Abstract: A method of manufacturing a semiconductor device includes forming a fin structure over a substrate, forming a sacrificial gate structure over the fin structure, and etching a source/drain (S/D) region of the fin structure to form an S/D recess. The fin structure includes first semiconductor layers and second semiconductor layers alternately stacked. The method further includes depositing an insulating dielectric layer in the S/D recess, depositing an etch protection layer over a bottom portion of the insulating dielectric layer, and partially removing the insulating dielectric layer. The method further includes growing an epitaxial S/D feature in the S/D recess. The bottom portion of the insulating dielectric layer interposes the epitaxial S/D feature and the substrate.

Abstract: A unmanned aerial vehicle charging system for charging an unmanned aerial vehicle is provided. The unmanned aerial vehicle charging system includes a platform, a wireless charging coil assembly, a first electromagnet, a second electromagnet, and a third electromagnet. The wireless charging coil assembly is disposed on the platform. A first virtual line and a second virtual line pass through the wireless charging coil assembly, wherein the first virtual line is substantially perpendicular to the second virtual line. The first, second, and third electromagnets are disposed on the platform. The first electromagnet and the second electromagnet are located on opposite sides of the first virtual line. The second electromagnet and the third electromagnet are located on opposite sides of the second virtual line.

Abstract: A method includes forming a dummy gate over a substrate. A first gate spacer is formed on a sidewall of the dummy gate. The dummy gate is replaced with a gate structure. A top portion of the first spacer is removed. After the top portion of the first spacer is removed, a second spacer is over the first spacer. The second spacer has a stepped bottom surface with an upper step in contact with a top surface of the first spacer and a lower step lower than the top surface of the first spacer. A contact plug is formed contacting the gate structure and the second spacer.

Abstract: A semiconductor structure includes a substrate, an isolation structure disposed in the substrate, and a hybrid structure disposed over the isolation structure. The hybrid structure is substantially conformal with respect to a profile of the isolation structure. The hybrid structure includes an oxide component, a nitride component surrounding the oxide component, and a first polysilicon component alongside the nitride component. The nitride component includes a first upper surface closed to the first polysilicon component, and a second upper surface distal to the first polysilicon component. The second upper surface is lower than the first upper surface.

Abstract: Multi-link operations can provide higher network throughput and improved network flexibility compared to traditional techniques for wireless communication. Embodiments of the present invention provide a method of frame transmission that prevents constrained MLDs from transmitting and receiving frames on multiple links simultaneously using a novel and reliable group addressed frame transmission schedule for constrained MLDs. Group addressed frames are frames that are transmitted to several devices (e.g., broadcast) listening on a wireless link. It is important to carefully schedule group addressed frames for reception by MLDs to prevent IDC interference. According to some embodiments, group addressed frames are only transmitted when all MLDs listening on a wireless link are not transmitting data to prevent IDC interference.

Abstract: A far infrared (FIR)-emitting composition includes a first polymer component and a silicon dioxide composite particle which is prepared by subjecting a tetraalkoxysilane and a compound represented by Formula (A) to hydrolysis and condensation polymerization: Y—Si(ORa)3??(A), wherein each Ra independently represents a C1-4 alkyl group or a C1-4 alkanoyl group, Y represents X—R1—, a non-substituted C1-18 linear alkyl group or a non-substituted C3-18 branched alkyl group, and X and R1 are defined as set forth in the Specification and Claims. A FIR-emitting fiber including the FIR-emitting composition is also disclosed.

Abstract: Embodiments of the present invention provide methods and devices for discovering a multi-link device (MLD) on a wireless network. One exemplary approach includes transmitting a beacon frame including a MAC address of an AP MLD on the wireless network. The AP MLD includes a plurality of STAs operating on a plurality of wireless links and associated with a plurality of wireless MAC addresses. A password element is generated using a preconfigured password and the MAC address of the AP MLD, and authentication is performed using the password element.

Abstract: An optical film, comprising: a first substrate; a first plurality of prisms, disposed on the first substrate, wherein the first plurality of prisms comprises a first prism and a second prism adjacent to the first prism, wherein a first highest point of the first prism is higher than a second highest point of the second prism, wherein a top portion of an outer surface of the first prism comprises an arc shape with the arc shape comprise a highest point of the first prism.

Abstract: The present disclosure provides a private network and edge application provisioning management system and a method thereof, which provides a construction of enterprise private cloud platform and a process of management standardization, so that a dedicated cloud operating environment can be provided for enterprise customers, and special software application services can further be established and managed. A remote registration mechanism, an enterprise private network establishment mechanism, and an edge application activation mechanism be proposed in the present disclosure. In this way, edge computing capabilities in the enterprise private network environment can be provided, which can not only reduce application service latency time, but also network transmission does not need to go through the Internet, thus having the advantages of avoiding data leakage and improving security. The present disclosure also provides a computer-readable medium for executing the method of the present disclosure.

Abstract: A fan stator structure includes a silicon steel sheet lamination formed of a plurality of laminated silicon steel sheets located between a set of insulating supports and having coils wound thereon; and a plurality of conducting coil end holders respectively including a fixing section and a connecting section, and a receiving zone located between the two sections. The fixing and the connecting section are located at two opposite ends of the conducting coil end holder, and the fixing section is connected to the set of insulating supports. The receiving zone is configured for receiving a front and a back end of the coils, so that the front and back ends of the coils are in contact with the conducting coil end holders. With the conducting coil end holders, the fan stator structure can be manufactured with simplified procedures, reduced time and labor costs, and upgraded good yield rate.

Abstract: A packaged image sensor includes a substrate, an image sensor, a light-emitting element, and a first encapsulant. The substrate includes a through-hole. The image sensor and the light-emitting element are disposed on the substrate and are electrically connected to the substrate. The first encapsulant is filled between the image sensor and the light emitting element, and keeps the through-hole of the substrate opened. The through-hole of the substrate of the above-mentioned packaged image sensor can define a relative position between a pipe and the image sensor to facilitate the subsequent packaging process. An endoscope including the above-mentioned packaged image sensor is also disclosed.

Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: A manufacturing method of fan stator structure includes the steps of providing a fan stator; providing a plurality of coil lead wire holders at an end of the fan stator; and winding lead wires on the fan stator to form coils, and setting and connecting a front end and a back end of each of the lead wires to the coil lead wire holders. The above method eliminates the drawbacks of the conventional fan stator coil winding operation, such as requiring manual twisting and trimming of the lead wire front ends and back ends and leaking of tin solder occurred during welding of the lead wires to a circuit board.

Abstract: The present invention relates to a silicon dioxide composite particle with far-infrared radioactivity, which is formed by the hydrolysis, condensation and polymerization of an organic silane precursor having the structure of the formula (I) with a tetra-alkoxysilane. The high stability of organic silane precursor compounds and the low biotoxicity of silicon dioxide composite particles make the present far-infrared radioactive silicon dioxide composite particles of great potential for extensive use in related bio-products.

Abstract: A salt spray resistant structure of fan motor assembly includes a silicon steel sheet assembly, an insulation support assembly and an encapsulation layer. An inner side of the silicon steel sheet assembly defines a connection hole. A winding assembly is wound on the silicon steel sheet assembly and electrically connected with a circuit board. A first extension section protrudes from the silicon steel sheet assembly into the connection hole to cover a part of the inner side. A bearing cup covers the other part of the inner side. The encapsulation layer encapsulates the insulation support assembly, the winding assembly, the silicon steel sheet assembly and the circuit board so as to achieve salt spray resistant effect.

Abstract: An audio switching device includes a housing, a first user interface, and a controller within the housing and in electronic communication with the first user interface. The controller is configured to connect a first audio source to the audio switching device, connect a first listening device to the audio switching device, such that an output from the first audio source is received at the first listening device, receive a first input from the first user interface, disconnect the first listening device in response to receiving the first input, and connect a second audio listening device to the audio switching device, such that an output from the first audio source is received at the second listening device.

Abstract: An audio switching device includes a housing, a first user interface, and a controller within the housing and in electronic communication with the first user interface. The controller is configured to connect a first audio source to the audio switching device, connect a first listening device to the audio switching device, such that an output from the first audio source is received at the first listening device, receive a first input from the first user interface, disconnect the first listening device in response to receiving the first input, and connect a second audio listening device to the audio switching device, such that an output from the first audio source is received at the second listening device.

Abstract: A far infrared (FIR)-emitting composition includes a first polymer component and a silicon dioxide composite particle which is prepared by subjecting a tetraalkoxysilane and a compound represented by Formula (A) to hydrolysis and condensation polymerization: Y—Si(ORa)3??(A), wherein each Ra independently represents a C1-4 alkyl group or a C1-4 alkanoyl group, Y represents X—R1—, a non-substituted C1-18 linear alkyl group or a non-substituted C3-18 branched alkyl group, and X and R1 are defined as set forth in the Specification and Claims. A FIR-emitting fiber including the FIR-emitting composition is also disclosed.