Patents by Inventor Chih-Hsun Lin
Chih-Hsun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9142693Abstract: An optoelectronic package includes a substrate and a cover element bonded onto the substrate. The cover element defines a cavity for accommodating semiconductor chips and optoelectronic components. The cover element includes a first adhesive bonding area configured for receiving a first adhesive and being bonded with a predetermined region of the substrate by the first adhesive. The engagement of the cover element and the substrate defines a second adhesive bonding area. The second adhesive bonding area is configured for receiving a second adhesive and confining the second adhesive within a localized area. A method for making an optoelectronic package is also provided.Type: GrantFiled: April 11, 2013Date of Patent: September 22, 2015Assignee: SAE MAGNETICS (H.K.) LTD.Inventors: Dennis Tak Kit Tong, Vincent Wai Hung, Danny Chih Hsun Lin, Francis Guillen Gamboa
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Publication number: 20150171189Abstract: A device includes a semiconductor substrate, a gate stack over the semiconductor substrate, and a stressor region having at least a portion in the semiconductor substrate and adjacent to the gate stack. The stressor region includes a first stressor region having a first p-type impurity concentration, a second stressor region over the first stressor region, wherein the second stressor region has a second p-type impurity concentration, and a third stressor region over the second stressor region. The third stressor region has a third p-type impurity concentration. The second p-type impurity concentration is lower than the first and the third p-type impurity concentrations.Type: ApplicationFiled: March 2, 2015Publication date: June 18, 2015Inventors: Mei-Hsuan Lin, Chih-Hsun Lin, Ching-Hua Chu, Ling-Sung Wang
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Patent number: 9046306Abstract: A heat dissipation device includes a plurality of fins connected to each other and two heat pipes extending through the fins. Each fin includes a plate, an upper flange extending from a top side of the plate, a lower flange extending from a bottom side of the plate and an inner flange extending from an inner periphery of a groove defined in the plate. The fins include first fins and second fins having lengths larger than that of the first fins. The two heat pipes include a wide heat pipe and a narrow heat pipe. The wide heat pipe extends through the grooves and contacts the inner flanges of the first fins and the second fins. The narrow heat pipe extends through the grooves and contacts the inner flanges of the second fins.Type: GrantFiled: August 23, 2011Date of Patent: June 2, 2015Assignee: Foxconn Technology Co., Ltd.Inventor: Chih-Hsun Lin
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Patent number: 9024391Abstract: A semiconductor structure includes a substrate, a shallow trench isolation (STI) structure embedded in the substrate, a stressor embedded in the substrate, and a conductive plug over and electrically coupled with the stressor. A same-material region is sandwiched by the STI structure and an entire sidewall of the stressor, and the same-material region is a continuous portion of the substrate.Type: GrantFiled: September 23, 2014Date of Patent: May 5, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mei-Hsuan Lin, Chih-Hsun Lin, Chih-Kang Chao, Ling-Sung Wang
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Patent number: 9012300Abstract: A manufacturing method for a shallow trench isolation. First, a substrate is provided, a hard mask layer and a patterned photoresist layer are sequentially formed on the substrate, at least one trench is then formed in the substrate through an etching process, the hard mask layer is removed. Afterwards, a filler is formed at least in the trench and a planarization process is then performed on the filler. Since the planarization process is performed only on the filler, so the dishing phenomenon can effectively be avoided.Type: GrantFiled: October 1, 2012Date of Patent: April 21, 2015Assignee: United Microelectronics Corp.Inventors: Wu-Sian Sie, Chun-Wei Hsu, Chia-Lung Chang, Chih-Hsun Lin, Chang-Hung Kung, Yu-Ting Li, Wei-Che Tsao, Yen-Ming Chen, Chun-Hsiung Wang, Chia-Lin Hsu
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Patent number: 9000568Abstract: A semiconductor structure includes a substrate, an oxide layer, a metallic oxynitride layer and a metallic oxide layer. The oxide layer is located on the substrate. The metallic oxynitride layer is located on the oxide layer. The metallic oxide layer is located on the metallic oxynitride layer. In addition, the present invention also provides a semiconductor process for forming the semiconductor structure.Type: GrantFiled: September 26, 2011Date of Patent: April 7, 2015Assignee: United Microelectronics Corp.Inventors: Szu-Hao Lai, Yu-Ren Wang, Po-Chun Chen, Chih-Hsun Lin, Che-Nan Tsai, Chun-Ling Lin, Chiu-Hsien Yeh, Te-Lin Sun
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Patent number: 8994097Abstract: A device includes a semiconductor substrate, a gate stack over the semiconductor substrate, and a stressor region having at least a portion in the semiconductor substrate and adjacent to the gate stack. The stressor region includes a first stressor region having a first p-type impurity concentration, a second stressor region over the first stressor region, wherein the second stressor region has a second p-type impurity concentration, and a third stressor region over the second stressor region. The third stressor region has a third p-type impurity concentration. The second p-type impurity concentration is lower than the first and the third p-type impurity concentrations.Type: GrantFiled: March 8, 2012Date of Patent: March 31, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mei-Hsuan Lin, Chih-Hsun Lin, Ching-Hua Chu, Ling-Sung Wang
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Publication number: 20150041857Abstract: A semiconductor structure includes a substrate, a shallow trench isolation (STI) structure embedded in the substrate, a stressor embedded in the substrate, and a conductive plug over and electrically coupled with the stressor. A same-material region is sandwiched by the STI structure and an entire sidewall of the stressor, and the same-material region is a continuous portion of the substrate.Type: ApplicationFiled: September 23, 2014Publication date: February 12, 2015Inventors: Mei-Hsuan LIN, Chih-Hsun LIN, Chih-Kang CHAO, Ling-Sung WANG
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Patent number: 8940600Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a transistor region and a resistor region; forming a shallow trench isolation (STI) on the resistor region of the substrate; forming a tank in the STI; and forming a resistor in the tank and on two sides of the top surface of the STI outside the tank.Type: GrantFiled: June 3, 2014Date of Patent: January 27, 2015Assignee: United Microelectronics Corp.Inventors: Chun-Wei Hsu, Po-Cheng Huang, Ren-Peng Huang, Jie-Ning Yang, Chia-Lin Hsu, Teng-Chun Tsai, Chih-Hsun Lin, Chang-Hung Kung, Yen-Ming Chen, Yu-Ting Li
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Publication number: 20140362531Abstract: The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.Type: ApplicationFiled: August 26, 2014Publication date: December 11, 2014Inventors: SHIH-CHANG LEE, MING-LEE CHU, CHIH-HSUN LIN
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Patent number: 8879268Abstract: The present invention discloses a cooling system for an electronic rack, comprising: an electronic rack comprising at least one side wall; at least one electronic chassis comprising a top wall and at least one side wall and disposed inside the electronic rack for housing at least one modular electronics equipment comprising a plurality of electronic components and at least one stationary thermal interface arranged above the plurality of electronic components; a first detachable thermal interface arranged between the top wall of the at least one electronic chassis and the at least one modular electronic equipment; and at least one second detachable thermal interface arranged between the at least one side wall of the electronic rack and the at least one side wall of the at least one electronic chassis.Type: GrantFiled: February 13, 2012Date of Patent: November 4, 2014Assignee: Academia SinicaInventors: Shih-Chang Lee, Chi-Hao Jin, Ming-Lee Chu, Chih-Hsun Lin
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Patent number: 8846492Abstract: An embodiment of the disclosure includes a method of forming a semiconductor structure. A substrate has a region adjacent to a shallow trench isolation (STI) structure in the substrate. A patterned mask layer is formed over the substrate. The patterned mask layer covers the STI structure and a portion of the region, and leaves a remaining portion of the region exposed. A distance between an edge of the remaining portion and an edge of the STI structure is substantially longer than 1 nm. The remaining portion of the region is etched thereby forms a recess in the substrate. A stressor is epitaxially grown in the recess. A conductive plug contacting the stressor is formed.Type: GrantFiled: July 22, 2011Date of Patent: September 30, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mei-Hsuan Lin, Chih-Hsun Lin, Chih-Kang Chao, Ling-Sung Wang
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Publication number: 20140273371Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a transistor region and a resistor region; forming a shallow trench isolation (STI) on the resistor region of the substrate; forming a tank in the STI; and forming a resistor in the tank and on two sides of the top surface of the STI outside the tank.Type: ApplicationFiled: June 3, 2014Publication date: September 18, 2014Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Wei Hsu, Po-Cheng Huang, Ren-Peng Huang, Jie-Ning Yang, Chia-Lin Hsu, Teng-Chun Tsai, Chih-Hsun Lin, Chang-Hung Kung, Yen-Ming Chen, Yu-Ting Li
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Patent number: 8836088Abstract: A semiconductor structure includes a substrate, a conductive feature over the substrate, a conductive plug structure contacting a portion of an upper surface of the conductive feature, a first etch stop layer over another portion of the upper surface of the conductive feature, and a second etch stop layer over the first etch stop layer. The first etch stop layer is a doped etch stop layer. The first etch stop layer is to function as an etch stop layer during a predetermined etching process for etching the second etch stop layer.Type: GrantFiled: July 24, 2013Date of Patent: September 16, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mei-Hsuan Lin, Chih-Hsun Lin, Chih-Kang Chao, Ling-Sung Wang
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Patent number: 8779526Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate having a transistor region and a resistor region; forming a shallow trench isolation (STI) on the substrate of the resistor region; forming a tank in the STI of the resistor region; and forming a resistor in the tank and on the surface of the STI adjacent to two sides of the tank.Type: GrantFiled: October 28, 2011Date of Patent: July 15, 2014Assignee: United Microelectronics Corp.Inventors: Chun-Wei Hsu, Po-Cheng Huang, Ren-Peng Huang, Jie-Ning Yang, Chia-Lin Hsu, Teng-Chun Tsai, Chih-Hsun Lin, Chang-Hung Kung, Yen-Ming Chen, Yu-Ting Li
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Patent number: 8775982Abstract: The present disclosure provides an integrated circuit design method. In an example, a method includes receiving an integrated circuit design layout that includes an active region feature, a contact feature, and an isolation feature, wherein a portion of the active region feature is disposed between the contact feature and the isolation feature; determining whether a thickness of the portion of the active region feature disposed between the contact feature and the isolation feature is less than a threshold value; and modifying the integrated circuit design layout if the thickness is less than the threshold value, wherein the modifying includes adding a supplementary active region feature adjacent to the portion of the active region feature disposed between the contact feature and the isolation feature.Type: GrantFiled: June 25, 2013Date of Patent: July 8, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mei-Hsuan Lin, Chih-Chan Lu, Chih-Hsun Lin, Chih-Kang Chao, Ling-Sung Wang, Jen-Pan Wang
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Patent number: 8765545Abstract: A method of manufacturing a semiconductor device is disclosed. The exemplary method includes providing a substrate having a source region and a drain region. The method further includes forming a first recess in the substrate within the source region and a second recess in the substrate within the drain region. The first recess has a first plurality of surfaces and the second recess has a second plurality of surfaces. The method also includes epi-growing a semiconductor material in the first and second recesses and, thereafter, forming shallow isolation (STI) features in the substrate.Type: GrantFiled: May 30, 2013Date of Patent: July 1, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mei-Hsuan Lin, Chih-Kang Chao, Chih-Hsun Lin, Ling-Sung Wang
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Patent number: 8741732Abstract: A plurality of metal layers includes a top metal layer. An Ultra-Thick Metal (UTM) layer is disposed over the top metal layer, wherein no additional metal layer is located between the UTM layer and the top metal layer. A Metal-Insulator-Metal (MIM) capacitor is disposed under the UTM layer and over the top metal layer.Type: GrantFiled: October 4, 2013Date of Patent: June 3, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kun-Mao Wu, Chih-Hsun Lin, Yu-Lung Yeh, Kuan-Chi Tsai
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Patent number: 8709901Abstract: The present invention relates to a method of forming an isolation structure, in which, a trench is formed in a substrate through a hard mask, and deposition, etch back, deposition, planarization, and etch back are performed in the order to form an isolation material layer of the isolation structure after the hard mask is removed. A silicon layer may be formed to cover the trench and original surface of the substrate before the former deposition, or to cover a part of the trench and original surface of the substrate after the former etch back and before the later deposition, to serve as a stop layer for the planarization process. Voids existing within the isolation material layer can be exposed or removed by partially etching the isolation material layer by the former etch back. The later deposition can be performed with a less aspect ratio to avoid forming voids.Type: GrantFiled: April 17, 2013Date of Patent: April 29, 2014Assignee: United Microelectronics Corp.Inventors: Chia-Lung Chang, Wu-Sian Sie, Jei-Ming Chen, Wen-Yi Teng, Chih-Chien Liu, Jui-Min Lee, Chih-Hsun Lin
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Publication number: 20140106558Abstract: A semiconductor device having a metal gate includes a substrate having a plurality of shallow trench isolations (STIs) formed therein, at least a metal gate positioned on the substrate, and at least a pair of auxiliary dummy structures respectively positioned at two sides of the metal gate and on the substrate.Type: ApplicationFiled: December 31, 2013Publication date: April 17, 2014Applicant: UNITED MICROELECTRONICS CORP.Inventors: Chun-Wei Hsu, Po-Cheng Huang, Teng-Chun Tsai, Chia-Lin Hsu, Chih-Hsun Lin, Yen-Ming Chen, Chia-Hsi Chen, Chang-Hung Kung