Abstract: In an embodiment, a pattern transfer processing chamber includes a pattern transfer processing chamber and a loading area external to the pattern transfer processing chamber. The loading area is configured to transfer a wafer to or from the pattern transfer processing chamber. The loading area comprises a first region including a loadport, a second region including a load-lock between the first region and the pattern transfer processing chamber, and an embedded baking chamber configured to heat a patterned photoresist on the wafer.

Abstract: A user equipment terminal (UE) in a wireless network calculates a measurement period for measuring the signal-to-interference-plus-noise ratio (SINR) for a serving cell within a frequency range. The calculation is based on a channel measurement resource (CMR) and an interference measurement resource (IMR). The calculation includes evaluation of a sharing factor P, which is a maximum of PCMR of the CMR and PIMR of the IMR. The PCMR and the PIMR are evaluated, at least in part, based on periodicity of the CMR and the IMR in relation to other periodic measurements performed by the UE. The UE performs a channel measurement and an interference measurement using the CMR and the IMR, respectively, over the measurement period. The UE calculates the SINR based on the channel measurement and the interference measurement; and transmits an SINR measurement report indicating the calculated SINR to a base station.

Abstract: A method for forming a semiconductor device is provided. The method for forming a semiconductor device is provided. The method includes coating a photoresist film over a target layer; performing a lithography process to pattern the photoresist film into a photoresist layer; performing a directional ion bombardment process to the photoresist layer, such that a carbon atomic concentration in the photoresist layer is increased; and etching the target layer using the photoresist layer as an etch mask.

Abstract: A centrifugal fan including an impeller housing and an impeller. The impeller housing has an accommodation space, an air inlet and an air outlet. The air inlet and the air outlet are connected to the accommodation space. The impeller is located in the accommodation space. The impeller includes a hub, a plurality of blades, and at least one heat conductive annular portion. The hub is rotatably disposed in the impeller housing. The plurality of blades are connected to an outer circumferential surface of the hub. The at least one heat conductive annular portion is connected to the plurality of blades.

Abstract: In a method of forming a pattern over a semiconductor substrate, a target layer to be patterned is formed over a substrate, a mask pattern including an opening is formed in a mask layer, a shifting film is formed in an inner sidewall of the opening, a one-directional etching operation is performed to remove a part of the shifting film and a part of the mask layer to form a shifted opening, and the target layer is patterned by using the mask layer with the shifted opening as an etching mask. A location of the shifted opening is laterally shifted from an original location of the opening.

Abstract: Provided is a memory device including a stack structure, a first set of vertical channel structures, a second set of vertical channel structures and a first slit. The stack structure is disposed on a substrate, wherein a top surface of the substrate is parallel to a plane defined by a X direction and a Y direction perpendicular to the X direction. The first set of vertical channel structures and the second set of vertical channel structures are arranged along the Y direction and penetrating through the stack structure along a Z direction vertical to the plane to contact the substrate. The first slit is disposed between the first and second sets of vertical channel structures, and penetrates through the stack structure along the Z direction to expose the substrate, wherein the first slit includes a plurality of first sub-slits discretely disposed along the X direction.

Abstract: A method of correcting a misalignment of a wafer on a wafer holder and an apparatus for performing the same are disclosed. In an embodiment, a semiconductor alignment apparatus includes a wafer stage; a wafer holder over the wafer stage; a first position detector configured to detect an alignment of a wafer over the wafer holder in a first direction; a second position detector configured to detect an alignment of the wafer over the wafer holder in a second direction; and a rotational detector configured to detect a rotational alignment of the wafer over the wafer holder.

Abstract: Provided is a memory device including a substrate, a stack structure, a first set of vertical channel structures, a second set of vertical channel structures, and a first slit. The stack structure is disposed on the substrate. The first and second sets of vertical channel structures are arranged along a Y direction and penetrate through the stack structure to contact the substrate. The first slit is disposed between the first and second sets of vertical channel structures, and penetrates through the stack structure to expose the substrate. The first slit includes a plurality of first sub-slits discretely disposed along a X direction.

Abstract: A heat dissipation system includes a single fan, first and second heat sources, first, second, and third heat pipes, and first and second heat dissipation arrays. The first heat pipe is thermally coupled with the first heat source. The second heat pipe is thermally coupled with the second heat source. The third heat pipe has a first position thermally coupled with the first heat pipe and a second position thermally coupled with the second heat pipe. The first heat dissipation array is arranged around the first position and thermally coupled with the third heat pipe. The second heat dissipation array is arranged around the second position and thermally coupled with the third heat pipe. The single fan is between the first and second heat sources, and configured to blow airflows towards the first and second heat sources, the first and second heat dissipation arrays.

Abstract: A three-dimensional memory device and a method of manufacturing a three-dimensional memory device are provided. The method includes providing a precursor structure including a substrate, a multi-layered stack, a plurality of vertical channel pillars and a barrier structure. A first slit and a second slit are then formed in the multi-layered stack and the substrate along a first direction, in which the first slit and the second slit have a pitch between thereof, and the second slit cuts the barrier structure. A portion of the second insulating layers is then replaced with a plurality of conductive layers. A first slit structure and a second slit structure are then formed in the first slit and the second slit, in which the first slit structure and the second slit structure separate the vertical channel pillars in a second direction that is different from the first direction.

Abstract: The present disclosure provides a card shaped mobile payment device, which includes a card shaped casing and an offline payment execution module configured for executing an offline payment operation and disposed in the card shaped casing. The offline payment execution module includes a display module, a security chip, an antenna unit and a central control unit. The display module is used for displaying card information; the security chip is used for generating a token information, which is time-sensitive, and executing a transaction procedure. The antenna unit is electrically connected to the security chip for providing the token information to a transaction device. The central control unit activates the security chip according to a received identity authentication result, and provides a card index information corresponding to the card information to the security chip, so as to access a stored card credential and generate the token information.

Abstract: The present disclosure provides a card shaped mobile payment device, which includes a card shaped casing and an offline payment execution module configured for executing an offline payment operation and disposed in the card shaped casing. The offline payment execution module includes a display module, a security chip, an antenna unit and a central control unit. The display module is used for displaying card information; the security chip is used for generating a token information, which is time-sensitive, and executing a transaction procedure. The antenna unit is electrically connected to the security chip for providing the token information to a transaction device. The central control unit activates the security chip according to a received identity authentication result, and provides a card index information corresponding to the card information to the security chip, so as to access a stored card credential and generate the token information.

Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.

Abstract: A connector assembly for mounting a chip module to a printed circuit board (PCB) includes: a seating mechanism including a socket connector, a metallic seat frame, and a metallic load plate; a back plate; and plural fasteners extending through the seating mechanism, the PCB, and the back plate to fasten the seating mechanism and the back plate on two opposite sides of the PCB, wherein the back plate has a curved inner region and a flat outer region and the fasteners extend through the flat outer region of the back plate.

Abstract: A semiconductor process system includes an ion source configured to bombard with a photoresist structure on a wafer. The semiconductor process system reduces a width of the photoresist structure by bombarding the photoresist structure with ions in multiple distinct ion bombardment steps having different characteristics.

Abstract: The current disclosure includes a plasma etching system that includes a movable plasma source and a moveable wafer stage. A relative position between the movable plasma source and the movable wafer stage can be varied to set up an angle along which plasma particles of the plasma hits a wafer positioned on the wafer stage.

Abstract: A foldable electronic device includes a first housing, a second housing, a pivot structure, a heat conducting member, a first heat pipe and a second heat pipe. The pivot structure pivotally connects the first housing to the second housing. The heat conducting member is disposed in the pivot structure. An end of the first heat pipe is pivotally connected to the heat conducting member and another end of the first heat pipe is fixed on the first housing. An end of the second heat pipe is pivotally connected to the heat conducting member and another end of the second heat pipe is fixed on the second housing.

Abstract: A 3D recording and playing method is applied to a laptop which has sound receiving elements and two audio output elements. The 3D recording and playing method comprises receiving input signals by the sound receiving elements, localizing and separating the input signals so as to obtain preliminarily processed signals, filtering each of the preliminarily processed signal using a head related transfer function to generate a left channel signal and a right channel signal, generating a left channel signal set according to the left channel signal corresponding to each of the preliminarily processed signals, and generating a right channel signal set according to the right channel signal corresponding to each of the preliminarily processed signals, and outputting the left channel signal set and the right channel signal set by the two audio output elements respectively.

Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.

Abstract: Provided is a memory device including a substrate, a stack structure, a first set of vertical channel structures, a second set of vertical channel structures, and a first slit. The stack structure is disposed on the substrate. The first and second sets of vertical channel structures are arranged along a Y direction and penetrate through the stack structure to contact the substrate. The first slit is disposed between the first and second sets of vertical channel structures, and penetrates through the stack structure to expose the substrate. The first slit includes a plurality of first sub-slits discretely disposed along a X direction.