package structure. The present disclosure further provides a method for fabricating the electronic package structure.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes disposing an electronic component on a lower side of a first carrier and forming an encapsulant on an upper side of the first carrier. A first conductor is disposed on the encapsulant and configured for generating radiation energy by an alternating voltage, an alternating current or radiation variation. As such, the electronic package has a reduced thickness and improved antenna efficiency.

Abstract: An electronic package is provided. An electronic component and a plurality of conductive pillars are provided on a carrier structure. An encapsulation layer encapsulates the electronic component and the conductive pillars. Each of the conductive pillars has a peripheral surface narrower than two end surfaces of the conductive pillar. Therefore, the encapsulation layer is better bonded to the conductive pillars. A method for fabricating the electronic package is also provided.

Abstract: An electronic package is provided. An electronic component and a plurality of conductive pillars are provided on a carrier structure. An encapsulation layer encapsulates the electronic component and the conductive pillars. Each of the conductive pillars has a peripheral surface narrower than two end surfaces of the conductive pillar. Therefore, the encapsulation layer is better bonded to the conductive pillars. A method for fabricating the electronic package is also provided.