Abstract: A wafer carrier device capable of detecting positioning precision of a supporting plate thereof. In the present invention, a supporting plate connected to a mechanical arm has three reflectors and a positioning window. A detection device has a vertical signal generator to output a vertical alignment signal to a vertical signal receiver, and three level detectors to each output a second signal to the corresponding reflector respectively and receive a corresponding reflected level detection signal from the corresponding reflector. A determining unit determines whether the supporting plate is aligned with the vertical signal receiver according to the vertical alignment signal. The determining unit outputs a position rectification signal when the supporting plate is not aligned with the vertical signal receiver. A driver moves the supporting plate by mechanical arm to align the vertical signal receiver according to the position rectification signal.

Abstract: A CMP (chemical mechanical polishing) apparatus having a measuring device for measuring a guide ring. A polishing table is provided. A wafer loading/unloading device is located at a first side of the polishing table. A measuring device is located at a second side of the polishing table. A carrier having a first lateral and a second lateral opposite the first lateral, wherein the first lateral faces the polishing table, the wafer loading/unloading device or the measuring device. A guide ring is disposed on the first lateral of the carrier. A transfer device is disposed on the second lateral of the carrier and connected to the carrier, wherein the transfer device is used to move the carrier onto the polishing table, the wafer loading/unloading device or the measuring device. The measuring device is used to automatically and immediately measure the severity of scoring on the guide ring.

Abstract: A wafer holder in a robot blade. A holder plate having a front end is provided. At least one sensor is disposed at the front end of the holder plate. A sensing circuit is connected to the sensor, wherein the sensing circuit determines the presence or absence of an obstruction positioned immediately ahead of the holder plate. Thus, the wafer holder is capable of avoiding contact with obstructions, thereby preventing system crash during semiconductor manufacturing process.

Abstract: A slurry homogenizer. A frame having an outlet is disposed on a driving means having a rotating shaft. A waterproof plate having a first opening is disposed in the frame and on the driving means. Part of the shaft penetrates the first opening. A filter is disposed in the frame and on the plate. A first grinding pad has a second opening and is fitted on the shaft through the second opening. The first grinding pad is disposed in the frame and above the plate. A knob is fitted on the top of the shaft. The knob fixes the first grinding pad on the shaft. A cover having a pipe is disposed on the frame. A second grinding pad having a third opening is fitted on the pipe and disposed in the frame. The second grinding pad and the first grinding pad are separated by a fixed distance.

Abstract: A slurry tank autocleaner for cleaning an empty slurry tank. A first pipe is inserted in the interior of the slurry tank, where the first pipe has an open end located inside the slurry tank. A first nozzle is disposed on the open end of the first pipe. A cover is used to cover the slurry tank, where the cover has a plurality of second nozzles targeting the slurry tank. A second pipe is connected to the second nozzles. A controller is used to control chemical, pure water or dry gas to spurt from the first nozzle and the second nozzles through the first pipe and the second pipe. Thus, the slurry tank can be automatically cleaned.

Abstract: A portable liquid level detector. The detector comprises a portable casing, a power supply unit disposed in the portable casing, a sensing device coupled to the power supply unit to sense a capacitance within a container and to output a enable signal when a difference in the capacitance is detected, a light emission device coupled to the sensing unit that illuminates after receiving the enable signal, and an alarm device coupled to the sensing unit that sounds after receiving the enable signal.

Abstract: A pumping system. The pumping system has a cylinder pump, a first group of switching devices, and a second group of switching devices. The first group of switching devices enable the cylinder pump to pump the liquid by feeding the gas provided by the gas source into the cylinder pump through a first ventilator according to a first enabling signal, and the second group of switching devices enable the cylinder to output the liquid by feeding the gas provided by the gas source into the cylinder pump through a second ventilator according to a second enable signal.

Abstract: An in-line oscillating device is essentially composed of an oscillating tank, an oscillating pipe, and an oscillating generator. The oscillating pipe is set in the oscillating tank and connects with a slurry pipe. The oscillating generator for generating ultrasonic waves is mounted on the oscillating tank. Furthermore, the oscillating tank is filled with a medium to transmit the ultrasonic waves generated by the oscillating generator to the oscillating pipe. The in-line oscillating device is suitable to be mounted on any location of the slurry pipe where oscillation is needed.