Abstract: A carrier assembly (100) comprises an IC package (200) and a carrier (300) for positioning the IC package (200), the IC package (200) includes a body portion (22), a die portion (21) extending upwardly from the body portion (22) and a ear portion (232) extending from the die portion (21), the ear portion (232) and the body portion (22) defines a space (231), the carrier (300) includes a first side (310), a second side (312) opposite to the first side (310), a position portion (343) extending from the first side (310) and a fixing portion (331) extending from the second side (312) positioned in the space (231) of the IC package (200) to position the IC package (200) on the carrier (300).

Abstract: A holding device for an electrical connector, includes a frame with an opening defined on a center thereof A first locking portion is disposed on the frame and extends into the opening. A second locking portion has a main body with an elastic arm. The main body defines a fixed end fixed to the frame and an active end rotating around the fixed end.

Abstract: A fan blade structure includes a hub, an annular partition surrounding the hub, a first blade group and a second blade group. The hub has a top surface and a flank connected to the top surface. The first blade group, disposed on one side of the annular partition, includes two blade arrays having multiple first and second blades respectively. The clearance between the two adjacent first blades is less than that between the two adjacent second blades. The second blade group, disposed on another side of the annular partition, includes another two blade arrays having a plurality of third and fourth blades respectively. The clearance between the two adjacent third blades is less than that between the two fourth blades adjacent to each other.

Abstract: A heat dissipation module includes multiple heat sink fins. The heat sink fins are assembled to one another along an assembly axis, and each of the heat sink fins includes a main body and an extension plate. The extension plate extends from one side of the main body towards an opposite side of the main body. An acute angle is formed between the extension plate and the main body. Each of the extension plates is located between the main bodies of the two heat sink fins adjacent to each other.

Abstract: An electronic device comprises a case having an air ventilation hole and an opening, a heat source, a radiator disposed inside the case and in thermal contact with the heat source, and an air current generator. The radiator comprises a body having a first and second lateral sides, and a third lateral side disposed therebetween. A first air inlet is disposed on the first lateral side. An air outlet exposed by the opening is disposed on the second lateral side, and a second air inlet is disposed on the third lateral side. The body comprising fins and a geometrical middle side of the fins is between the first and second lateral sides. The second air inlet corresponding to the air ventilation hole is between the geometrical middle side and the first lateral side. An air exhausting hole of the air current generator faces the first air inlet.

Abstract: A heat conduction element comprises a pressing portion and extending portions. A pressing side of the pressing portion is in thermal contact with a heat generating element. Each of the extending portions has a first end connected to the pressing portion and a second end away from the pressing portion. Each of the extending portions has a first surface facing the direction same as that of the pressing side and an oppositely disposed second surface. Each of the second ends has a fixing portion. At least one slot is formed between each of the extending portions and the pressing portion. The slot penetrates the first surface and the second surface. The shortest straight distance between each of the fixing portions and the pressing portion is smaller than or equal to the length extended from the first end to the second end of the extending portion.

Abstract: An electronic device includes a case, a heat source, a radiator, and an air stream generator. The case has an air ventilation hole and an opening. The radiator is disposed in the case and in thermal contact with the heat source. The radiator includes a main body having a first, a second, and a third side surface. A first air inlet, an air outlet, and a second air inlet are disposed on the first side surface, the second side surface, and the third side surface, respectively. The third side surface and the case are separated by a distance from each other. The second air inlet is disposed between a geometric middle plane of fins of the main body and the second side surface. The distance between the second air inlet and the first side surface is greater than that between the air ventilation hole and the first side surface.

Abstract: A network audio testing system and a network audio testing method thereof for testing the performance of a network communication system during communication are disclosed. The system includes a processing system and a sound simulation device. The processing system is for generating a near-end simulation signal and a far-end simulation signal. The sound simulation device is for receiving and making a near-end simulation sound. The near-end simulation sound is received by a microphone of the network communication system to generate a first test signal. The processing system further simultaneously makes the sound simulation device sounding the near-end simulation sound and a speaker sounding a far-end simulation sound to obtain a second test signal. The processing system compares the first and the second test signal to obtain an attenuation degree of the near-end simulation signal and a residual energy of the far-end simulation signal.

Abstract: A network audio testing system and a network audio testing method thereof for testing the performance of a network communication, system during communication are disclosed. The system includes a processing system and a sound simulation device. The processing system is for generating a near-end simulation signal and a far-end simulation signal. The sound simulation device is for receiving and making a near-end simulation sound. The near-end simulation sound is received by a microphone of the network communication system to generate a first test signal. The processing system further simultaneously makes the sound simulation device sounding the near-end simulation sound and a speaker sounding a far-end simulation sound to obtain a second test signal. The processing system compares the first and the second test signal to obtain an attenuation degree of the near-end simulation signal and a residual energy of the far-end simulation signal.

Abstract: A method for testing heat pipes includes the following steps. A plurality of bar-shaped heat pipes having the same size is provided, and the heat pipes are deformed. The deformed heat pipes are placed in a temperature regulator, such that a temperature of the heat pipes is periodically changed between a first temperature and a second temperature. The heat pipes are then taken out of the temperature regulator. One end of each heat pipe is maintained at a third temperature by a thermostatic device, and a heat pipe temperature difference of two opposite ends of the heat pipe is measured. The heat pipes having the heat pipe temperature difference greater than a standard temperature difference in the heat pipes are marked.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: To provide a catalyst, which is formed from a perovskite oxide, for thermochemical fuel production, and a method of producing fuel using thermochemical fuel production that is capable of allowing a fuel to be produced in a thermochemical manner. Provided is a catalyst for thermochemical fuel production, which is used for producing the fuel from thermal energy by using a two-step thermochemical cycle of a first temperature and a second temperature that is equal to or lower than the first temperature, wherein the catalyst is formed from a perovskite oxide having a compositional formula of AXO3±? (provided that, 0???1). Here, A represents one or more of a rare-earth element (excluding Ce), an alkaline earth metal element, and an alkali metal element, X represents one or more of a transition metal element and a metalloid element, and O represents oxygen.

Abstract: An electronic device comprises a casing, a heat generation source, an airflow guiding structure, and a jet flow generator. The casing includes an interior space. The airflow guiding structure is in contact with the heat generation source and has one air inlet. The jet flow generator, the heat generation source, and the airflow guiding structure together are situated within the interior space. The jet flow generator includes a nozzle which directs toward the air inlet of the airflow guiding structure at a distance apart. Airflows emitted by the jet flow generator through the nozzle travel at a velocity greater than 0.1 meters/second (m/s), causing a fluid pressure differential with the neighboring air and pulling air in the vicinity along the air inlet into the airflow guiding structure.

Abstract: An electronic device is provided. The electronic device includes a mechanism, a circuit module and a fixing element. The circuit module is disposed inside the mechanism. The circuit module includes a circuit board and a fan. The circuit board has at least one edge and a fixing hole. The fan has a first lateral side and a second lateral side. The first lateral side has a first hook buckled on the edge. The second lateral side has at least one screwed board, wherein the screwed board has a screwed hole. The fixing element is screwed on the screwed hole and the fixing hole to screw the fan on the circuit board.

Abstract: A contact includes an upper contact having a planar main board with a plurality of blocks, a lower contact, and a spring. The lower contact includes a first spring arm and a second spring arm which are positioned at opposite sides of the main board of the upper contact. Only the second spring arm defines a recess to receive corresponding block of the upper contact. The spring is fitted over a predetermined area between the upper and the lower contact.

Abstract: An electronic device is provided. The electronic device includes a mechanism, a circuit module and a fixing element. The circuit module is disposed inside the mechanism. The circuit module includes a circuit board and a fan. The circuit board has at least one edge and a fixing hole. The fan has a first lateral side and a second lateral side. The first lateral side has a first hook buckled on the edge. The second lateral side has at least one screwed board, wherein the screwed board has a screwed hole. The fixing element is screwed on the screwed hole and the fixing hole to screw the fan on the circuit board.

Abstract: A contact includes an upper contact having a planar main board with a plurality of blocks, a lower contact, and a spring. The lower contact includes a first spring arm and a second spring arm which are positioned at opposite sides of the main board of the upper contact. Only the second spring arm defines a recess to receive corresponding block of the upper contact. The spring is fitted over a predetermined area between the upper and the lower contact.

Abstract: An IC socket includes a driving member, a socket body mounted below the driving member and a latch member assembled to the base. The driving member is operated between an upper position and a lower position, and drives the latch member to shift between a closed position and an opened position. The base is assembled with a detachable latch hinge, to which the latch member is pivotally attached. The latch hinge can be easily replaced with another proper one according to a thickness of the IC package to the received in the IC socket.

Abstract: An electrical connector contact comprises an upper and lower contact pins and a spring device disposed between the upper and lower contact pins. The upper contact pin includes a main portion, two pair of stopping portions respectively projecting from two sides of the main portion, and two guiding slots each formed between two stopping portions located at a same side of the main portion. The lower contact pin has a pair of elastic arms directly made from lacerating and bending a metallic plate and received in the guiding slots, a pair of clamping portions clamping the main portion, and two hooks abutting against the stopping portions to prevent the upper and lower contact pins separating from each other.

Abstract: An electrical connector contact comprises an upper and lower contact pins and a spring device disposed between the upper and lower contact pins. The upper contact pin includes a main portion, two pair of stopping portions respectively projecting from two sides of the main portion, and two guiding slots each formed between two stopping portions located at a same side of the main portion. The lower contact pin has a pair of elastic arms directly made from lacerating and bending a metallic plate and received in the guiding slots, a pair of clamping portions clamping the main portion, and two hooks abutting against the stopping portions to prevent the upper and lower contact pins separating from each other.