Abstract: A slurry tank autocleaner for cleaning an empty slurry tank. A first pipe is inserted in the interior of the slurry tank, where the first pipe has an open end located inside the slurry tank. A first nozzle is disposed on the open end of the first pipe. A cover is used to cover the slurry tank, where the cover has a plurality of second nozzles targeting the slurry tank. A second pipe is connected to the second nozzles. A controller is used to control chemical, pure water or dry gas to spurt from the first nozzle and the second nozzles through the first pipe and the second pipe. Thus, the slurry tank can be automatically cleaned.

Abstract: A CMP (chemical mechanical polishing) apparatus having a measuring device for measuring a guide ring. A polishing table is provided. A wafer loading/unloading device is located at a first side of the polishing table. A measuring device is located at a second side of the polishing table. A carrier having a first lateral and a second lateral opposite the first lateral, wherein the first lateral faces the polishing table, the wafer loading/unloading device or the measuring device. A guide ring is disposed on the first lateral of the carrier. A transfer device is disposed on the second lateral of the carrier and connected to the carrier, wherein the transfer device is used to move the carrier onto the polishing table, the wafer loading/unloading device or the measuring device. The measuring device is used to automatically and immediately measure the severity of scoring on the guide ring.

Abstract: A device used for detecting the clamping force of a processed object and a method thereof are proposed. The device comprises a detection unit, a basis component and a pressure detection component disposed on the basis component. The basis component having the pressure detection component is closely placed between pivotal rods so that the detection unit can detect variation of electric properties of the pressure detection component to adjust the spacing between the pivotal rods, hence facilitating adjustment of the clamping force.

Abstract: A device used for detecting the clamping force of a processed object and a method thereof are proposed. The device comprises a detection unit, a basis component and a pressure detection component disposed on the basis component. The basis component having the pressure detection component is closely placed between pivotal rods so that the detection unit can detect variation of electric properties of the pressure detection component to adjust the spacing between the pivotal rods, hence facilitating adjustment of the clamping force.

Abstract: A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

Abstract: A method and apparatus for real-time detection of wafer defects. A method for real-time detection of wafer defects comprises the steps of providing a desired wafer before or after a predetermined fabrication step and obtaining optical information thereof and comparing and analyzing the optical information of the desired wafer with corresponding reference information for instantaneously detecting possible wafer defects, wherein a predetermined action is performed upon detection of wafer defects.

Abstract: The present invention provides an apparatus for detecting flaws in a wafer. The apparatus has a detection platform for holding a wafer positioned thereon, a cross-bar ultrasonic detection device positioned above the detection platform for emitting and receiving an ultrasonic wave reflected by a wafer; and a microprocessor for processing the reflected ultrasonic and transmits to a monitor.

Abstract: A humidity sensor and fabrication method thereof. In the humidity sensor of the present invention, two comb-type electrodes with a plurality of teeth are disposed on a semiconductor substrate. A SiO2 sensing film is disposed between the teeth of the two comb-type electrodes on the substrate. A predetermined voltage is applied between the two comb-type electrodes, a leakage current between the two electrodes is detected, and the humidity in the environment is measured according thereto.

Abstract: A pumping system. The pumping system has a cylinder pump, a first group of switching devices, and a second group of switching devices. The first group of switching devices enable the cylinder pump to pump the liquid by feeding the gas provided by the gas source into the cylinder pump through a first ventilator according to a first enabling signal, and the second group of switching devices enable the cylinder to output the liquid by feeding the gas provided by the gas source into the cylinder pump through a second ventilator according to a second enable signal.

Abstract: A method of measuring pore depth on the surface of a polishing pad during processing. In the present invention, a planar ultrasound sensing device is disposed a predetermined distance above the surface of a polishing pad. The planar ultrasound sensing device sends out a plurality of ultrasound signals to the surface and the pores therein, and receives a plurality of reflected signals from the pad surface and constituent pores. The difference between pore depth and the surface is determined to establish first depth difference data according to the time delay in the reflected signals. The polishing pad is rotated to obtain second to Nth depth difference data. A relational image relative to the surface and the pores of the polishing pad is obtained according to the first to Nth depth difference data.

Abstract: An in-line oscillating device is essentially composed of an oscillating tank, an oscillating pipe, and an oscillating generator. The oscillating pipe is set in the oscillating tank and connects with a slurry pipe. The oscillating generator for generating ultrasonic waves is mounted on the oscillating tank. Furthermore, the oscillating tank is filled with a medium to transmit the ultrasonic waves generated by the oscillating generator to the oscillating pipe. The in-line oscillating device is suitable to be mounted on any location of the slurry pipe where oscillation is needed.

Abstract: A guide ring removal device. The guide ring removal device includes a column press, a first disc, a second disc, and a plurality of fasteners. The first disc is disposed on the column press. The second disc is disposed on a point of the column press to exert force on a carrier. The plurality of fasteners is disposed on the first disc, the fasteners grasping the guide ring. As the second disc exerts the primary force on the carrier, the fasteners generate reciprocal force on the guide ring, thus separating the guide ring. Engagement of the column press alters the distance between the first disc and the second disc, and the primary force is exerted on the carrier.

Abstract: A guide ring removal device. The guide ring removal device includes a column press, a first disc, a second disc, and a plurality of fasteners. The first disc is disposed on the column press. The second disc is disposed on a point of the column press to exert force on a carrier. The plurality of fasteners is disposed on the first disc, the fasteners grasping the guide ring. As the second disc exerts the primary force on the carrier, the fasteners generate reciprocal force on the guide ring, thus separating the guide ring. Engagement of the column press alters the distance between the first disc and the second disc, and the primary force is exerted on the carrier.

Abstract: A cleaning roller. The roller comprises a shaft, a sponge sleeve, and an inflatable chamber. The sponge sleeve encloses the shaft, and the inflatable chamber is disposed between the shaft and the sponge sleeve. A central portion of the inflatable chamber is thicker than the ends of the inflatable chamber. The inflatable chamber is of elastic materials. By introducing a working flow into the inflatable chamber, the thickness of the central portion of the inflatable chamber can be adjusted.

Abstract: A slurry homogenizer. A frame having an outlet is disposed on a driving means having a rotating shaft. A waterproof plate having a first opening is disposed in the frame and on the driving means. Part of the shaft penetrates the first opening. A filter is disposed in the frame and on the plate. A first grinding pad has a second opening and is fitted on the shaft through the second opening. The first grinding pad is disposed in the frame and above the plate. A knob is fitted on the top of the shaft. The knob fixes the first grinding pad on the shaft. A cover having a pipe is disposed on the frame. A second grinding pad having a third opening is fitted on the pipe and disposed in the frame. The second grinding pad and the first grinding pad are separated by a fixed distance.

Abstract: A humidity sensor and fabrication method thereof. In the humidity sensor of the present invention, two comb-type electrodes with a plurality of teeth are disposed on a semiconductor substrate. A SiO2 sensing film is disposed between the teeth of the two comb-type electrodes on the substrate. A predetermined voltage is applied between the two comb-type electrodes, a leakage current between the two electrodes is detected, and the humidity in the environment is measured according thereto.

Abstract: A portable liquid level detector. The detector comprises a portable casing, a power supply unit disposed in the portable casing, a sensing device coupled to the power supply unit to sense a capacitance within a container and to output a enable signal when a difference in the capacitance is detected, a light emission device coupled to the sensing unit that illuminates after receiving the enable signal, and an alarm device coupled to the sensing unit that sounds after receiving the enable signal.

Abstract: A polishing pad showing intrinsic abrasion automatically during processing. In the pad of the present invention, a polishing substrate has a first surface, a first index a first predetermined distance from the first surface, a second index a second predetermined distance from the first surface, and a third index a third predetermined distance from the first surface, wherein the third predetermined distance exceeds the second predetermined distance, and the second predetermined distance exceeds the first predetermined distance. The polishing pad shows the first pattern when abrasion from the first surface exceeds the first predetermined distance, and shows the first and second patterns when abrasion from the first surface exceeds the second predetermined distance. The first, second and third patterns appear when abrasion from the first surface exceeds the third predetermined distance.

Abstract: A method of measuring pore depth on the surface of a polishing pad during processing. In the present invention, a planar ultrasound sensing device is disposed a predetermined distance above the surface of a polishing pad. The planar ultrasound sensing device sends out a plurality of ultrasound signals to the surface and the pores therein, and receives a plurality of reflected signals from the pad surface and constituent pores. The difference between pore depth and the surface is determined to establish first depth difference data according to the time delay in the reflected signals. The polishing pad is rotated to obtain second to Nth depth difference data. A relational image relative to the surface and the pores of the polishing pad is obtained according to the first to Nth depth difference data.

Abstract: A piping apparatus. The piping apparatus comprises a first pipe, a second pipe, and a nozzle. An end of the second pipe is disposed in the first pipe. The nozzle with a plurality of holes is connected to the end of the second pipe in the first pipe. The piping apparatus is utilized to mix an admixture to a carrier fluid. The admixture is ejected from the second pipe through the plurality of holes to the carrier fluid in the first pipe.