Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

Abstract: The present disclosure provides an in-ear headphone device including a loudspeaker having a loudspeaker diaphragm and a microphone, wherein the device is arranged to provide a noise cancelling audio signal to the loudspeaker. The loudspeaker and microphone are acoustically coupled within a device housing, and the device includes an acoustic tube coupling the device to an ear canal of a user. The acoustic tube is associated with an acoustic tube axis defining a projection plane perpendicular to the acoustic tube axis. The loudspeaker and microphone are arranged such that a projection area of the loudspeaker diaphragm onto the projection plane and a projection area of the microphone onto the projection plane are non-intersecting. The disclosure further provides an in-ear headphone device set including a first and a second in-ear headphone device.

Abstract: A motion sensitive lamp with a coupling mechanism is provided. The motion sensitive lamp is installed on a wall or a ceiling. The motion sensitive lamp at least includes a lamp body, a base and a coupling mechanism. A coupling mechanism includes an engaging structure, a positioning structure and a limiting element. One of the engaging structure and the positioning structure is installed on the lamp body. The other of the engaging structure and the positioning structure is installed on the base. The engaging structure is inserted into the positioning structure, so that the lamp body is locked on or coupled with the base. When an external force is applied to the limiting element, the external force results in a displacement of the limiting element, so that the limiting element is inserted into one of the base and the lamp body.

Abstract: Various embodiments provide a thickness sensor and method for measuring a thickness of discrete conductive features, such as conductive lines and plugs. In one embodiment, the thickness sensor generates an Eddy current in a plurality of discrete conductive features, and measures the generated Eddy current generated in the discrete conductive features. The thickness sensor has a small sensor spot size, and amplifies peaks and valleys of the measured Eddy current. The thickness sensor determines a thickness of the discrete conductive features based on a difference between a minimum amplitude value and a maximum amplitude value of the measured Eddy current.

Abstract: A chemical mechanical planarization (CMP) tool includes a platen and a polishing pad attached to the platen, where a first surface of the polishing pad facing away from the platen includes a first polishing zone and a second polishing zone, where the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, where the first polishing zone and the second polishing zone have different surface properties.

Abstract: Various embodiments provide a thickness sensor and method for measuring a thickness of discrete conductive features, such as conductive lines and plugs. In one embodiment, the thickness sensor generates an Eddy current in a plurality of discrete conductive features, and measures the generated Eddy current generated in the discrete conductive features. The thickness sensor has a small sensor spot size, and amplifies peaks and valleys of the measured Eddy current. The thickness sensor determines a thickness of the discrete conductive features based on a difference between a minimum amplitude value and a maximum amplitude value of the measured Eddy current.

Abstract: In an embodiment, a method includes: performing a self-limiting process to modify a top surface of a wafer; after the self-limiting process completes, removing the modified top surface from the wafer; and repeating the performing the self-limiting process and the removing the modified top surface from the wafer until a thickness of the wafer is decreased to a predetermined thickness.

Abstract: A motion sensitive lamp with a coupling mechanism is provided. The motion sensitive lamp is installed on a wall or a ceiling. The motion sensitive lamp at least includes a lamp body, a base and a coupling mechanism. A coupling mechanism includes an engaging structure, a positioning structure and a limiting element. One of the engaging structure and the positioning structure is installed on the lamp body. The other of the engaging structure and the positioning structure is installed on the base. The engaging structure is inserted into the positioning structure, so that the lamp body is locked on or coupled with the base. When an external force is applied to the limiting element, the external force results in a displacement of the limiting element, so that the limiting element is inserted into one of the base and the lamp body.

Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

Abstract: A slurry dispensing unit for a chemical mechanical polishing (CMP) apparatus is provided. The slurry dispensing unit includes a nozzle, a mixer, a first fluid source, and a second fluid source. The nozzle is configured to dispense a slurry. The mixer is disposed upstream of the nozzle. The first fluid source is connected to the mixer through a first pipe and configured to provide a first fluid including a first component of the slurry. The second fluid source is connected to the mixer through a second pipe and configured to provide a second fluid including a second component of the slurry, wherein the second component is different from the first component.

Abstract: In an embodiment, a method includes: performing a self-limiting process to modify a top surface of a wafer; after the self-limiting process completes, removing the modified top surface from the wafer; and repeating the performing the self-limiting process and the removing the modified top surface from the wafer until a thickness of the wafer is decreased to a predetermined thickness.

Abstract: The present disclosure provides an in-ear headphone device including a loudspeaker having a loudspeaker diaphragm and a microphone, wherein the device is arranged to provide a noise cancelling audio signal to the loudspeaker. The loudspeaker and microphone are acoustically coupled within a device housing, and the device includes an acoustic tube coupling the device to an ear canal of a user. The acoustic tube is associated with an acoustic tube axis defining a projection plane perpendicular to the acoustic tube axis. The loudspeaker and microphone are arranged such that a projection area of the loudspeaker diaphragm onto the projection plane and a projection area of the microphone onto the projection plane are non-intersecting. The disclosure further provides an in-ear headphone device set including a first and a second in-ear headphone device.

Abstract: A post CMP cleaning apparatus is provided. The post CMP cleaning apparatus includes a cleaning stage. The post CMP cleaning apparatus also includes a rotating platen disposed in the cleaning stage, and the rotating platen is configured to hold and rotate a semiconductor wafer. The post CMP cleaning apparatus further includes a vibrating device disposed over the rotating platen. The post CMP cleaning apparatus further includes a solution delivery module disposed near the vibrating device and configured to deliver a cleaning fluid to the semiconductor wafer. The vibrating device is configured to provide the cleaning fluid with a specific frequency which is at least greater than 100 MHz while the rotating platen is rotating the semiconductor wafer, so that particles on the semiconductor wafer are removed by the cleaning fluid.

Abstract: An electronic device includes a substrate, first signal lines, pixel structures, first pads, transmission pads, a first combination circuit board, and a transmission circuit board. The first pads are electrically connected to some of a plurality of first signal lines. The transmission pads are electrically connected to some of the first signal lines. The first combination circuit board is disposed between a first side and a second side of the substrate opposite to each other. The transmission circuit board is disposed between the first combination circuit board and the second side of the substrate. The first combination circuit board is electrically connected to at least some of the first pads, and a first pitch exists between the adjacent first pads. The transmission pads are electrically connected to the transmission circuit board, and a transmission-pad pitch exists between the adjacent transmission pads. The transmission-pad pitch is greater than the first pitch.

Abstract: A compound of formula (I) or a pharmaceutically acceptable salt thereof is provided. In formula (I), Ar is indazole, 5-isoquinoline, 6-isoquinoline, or their N-oxide. X is —C(?Z)—, wherein Z is N—CN, NH, NR4, NCOR4, NCONR4R5, NCO-aryl, S, or O. Y and J are independently H, alkyl, aryl, aminoalkyl, —NH2, —CN, —OH, —O-alkyl, —O-aryl, —COOH, —COOR4, —CONHR4, —CONHCH2-aryl, —CONR4CH2-aryl, —NHCOR4, halogen, halogened alkyl, -alkyl-OR4, -alkyl-ONO2, alkyl-ONO2, —OCOOR4, —O(C?O)-aryl, —CHR4OH, —CH2OH, —CH2O(C?O)-aryl, —CH2O(C?O)—R4, —CHR4O(C?O)-aryl, —CHR4O(C?O)—R4, unsaturated carboxylic ester, substituted alkynyl, —NHSO2R4, —SO2R4, —SO2NHR4, or —SO2NR4R5, or Y and J bond together to form a carbocylic or aromatic ring, wherein R4 and R5 are independently H, substituted C1-C6 alkyl, substituted aryl, cycloalkyl, alkylaryl, -alkyl-NR6R7, —S(O)0-2-(alkyl-NR6R7).

Abstract: A starting device including a housing, a circuit board disposed in the housing, an electromagnetic element, a lever structure and a pressing assembly. A recessed hole is formed on one side of the housing. The circuit board is connected to a power cable. The electromagnetic element is electrically connected to the circuit board. The electromagnetic element includes a coil and a plunger operated by magnetic attraction of the coil. One end of the lever structure is in contact with the plunger. The pressing assembly includes a button cover and a screw rod disposed in the recessed hole. One end of the screw rod is fixedly connected to the button cover, while the other end of the screw rod extends out of the other side of the housing. The screw rod is screwably connected to the other end of the lever structure.

Abstract: The present disclosure provides a wet chemical heating system, including a first conduit for transporting wet chemical, a dispensing head connected to the first conduit, and a radiative heating element configured to heat the wet chemical in the first conduit and positioned at an upper stream of the dispensing head.

Abstract: Various embodiments provide a thickness sensor and method for measuring a thickness of discrete conductive features, such as conductive lines and plugs. In one embodiment, the thickness sensor generates an Eddy current in a plurality of discrete conductive features, and measures the generated Eddy current generated in the discrete conductive features. The thickness sensor has a small sensor spot size, and amplifies peaks and valleys of the measured Eddy current. The thickness sensor determines a thickness of the discrete conductive features based on a difference between a minimum amplitude value and a maximum amplitude value of the measured Eddy current.

Abstract: An electronic device includes a substrate, first signal lines, pixel structures, first pads, transmission pads, a first combination circuit board, and a transmission circuit board. The first pads are electrically connected to some of a plurality of first signal lines. The transmission pads are electrically connected to some of the first signal lines. The first combination circuit board is disposed between a first side and a second side of the substrate opposite to each other. The transmission circuit board is disposed between the first combination circuit board and the second side of the substrate. The first combination circuit board is electrically connected to at least some of the first pads, and a first pitch exists between the adjacent first pads. The transmission pads are electrically connected to the transmission circuit board, and a transmission-pad pitch exists between the adjacent transmission pads. The transmission-pad pitch is greater than the first pitch.

Abstract: A starting device including a housing, a circuit board disposed in the housing, an electromagnetic element, a lever structure and a pressing assembly. A recessed hole is formed on one side of the housing. The circuit board is connected to a power cable. The electromagnetic element is electrically connected to the circuit board. The electromagnetic element includes a coil and a plunger operated by magnetic attraction of the coil. One end of the lever structure is in contact with the plunger. The pressing assembly includes a button cover and a screw rod disposed in the recessed hole. One end of the screw rod is fixedly connected to the button cover, while the other end of the screw rod extends out of the other side of the housing. The screw rod is screwably connected to the other end of the lever structure.