Abstract: An inductive component and a method for fabricating the same are provided. The method includes: filling a mold with a first magnetic powder to form a base layer; forming a cavity in the base layer; inserting a coil corresponding to the cavity; filling the mold with a second magnetic powder to form a cover layer, in which the cover layer fills a space between the cavity and the corresponding coil and covers the base layer and the coil; executing a compression molding process to form a to-be-sliced package and taking the to-be-sliced package out; slicing the to-be-sliced package to obtain a to-be-packaged body; and forming a protective layer and an electrode part electrically connected to the coil on a surface of the to-be-packaged body.

Abstract: A method of forming a semiconductor device is provided. The method includes mounting a semiconductor die on a die pad of a leadframe. The die pad includes a central opening configured to expose a central portion of the semiconductor die. A first end of a bond wire is attached to a bond pad of the semiconductor die and a second end of the bond wire is attached to a lead of the leadframe. An encapsulant encapsulates the semiconductor die and the leadframe. A portion of the lead and a portion of the die pad are exposed and protruded through the encapsulant.

Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.

Abstract: A centering vice is provided, including: a base, a clamp assembly and an adjusting assembly. The base includes a sliding groove extending in a first direction and a first abutting portion. The clamp assembly includes a first jaw portion and a second jaw portion. The adjusting assembly includes a threaded rod, a positioning member and two adjusting members. The threaded rod includes a first threaded segment, a second threaded segment and a positioning portion. The positioning member is immovably connected to the positioning portion and disposed between the two adjusting members, and the two adjusting members respectively have a second abutting portion abutted against the first abutting portion. The two adjusting members are movable relative to the base in a second direction lateral to the first direction to urge the positioning member to move in the first direction.

Abstract: A charge pump of a phase-locked loop (PLL) circuit includes a current source circuit, a current sink circuit, and a biasing circuit. The biasing circuit includes a current digital-to-analog converter (IDAC) and a low-pass filter (LPF). The IDAC provides a reference current in response to a current value setting, wherein a first voltage is established due to the reference current. The LPF applies low-pass filtering to the first voltage to generate a filter output as a second voltage, wherein bias voltages of the current source circuit and the current sink circuit are controlled by the second voltage.

Abstract: An immersion cooling system includes a cooling tank, a housing and a valve. The coolant tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The housing covers a side of the cooling tank and thereby forms an enclosure. The valve has two ports, one of which communicates with the enclosure and the other communicates with a part of the cooling tank above the liquid coolant. The valve is configured to open in response to a gas pressure inside the cooling tank exceeding an upper limit.

Abstract: A clock control circuit, a memory storage device, and a clock control method are disclosed. The method includes: tracking a frequency of a first signal from a host system; generating, in a first mode, a clock signal according to the frequency of the first signal; and generating, in a second mode, the clock signal without reference to the frequency of the first signal.

Abstract: The present invention provides an isolated power supply having a fast output response, comprising an isolated power supply and a control unit. The isolated power supply includes a primary side power-stage unit, a secondary side power-stage unit, and an isolation transformer, and the control unit includes a primary side control unit, a secondary side control unit, and a photo-coupling isolation unit.

Abstract: An environment-friendly cartridge is provided. The environment-friendly cartridge includes a body portion. The body portion has two end surfaces and an annular side surface connected to the two end surfaces. The body portion is composed of a smoke generating material. A plurality of gas communication structures are formed on the body portion. A plurality of openings in communication with the plurality of gas communication structures are formed on the two end surfaces. A pressure drop between 30 millimeters of water and 300 millimeters of water exists between the two end surfaces of the environment-friendly cartridge. The cartridge includes no filter and no cigarette paper, can be harmlessly degraded, and is environmentally friendly.

Abstract: A radio frequency (RF) tamper detector of an electronic device can offer improved chassis intrusion monitoring to protect the device from software and hardware-based tampering. The tamper detector can monitor RF noise levels in a first frequency band and in a second frequency band to calculate an RF noise level moving average for each frequency band. If the moving averages in both frequency bands exceed a RF noise threshold, the tamper detector can set a cover removal flag to indicate that a cover of the device housing has been removed. The tamper detector can cause the electronic device to lock or disable a system BIOS when cover removal is detected. Additionally, the electronic device can notify remote monitoring systems (e.g., operated by an IT administrator or warranty support center) to receive additional instructions to secure the device.

Abstract: A method of controlling a wafer stage includes moving the wafer stage to position an immersion hood over a first sensor in the wafer stage. The method further includes moving the wafer stage to position the immersion hood over a second sensor in the wafer stage. The method further includes moving the wafer stage to position the immersion hood over a first particle capture area on the wafer stage after moving the wafer stage to position the immersion hood over the second sensor. The method further includes moving the wafer stage to define a routing track over the first particle capture area. The method further includes moving the wafer stage to position the immersion hood over an area for receiving a wafer on the wafer stage after defining the routing track over the first particle capture area.

Abstract: A circuit, including: a photodetector including a first readout terminal and a second readout terminal different than the first readout terminal; a first readout circuit coupled with the first readout terminal and configured to output a first readout voltage; a second readout circuit coupled with the second readout terminal and configured to output a second readout voltage; and a common-mode analog-to-digital converter (ADC) including: a first input terminal coupled with a first voltage source; a second input terminal coupled with a common-mode generator, the common-mode generator configured to receive the first readout voltage and the second readout voltage, and to generate a common-mode voltage between the first and second readout voltages; and a first output terminal configured to output a first output signal corresponding to a magnitude of a current generated by the photodetector.

Abstract: An antenna structure is disposed on a metal case. The metal case includes a surface. The antenna structure includes a slot and a metal unit. The slot is formed on the surface along a direction. The metal unit is disposed on the metal case. The metal unit includes at least one blocking part. The at least one blocking part is in contact with the surface, extended toward and crossed over the slot to separate the slot into a plurality of slot paths.

Abstract: A method of manufacturing a semiconductor device includes forming a fin structure over a substrate, forming a sacrificial gate structure over the fin structure, and etching a source/drain (S/D) region of the fin structure to form an S/D recess. The fin structure includes first semiconductor layers and second semiconductor layers alternately stacked. The method further includes depositing an insulating dielectric layer in the S/D recess, depositing an etch protection layer over a bottom portion of the insulating dielectric layer, and partially removing the insulating dielectric layer. The method further includes growing an epitaxial S/D feature in the S/D recess. The bottom portion of the insulating dielectric layer interposes the epitaxial S/D feature and the substrate.

Abstract: A composite tray includes a tray body and an external supporting member. The tray body includes a loading plate and a plurality of side walls. The side walls protrude from the loading plate. The side walls and the loading plate jointly form an accommodating groove, and the accommodating groove has an opening. The external supporting member includes a supporting plate and a plurality of assembly members. The supporting plate is located in the accommodating groove and divides the accommodating groove into an inner space and an outer space. The inner space is located between the supporting plate and the loading plate. The outer space is located between the opening and the supporting plate. The assembly members are connected around the supporting plate and respectively assembled to the side walls, and a thickness of the supporting plate is less than a thickness of the loading plate.

Abstract: An exhaust structure includes a piping section, wherein the piping section has a first inner diameter in a central region of the piping section, the piping section has a second diameter in at least one of an inlet or an outlet, and the second diameter has a same value as the first inner diameter. The exhaust structure further includes a plurality of smoothing layers configured to resist turbulence and condensation produced by a flow of one or more gasses in the piping section.

Abstract: Various embodiments of the present application are directed towards an integrated circuit (IC) in which a shield structure blocks the migration of charge to a semiconductor device from proximate a through substrate via (TSV). In some embodiments, the IC comprises a substrate, an interconnect structure, the semiconductor device, the TSV, and the shield structure. The interconnect structure is on a frontside of the substrate and comprises a wire. The semiconductor device is on the frontside of the substrate, between the substrate and the interconnect structure. The TSV extends completely through the substrate, from a backside of the substrate to the wire, and comprises metal. The shield structure comprises a PN junction extending completely through the substrate and directly between the semiconductor device and the TSV.

Abstract: A thermal module for being disposed in an electronic device comprises a driving device and at least one thermal device. The driving device includes a driving member and a driven member which are connected together, wherein the driving member is adapted to drive the driven member to operate. The at least one thermal device includes a fan, wherein two opposite ends of the fan respectively have a mating portion and a connecting portion. The mating portion is adapted to be connected to the driven member, so that the driving member drives the driven member to drive the fan to rotate. The connecting portion of the fan is adapted to be connected to the mating portion of a fan of another thermal device, so that when the driving member drives the fan to rotate, the fan drives the fan of the another thermal device to rotate.

Abstract: An example electronic device includes a network communication interface to connect to a conference server, a central control device communication interface to connect to a local central control device, a microphone and a processor. The processor is to receive audio at the microphone and send the audio to the local central control device and to the conference server. The processor is to send the audio to the local central control device such that it is received by a nearby electronic device before the audio is received from the conference server by the nearby electronic device.

Abstract: In some embodiments, the present disclosure relates to an integrated device, including a substrate; an interconnect structure disposed over the substrate, the interconnect structure including an dielectric; a first bottom electrode structure disposed in the dielectric, the first bottom electrode structure having a first width as measured between outer sidewalls of the first bottom electrode structure and a first depth as measured from an upper surface of the dielectric; and a second bottom electrode structure disposed in the dielectric and spaced apart from the first bottom electrode structure, the second bottom electrode structure having a second width as measured between outer sidewalls of the second bottom electrode structure and a second depth as measured from the upper surface of the dielectric; where the first width is greater than the second width and the first depth is greater than the second depth.