Patents by Inventor Chih Lu

Chih Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180151613
    Abstract: Embodiments of the present disclosure include an image sensor device and methods of forming the same. An embodiment is an image sensor device including a first plurality of pickup regions in a photosensor array area of a substrate, each of first plurality of pickup regions having a first width and a first length, a second plurality of pickup regions in a periphery area of the substrate, the periphery area along at least one side of the photosensor array area, each of second plurality of pickup regions having a second width and a second length.
    Type: Application
    Filed: January 8, 2018
    Publication date: May 31, 2018
    Inventors: Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin, Yan-Chih Lu
  • Patent number: 9928397
    Abstract: A method for identifying a target object in a video file is implemented using an identification system. In the method, the identification system is programmed to: obtain a video file and an image; obtain a target object in the image; construct an image model based on a feature of the target object; extract key frames from the video file sequentially; perform a comparing procedure for each key frame to determine whether the key frame includes a similar object corresponding to the image model; and for each key frame, extract from the key frame, when the determination is affirmative, a part of the key frame that contains the similar object to obtain a target image, presence of the target image indicating that the target object is identified in the video file.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: March 27, 2018
    Assignees: Bravo Ideas Digital Co., Ltd.
    Inventor: Yi-Chih Lu
  • Patent number: 9899138
    Abstract: A coil structure for generating a uniform magnetic field and a coil apparatus having the same are disclosed. The coil apparatus has a plurality of coil units, and each of the coil units includes a sub-coil and a plurality of wire sections. The sub-coil has an eccentric-coil portion and two circuit connecting portions. The two circuit connecting portions are respectively connected to two segments of the eccentric-coil portion. The wire sections are arranged in parallel at intervals, are opposite the sub-coil, overlap the sub-coil, and are relatively inclined to the sub-coil. The circuit connecting portions of the segments of the coil units are connected to each other to form an auxiliary coil. A center position of the sub-coils is corresponding to a center position of the auxiliary coil so that a current flows through the sub-coils and the auxiliary coil to generate a uniform magnetic field.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: February 20, 2018
    Assignee: Automotive Research & Testing Center
    Inventors: Chien-Chih Lu, Tzyy-Haw Huang
  • Publication number: 20180021981
    Abstract: Disclosed herein is a method for recovering silicon particles and abrasive grains from a wasted abrasive slurry. The method includes providing a wasted abrasive slurry that contains silicon particles, abrasive grains and a water-soluble glycol, and mixing the wasted abrasive slurry with a metal chloride solution, so as to obtain a micelle layer and a slurry layer, the micelle layer including the water-soluble glycol, and the slurry layer including the silicon particles and the abrasive grains.
    Type: Application
    Filed: July 18, 2017
    Publication date: January 25, 2018
    Inventors: Po-Nien Lai, Shin-Lee Liu, Huang-Chih Lu
  • Patent number: 9865630
    Abstract: Embodiments of the present disclosure include an image sensor device and methods of forming the same. An embodiment is an image sensor device including a first plurality of pickup regions in a photosensor array area of a substrate, each of first plurality of pickup regions having a first width and a first length, a second plurality of pickup regions in a periphery area of the substrate, the periphery area along at least one side of the photosensor array area, each of second plurality of pickup regions having a second width and a second length.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: January 9, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin, Yan-Chih Lu
  • Publication number: 20170310166
    Abstract: A wireless power transmission device radiates electromagnetic waves through a transmission antenna and generates multiple sensed signals by using multiple foreign object detection (FOD) coils for detecting metallic foreign object to sense the electromagnetic waves. Each FOD coil has three coil units connected in series to and spaced apart from one another. The radiation pattern of the transmission antenna overlaps a sensing range of the FOD coils. A controller of the wireless power transmission device determines if any metallic foreign object enters the radiation range of the transmission antenna according to a reference voltage signal and sensed signals of the cells, and stops the generation of electromagnetic waves when determining entry of metallic foreign object into the radiation range to avoid the metallic foreign object to be heated by the electromagnetic waves.
    Type: Application
    Filed: June 24, 2016
    Publication date: October 26, 2017
    Inventors: Tzyy-Haw Huang, Chien-Chih Lu
  • Patent number: 9728521
    Abstract: An integrated circuit (IC) using a copper-alloy based hybrid bond is provided. The IC comprises a pair of semiconductor structures vertically stacked upon one another. The pair of semiconductor structures comprise corresponding dielectric layers and corresponding metal features arranged in the dielectric layers. The metal features comprise a copper alloy having copper and a secondary metal. The IC further comprises a hybrid bond arranged at an interface between the semiconductor structures. The hybrid bond comprises a first bond bonding the dielectric layers together and a second bond bonding the metal features together. The second bond comprises voids arranged between copper grains of the metal features and filled by the secondary metal. A method for bonding a pair of semiconductor structures together using the copper-alloy based hybrid bond is also provided.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: August 8, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Cheng Tsai, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Chih-Hui Huang, Yan-Chih Lu, Ju-Shi Chen
  • Publication number: 20170221950
    Abstract: In some embodiments, the present disclosure relates to an integrated chip (IC) structure having a conductive blocking structure configured prevent radiation produced by a device within a first die from affecting an image sensing element within a second die. The IC structure has a first IC die with one or more semiconductor devices and a second IC die with an array of image sensing elements. A hybrid bonding interface region is arranged between the first and second IC die. A conductive bonding structure is arranged within the hybrid bonding interface region and is configured to electrically couple the first IC die to the second IC die. A conductive blocking structure is arranged within the hybrid bonding interface region and extends laterally between the one or more semiconductor devices and the array of image sensing elements.
    Type: Application
    Filed: July 19, 2016
    Publication date: August 3, 2017
    Inventors: Cheng-Ying Ho, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Yan-Chih Lu
  • Publication number: 20170154059
    Abstract: An environment quality recording system includes a database, an analysis device, a recording platform and an electrical device. The database stores a platform environment quality datum and a device position datum. The recording platform generates and sends sensing data to the analysis device. The analysis device generates and stores the platform environment quality datum in the database. The electrical device is configured to send the device position datum to the analysis device. The analysis device generates real-time environment quality datum according to the device position datum, and determines if the environment quality data is valid according to a valid condition. When determining the real-time environment quality datum is valid, the analysis device sends the environment quality data to the electrical device.
    Type: Application
    Filed: April 1, 2016
    Publication date: June 1, 2017
    Inventor: Ying-Chih LU
  • Patent number: 9665136
    Abstract: A cover for an electronic device includes a transparent portion and a non-transparent portion beside the transparent portion. The transparent portion defines a display area of the electronic device. The non-transparent portion defines a non-display area of the electronic device beside the display area. The non-transparent portion includes a transparent substrate integrated with the transparent portion. A plurality of through holes are defined on the transparent substrate.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: May 30, 2017
    Assignees: INTERFACE OPTOELECTRONIC (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Chien-Chih Lu, Juin-Ming Wu, Wei-Cheng Lou
  • Patent number: 9658656
    Abstract: A cover for an electronic device includes a main portion and a border portion beside the main portion. The border portion includes a transparent substrate and a adhesive layer. The transparent substrate defines at least one through hole. The adhesive layer is adhered to an inner wall of the at least one through hole.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: May 23, 2017
    Assignees: INTERFACE OPTOELECTRONIC (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Chien-Chih Lu, Juin-Ming Wu, Wei-Cheng Lou
  • Publication number: 20170140541
    Abstract: A method for identifying a target object in a video file is implemented using an identification system. In the method, the identification system is programmed to: obtain a video file and an image; obtain a target object in the image; construct an image model based on a feature of the target object; extract key frames from the video file sequentially; perform a comparing procedure for each key frame to determine whether the key frame includes a similar object corresponding to the image model; and for each key frame, extract from the key frame, when the determination is affirmative, a part of the key frame that contains the similar object to obtain a target image, presence of the target image indicating that the target object is identified in the video file.
    Type: Application
    Filed: June 8, 2016
    Publication date: May 18, 2017
    Inventor: Yi-Chih Lu
  • Publication number: 20170124088
    Abstract: A method of operating a solution searching system includes a utility server generating a model input file according to words in an issue description file, a model server generating a prediction solution classification according to the model input file and a data mining prediction model, a central server selecting a first user defined solution classification with a highest weighting of at least one of user defined solution classification stored in a relational database as a solution classification, a database server reading at least one solution from a big database according to the solution classification, and the central server outputting the at least one solution according to weighting of each of the solution.
    Type: Application
    Filed: March 28, 2016
    Publication date: May 4, 2017
    Inventors: Ying-Chih Lu, Tsai-Feng Chung
  • Patent number: 9639939
    Abstract: A method for vehicle positioning is provided, which includes the steps of identifying at least one vehicle in an image, obtaining identification information of each vehicle from the image, and transforming coordinates of each vehicle in the image into positioning information of the corresponding vehicle according to mapping information. The positioning information is a position of the corresponding vehicle in real world. Precise lane-level vehicle positioning can be achieved based on comparison with the identification information or the positioning information.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: May 2, 2017
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Chee Tseng, Lien-Wu Chen, Chia-Chen Chang, Yin-Chih Lu, Pei-Chuan Tsai
  • Patent number: 9571910
    Abstract: An electronic device includes a speaker, and a cover covering the speaker. The cover includes a transparent main portion, and a non-transparent border portion. The non-transparent border portion includes a substrate integrated with the transparent main portion. The substrate of the border portion defines a plurality of through holes corresponding to the speaker to transmit sound output from the speaker.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: February 14, 2017
    Assignees: INTERFACE OPTOELECTRONIC (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Chien-Chih Lu, Juin-Ming Wu, Wei-Cheng Lou
  • Publication number: 20170025381
    Abstract: An integrated circuit (IC) using a copper-alloy based hybrid bond is provided. The IC comprises a pair of semiconductor structures vertically stacked upon one another. The pair of semiconductor structures comprise corresponding dielectric layers and corresponding metal features arranged in the dielectric layers. The metal features comprise a copper alloy having copper and a secondary metal. The IC further comprises a hybrid bond arranged at an interface between the semiconductor structures. The hybrid bond comprises a first bond bonding the dielectric layers together and a second bond bonding the metal features together. The second bond comprises voids arranged between copper grains of the metal features and filled by the secondary metal. A method for bonding a pair of semiconductor structures together using the copper-alloy based hybrid bond is also provided.
    Type: Application
    Filed: July 23, 2015
    Publication date: January 26, 2017
    Inventors: Yu-Cheng Tsai, Chun-Chieh Chuang, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Chih-Hui Huang, Yan-Chih Lu, Ju-Shi Chen
  • Publication number: 20170024360
    Abstract: A publishing system generates and provides webpage data to a client device via a network in response to a request from the client device for experiencing primary media content. The webpage data includes a primary media presentation interface to reproduce the primary media content, and a secondary media presentation interface to present secondary media content having a predefined correspondence with the primary media content. The secondary media presentation interface presents the secondary media content when a predefined time point is reached during reproduction of the primary media content.
    Type: Application
    Filed: October 6, 2016
    Publication date: January 26, 2017
    Inventor: Yi-Chih Lu
  • Publication number: 20170024097
    Abstract: A method for creating a composite media file includes: receiving a first command directed to a primary media file; retrieving the primary media file based on the first command; receiving a second command directed to a secondary media file, the second command including at least one designated time instance associated with the primary media file; retrieving the secondary media file based on the second command; and creating a composite media file that incorporates the primary media file and the secondary media file. The composite media file is created in such a manner that when played, the secondary media file is displayed simultaneously with and separately with respect to the primary media file at the designated time instance.
    Type: Application
    Filed: October 6, 2016
    Publication date: January 26, 2017
    Inventor: Yi-Chih Lu
  • Publication number: 20160365062
    Abstract: A fan-out circuit including a plurality of first fan-out lines is provided. At least one of the first fan-out lines includes a first upper segment, a first upper connection part having one end connected to the first upper segment, a first intermediate segment having one end connected to the other end of the first upper connection part, a first lower connection part having or e end connected to the other end of the first intermediate segment, and a first lower segment connected to the other end of the first lower connection part. At least one of the first upper segment, the first intermediate segment and the first lower segment has a zigzag structure.
    Type: Application
    Filed: May 31, 2016
    Publication date: December 15, 2016
    Inventors: Ching-Lung Wu, Jen-Chih Lu, Neng-Hsien Wang
  • Publication number: 20160322407
    Abstract: Embodiments of the present disclosure include an image sensor device and methods of forming the same. An embodiment is an image sensor device including a first plurality of pickup regions in a photosensor array area of a substrate, each of first plurality of pickup regions having a first width and a first length, a second plurality of pickup regions in a periphery area of the substrate, the periphery area along at least one side of the photosensor array area, each of second plurality of pickup regions having a second width and a second length.
    Type: Application
    Filed: July 8, 2016
    Publication date: November 3, 2016
    Inventors: Dun-Nian Yaung, Ching-Chun Wang, Feng-Chi Hung, Jeng-Shyan Lin, Yan-Chih Lu