Abstract: A packaged image sensor includes a substrate, an image sensor, a light-emitting element, and a first encapsulant. The substrate includes a through-hole. The image sensor and the light-emitting element are disposed on the substrate and are electrically connected to the substrate. The first encapsulant is filled between the image sensor and the light emitting element, and keeps the through-hole of the substrate opened. The through-hole of the substrate of the above-mentioned packaged image sensor can define a relative position between a pipe and the image sensor to facilitate the subsequent packaging process. An endoscope including the above-mentioned packaged image sensor is also disclosed.

Abstract: A photosensing pixel includes a substrate, a photosensing region, a floating diffusion region, a transfer gate and a control electrode. The photosensing region is located within the substrate. The floating diffusion region is located within the substrate aside the photosensing region. The transfer gate is disposed on the substrate and extending into the photosensing region. The control electrode is located on the substrate and extending into the floating diffusion region.

Abstract: A hybrid cluster system includes at least one computing node for providing computing resources and at least one storage node for providing storage resources. A specification of the at least one computing node is identical to a specification of the at least one storage node.

Abstract: A photosensing pixel includes a substrate, a photosensing region, a floating diffusion region, a transfer gate and a control electrode. The photosensing region is located within the substrate. The floating diffusion region is located within the substrate aside the photosensing region. The transfer gate is disposed on the substrate and extending into the photosensing region. The control electrode is located on the substrate and extending into the floating diffusion region.

Abstract: An optical sensor includes pixels disposed in a substrate. A light collimating layer is disposed on the substrate and includes a transparent layer, a light-shielding layer, and transparent pillars. The transparent layer blanketly disposed on the substrate covers the pixels and the region between the pixels. The light-shielding layer is disposed on the transparent layer and between the transparent pillars. The transparent pillars penetrating through the light-shielding layer are correspondingly disposed on the pixels.

Abstract: A fan stator structure includes a silicon steel sheet lamination formed of a plurality of laminated silicon steel sheets located between a set of insulating supports and having coils wound thereon; and a plurality of conducting coil end holders respectively including a fixing section and a connecting section, and a receiving zone located between the two sections. The fixing and the connecting section are located at two opposite ends of the conducting coil end holder, and the fixing section is connected to the set of insulating supports. The receiving zone is configured for receiving a front and a back end of the coils, so that the front and back ends of the coils are in contact with the conducting coil end holders. With the conducting coil end holders, the fan stator structure can be manufactured with simplified procedures, reduced time and labor costs, and upgraded good yield rate.

Abstract: A manufacturing method of fan stator structure includes the steps of providing a fan stator; providing a plurality of coil lead wire holders at an end of the fan stator; and winding lead wires on the fan stator to form coils, and setting and connecting a front end and a back end of each of the lead wires to the coil lead wire holders. The above method eliminates the drawbacks of the conventional fan stator coil winding operation, such as requiring manual twisting and trimming of the lead wire front ends and back ends and leaking of tin solder occurred during welding of the lead wires to a circuit board.

Abstract: A process for preparing a triazine-based precursor for producing a micro-particulate complex containing a far infrared-emissive silica particle comprises steps of: a) subjecting 2-4-6-trichloro-1,3,5-triazine and a first nucleophilic compound to a displacement reaction in the presence of a first solvent at a first temperature range to form an intermediate; and b) subjecting the intermediate and a second nucleophilic compound to a further displacement reaction in the presence of a second solvent at a second temperature range higher than the first temperature range.

Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: A storage and transportation system for automated warehouse and positioning control method thereof are disclosed. The system includes: a plurality of three-dimensional storage cabinets, a plurality of guiding rail assemblies, a plurality of automatic conveying modules, at least an automatic positioning module, at least a reading module, at least an automatic gripping module, and a central control processing module. The positioning control method includes: a conveying step, a mechanical positioning step, a sensing reading step, an optical positioning step, a computation processing step, a transmission step, and an operation step.

Abstract: In some embodiments, the present disclosure relates to a method of forming an integrated chip (IC) structure. The method may be performed by forming a first integrated chip die having one or more semiconductor devices within a first substrate, and forming a passivation layer over the first integrated chip die. The passivation layer is selectively etched to form interior sidewalls defining a first opening, and a conductive material is deposited over the passivation layer and within the first opening. The conductive material is patterned to define a conductive blocking structure that laterally extends past the one or more semiconductor devices in opposing directions. The first integrated chip die is bonded to a second integrated chip die having an array of image sensing elements within a second substrate.

Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: A photosensing pixel includes a substrate, a photosensing region, a floating diffusion region, a transfer gate and a control electrode. The photosensing region is located within the substrate. The floating diffusion region is located within the substrate aside the photosensing region. The transfer gate is disposed on the substrate and extending into the photosensing region. The control electrode is located on the substrate and extending into the floating diffusion region.

Abstract: A manufacturing method of an injection molded composite shoe sole and the sole thereof are provided. The method includes facial modifying, cleaning a combination face of an additional component formed of a material different from the sole material, and coating a facial process layer on the combination face, and drying to modify the combination face; gumming, placing a gum layer on the facial process layer on the modified combination face; in-mold positioning, placing additional component into a mold; and injection molding, injecting the sole material into the mold, thereby gumming the sole material and the gum layer of the combination face to form a composite shoe sole. Therefore, the manufacturing method effectively reduces the sole manufacturing time.

Abstract: A long-lasting antibacterial core-shell agent, a method for preparing a long-lasting antibacterial agent and method for preparing a solid media utilizing a long-lasting antibacterial core-shell agent. The long-lasting antibacterial core-shell agent comprises an antibacterial core composed of an antibacterial metal powder, a poorly soluble metal salt and a metal oxide; and an outer shell composed of a porous oxide. The solid media prepared utilizing the long-lasting antibacterial core-shell agent has the ability to resist ultraviolet damage, inhibits oxygen oxidation, slowly releases metal ions and thereby exhibits long-term release of antibacterial ions and longitudinal antibacterial uniformity.

Abstract: An optical sensor includes a plurality of pixels disposed in a substrate and a light collimating layer. The light collimating layer is disposed on the substrate. The light collimating layer includes a light-shielding layer, a plurality of transparent pillars, and a plurality of first dummy transparent pillars. The light-shielding layer is disposed on the substrate. The plurality of transparent pillars pass through the light-shielding layer and are disposed correspondingly on the plurality of pixels. The plurality of first dummy transparent pillars that pass through the light-shielding layer are disposed on a first peripheral region of the light collimating layer, wherein the plurality of first dummy transparent pillars surround the plurality of transparent pillars from a top view.

Abstract: Disclosed is an azo compound represented by Formula (I) in which R1 is hydrogen or methyl, R2 is hydrogen or methyl, and R3 is hydrogen, an unsubstituted linear alkyl group of from 1 to 4 carbon atoms, or an unsubstituted branched alkyl group of from 1 to 9 carbon atoms. This disclosure also provides a black dye composition including the azo compound represented by Formula (I).

Abstract: Disclosed is an azo compound represented by Formula (I), in which R1 is hydrogen or methyl, R2 is hydrogen or methyl, and R3 is hydrogen, an unsubstituted linear alkyl group of from 1 to 4 carbon atoms, or an unsubstituted branched alkyl group of from 1 to 4 carbon atoms. This disclosure also provides a black dye composition including the azo compound represented by Formula (I).

Abstract: A foreign object detection device includes a processor, a detecting circuit assembly connected to the processor, a coil connected to the detecting circuit assembly, a signal generator connected to the processor and the detecting circuit assembly, and a coil configuring circuit connected to the processor and the coil. The processor outputs a control signal to the coil configuring circuit so as to control the coil configuring circuit to generate a switch signal for enabling the coil to switch to one of a closed mode and an open mode, and controls the signal generator to transmit a test signal to the coil via the detecting circuit assembly when the coil is in the open mode.