Patents by Inventor Chih-Hung Chen

Chih-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220012400
    Abstract: A method includes cropping a plurality of images from a layout of an integrated circuit, generating a first plurality of hash values, each from one of the plurality of images, loading a second plurality of hash values stored in a hotspot library, and comparing each of the first plurality of hash values with each of the second plurality of hash values. The step of comparing includes calculating a similarity value between the each of the first plurality of hash values and the each of the second plurality of hash values. The method further includes comparing the similarity value with a pre-determined threshold similarity value, and in response to a result that the similarity value is greater than the pre-determined threshold similarity value, recording a position of a corresponding image that has the result. The position is the position of the corresponding image in the layout.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 13, 2022
    Inventors: I-Shuo Liu, Chih-Chun Hsia, Hsin Ting Chou, Kuanhua Su, William Weilun Hong, Chih Hung Chen, Kei-Wei Chen
  • Patent number: 11222802
    Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: January 11, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yi-Fam Shiu, Yu-Chen Chen, Yang-Ann Chu, Jiun-Rong Pai
  • Publication number: 20220005957
    Abstract: A manufacturing method of a semiconductor device includes the following steps. An opening is formed penetrating a dielectric layer on a semiconductor substrate. A stacked structure is formed on the dielectric layer. The stacked structure includes a first semiconductor layer partly formed in the opening and partly formed on the dielectric layer, a sacrificial layer formed on the first semiconductor layer, and a second semiconductor layer formed on the sacrificial layer. A patterning process is performed for forming a fin-shaped structure including the first semiconductor layer, the sacrificial layer, and the second semiconductor layer. An etching process is performed to remove the sacrificial layer in the fin-shaped structure. The first semiconductor layer in the fin-shaped structure is etched to become a first semiconductor wire by the etching process. The second semiconductor layer in the fin-shaped structure is etched to become a second semiconductor wire by the etching process.
    Type: Application
    Filed: September 15, 2021
    Publication date: January 6, 2022
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chin-Hung Chen, Ssu-I Fu, Chih-Kai Hsu, Chun-Ya Chiu, Chia-Jung Hsu, Yu-Hsiang Lin
  • Publication number: 20210408816
    Abstract: Various embodiments of a battery charging apparatus are disclosed, along with methods of charging and rejuvenating a battery using the apparatus. The apparatus may include a positive electrode and a negative electrode which are configured to connect to a battery, and a charging current generator generating a charging current that charges the battery for a period of time via the positive and and negative electrodes by adding electric charge to the battery. The charging current is generated based on parameters of the battery, including a charging constant and an initial charging state. In some embodiments, a natural logarithm of a ratio of the added electric charge to the initial charging state substantially equals to a product of the charging constant and a length of the period of time and negative one.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 30, 2021
    Inventors: Rong-Jie Chen, Chih-Hung Lin
  • Publication number: 20210408373
    Abstract: A method for fabricating a memory device is provided. The method includes forming a bottom electrode layer over a substrate; forming a buffer layer over the bottom electrode layer; performing a surface treatment to a top surface of the buffer layer; depositing a resistance switch layer over the top surface of the buffer layer after performing the surface treatment; forming a top electrode over the resistance switch layer; and patterning the resistance switch layer into a resistance switch element below the top electrode.
    Type: Application
    Filed: June 25, 2020
    Publication date: December 30, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsia-Wei CHEN, Chih-Hung PAN, Chih-Hsiang CHANG, Yu-Wen LIAO, Wen-Ting CHU
  • Publication number: 20210407826
    Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 30, 2021
    Inventors: Chih-Hung HUANG, Cheng-Lung WU, Yi-Fam SHIU, Yu-Chen CHEN, Yang-Ann CHU, Jiun-Rong PAI
  • Patent number: 11203123
    Abstract: Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: December 21, 2021
    Assignee: Grabit, Inc.
    Inventors: Harsha Prahlad, Richard J. Casler, Susan Kim, Matthew Leettola, Jon Smith, Kenneth Tan, Patrick Wang, John Mathew Farren, Patrick Conall Regan, Po Cheng Chen, Honam Ko, Dragan Jurkovic, Aishwarya Varadhan, Tsung Tai Chien, Chang-Chu Liao, Chih-Chi Chang, Kuo-Hung Lee, TaeHoun Kim
  • Publication number: 20210364275
    Abstract: A method of evaluating a thickness of a film on a substrate includes detecting atomic force responses of the film to exposure of electromagnetic radiation in the infrared portion of the electromagnetic spectrum. The use of atomic force microscopy to evaluate thicknesses of thin films avoids underlayer noise commonly encountered when optical metrology techniques are utilized to evaluate film thicknesses. Such underlayer noise adversely impacts the accuracy of the thickness evaluation.
    Type: Application
    Filed: March 8, 2021
    Publication date: November 25, 2021
    Inventors: Chih Hung CHEN, Kei-Wei CHEN, Te-Ming KUNG
  • Publication number: 20210348027
    Abstract: A magnetic polishing slurry for polishing a workpiece includes magnetic particles coated with a modifying material, a liquid carrier, and abrasives. The modifying material has a hardness lower than that of the workpiece.
    Type: Application
    Filed: January 5, 2021
    Publication date: November 11, 2021
    Inventors: JI CUI, CHIH HUNG CHEN, KEI-WEI CHEN
  • Publication number: 20210343538
    Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.
    Type: Application
    Filed: July 12, 2021
    Publication date: November 4, 2021
    Inventors: Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih Hung Chen, William Weilun Hong, Kei-Wei Chen
  • Patent number: 11145751
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate structure, a source/drain structure, a dielectric layer, a contact plug. The gate structure is positioned over a fin structure. The source/drain structure is positioned in the fin structure and adjacent to the gate structure. The dielectric layer is positioned over the gate structure and the source/drain structure. The contact plug is positioned passing through the dielectric layer. The contact plug includes a first metal compound including one of group III elements, group IV elements, group V elements or a combination thereof.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: October 12, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kuo-Ju Chen, Su-Hao Liu, Chun-Hao Kung, Liang-Yin Chen, Huicheng Chang, Kei-Wei Chen, Hui-Chi Huang, Kao-Feng Liao, Chih-Hung Chen, Jie-Huang Huang, Lun-Kuang Tan, Wei-Ming You
  • Publication number: 20210220964
    Abstract: A chemical mechanical planarization apparatus includes a multi-zone platen comprising a plurality of individually controlled concentric toroids. The rotation direction, rotation speed, applied force, relative height, and temperature of each concentric toroid is individually controlled. Concentric polishing pads are affixed to an upper surface of each of the individually controlled concentric toroids. The chemical mechanical planarization apparatus includes a single central slurry source or includes individual slurry sources for each individually controlled concentric toroid.
    Type: Application
    Filed: January 17, 2020
    Publication date: July 22, 2021
    Inventors: Ting-Hsun Chang, Hung Yen, Chi-Hsiang Shen, Fu-Ming Huang, Chun-Chieh Lin, Tsung Hsien Chang, Ji Cui, Liang-Guang Chen, Chih Hung Chen, Kei-Wei Chen
  • Patent number: 11069533
    Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: July 20, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih Hung Chen, William Weilun Hong, Kei-Wei Chen
  • Patent number: 11057695
    Abstract: The present disclosure provides an in-ear headphone device including a loudspeaker having a loudspeaker diaphragm and a microphone, wherein the device is arranged to provide a noise cancelling audio signal to the loudspeaker. The loudspeaker and microphone are acoustically coupled within a device housing, and the device includes an acoustic tube coupling the device to an ear canal of a user. The acoustic tube is associated with an acoustic tube axis defining a projection plane perpendicular to the acoustic tube axis. The loudspeaker and microphone are arranged such that a projection area of the loudspeaker diaphragm onto the projection plane and a projection area of the microphone onto the projection plane are non-intersecting. The disclosure further provides an in-ear headphone device set including a first and a second in-ear headphone device.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: July 6, 2021
    Assignee: Tymphany Acoustic Technology (Huizhou) Co., Ltd.
    Inventors: Rowan Dylan Gower Williams, Thomas Pieter J. Peeters, Chih-Hung Chen
  • Patent number: 11035554
    Abstract: A motion sensitive lamp with a coupling mechanism is provided. The motion sensitive lamp is installed on a wall or a ceiling. The motion sensitive lamp at least includes a lamp body, a base and a coupling mechanism. A coupling mechanism includes an engaging structure, a positioning structure and a limiting element. One of the engaging structure and the positioning structure is installed on the lamp body. The other of the engaging structure and the positioning structure is installed on the base. The engaging structure is inserted into the positioning structure, so that the lamp body is locked on or coupled with the base. When an external force is applied to the limiting element, the external force results in a displacement of the limiting element, so that the limiting element is inserted into one of the base and the lamp body.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: June 15, 2021
    Assignee: LIVINGSTYLE ENTERPRISES LIMITED
    Inventors: Ming-Yun Chen, Chih-Hung Chen
  • Publication number: 20210125881
    Abstract: Various embodiments provide a thickness sensor and method for measuring a thickness of discrete conductive features, such as conductive lines and plugs. In one embodiment, the thickness sensor generates an Eddy current in a plurality of discrete conductive features, and measures the generated Eddy current generated in the discrete conductive features. The thickness sensor has a small sensor spot size, and amplifies peaks and valleys of the measured Eddy current. The thickness sensor determines a thickness of the discrete conductive features based on a difference between a minimum amplitude value and a maximum amplitude value of the measured Eddy current.
    Type: Application
    Filed: January 6, 2021
    Publication date: April 29, 2021
    Inventors: CHIH HUNG CHEN, KEI-WEI CHEN, YING-LANG WANG
  • Publication number: 20210053180
    Abstract: A chemical mechanical planarization (CMP) tool includes a platen and a polishing pad attached to the platen, where a first surface of the polishing pad facing away from the platen includes a first polishing zone and a second polishing zone, where the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, where the first polishing zone and the second polishing zone have different surface properties.
    Type: Application
    Filed: August 23, 2019
    Publication date: February 25, 2021
    Inventors: Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang, Ting-Hsun Chang, Fu-Ming Huang, Chun-Chieh Lin, Peng-Chung Jangjian, Ji James Cui, Liang-Guang Chen, Chih Hung Chen, Kei-Wei Chen
  • Patent number: 10916481
    Abstract: Various embodiments provide a thickness sensor and method for measuring a thickness of discrete conductive features, such as conductive lines and plugs. In one embodiment, the thickness sensor generates an Eddy current in a plurality of discrete conductive features, and measures the generated Eddy current generated in the discrete conductive features. The thickness sensor has a small sensor spot size, and amplifies peaks and valleys of the measured Eddy current. The thickness sensor determines a thickness of the discrete conductive features based on a difference between a minimum amplitude value and a maximum amplitude value of the measured Eddy current.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: February 9, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih Hung Chen, Kei-Wei Chen, Ying-Lang Wang
  • Publication number: 20210036129
    Abstract: In an embodiment, a method includes: performing a self-limiting process to modify a top surface of a wafer; after the self-limiting process completes, removing the modified top surface from the wafer; and repeating the performing the self-limiting process and the removing the modified top surface from the wafer until a thickness of the wafer is decreased to a predetermined thickness.
    Type: Application
    Filed: October 12, 2020
    Publication date: February 4, 2021
    Inventors: Chih Hung Chen, Kei-Wei Chen, Ying-Lang Wang
  • Publication number: 20210025572
    Abstract: A motion sensitive lamp with a coupling mechanism is provided. The motion sensitive lamp is installed on a wall or a ceiling. The motion sensitive lamp at least includes a lamp body, a base and a coupling mechanism. A coupling mechanism includes an engaging structure, a positioning structure and a limiting element. One of the engaging structure and the positioning structure is installed on the lamp body. The other of the engaging structure and the positioning structure is installed on the base. The engaging structure is inserted into the positioning structure, so that the lamp body is locked on or coupled with the base. When an external force is applied to the limiting element, the external force results in a displacement of the limiting element, so that the limiting element is inserted into one of the base and the lamp body.
    Type: Application
    Filed: July 21, 2020
    Publication date: January 28, 2021
    Inventors: MING-YUN CHEN, CHIH-HUNG CHEN