Patents by Inventor Chih-Ming Hsu

Chih-Ming Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100069800
    Abstract: A massage device includes an outer casing, a control circuit, a power mechanism, a transmission mechanism, a big rotary disc, a small rotary disc, a massage ball, a big lid, and a small lid. The control circular is disposed in the outer casing. The outer casing has a massage surface and an installation trough. The power mechanism, the transmission mechanism, the big rotary disc and the small rotary disc are disposed in the installation trough. The power mechanism is electrically connected to the control circuit via an electric wire and controlled by the control circuit to operate. The power mechanism brings the big rotary disc and the small rotary disc to spin, respectively, through the transmission mechanism. The small rotary disc has a central shaft secured on the big rotary disc. The small rotary disc is formed with a ball aperture. The massage ball is disposed in the ball aperture. The big lid and the small lid cover the big rotary disc and the small rotary disc.
    Type: Application
    Filed: March 19, 2009
    Publication date: March 18, 2010
    Inventor: CHIH-MING HSU
  • Publication number: 20090296973
    Abstract: An electronic device is provided, which includes a first cover, a second cover, a circuit board, and a first microphone. The first cover comprises a first wall portion, a first storage space encircled by the first wall portion, and a first acoustic opening connected to the first storage space. The circuit board is affixed to the second cover. The first microphone is mounted on the circuit board and disposed in the first storage space to receive external sound through the first acoustic opening.
    Type: Application
    Filed: May 29, 2008
    Publication date: December 3, 2009
    Applicant: FORTEMEDIA, INC.
    Inventors: Chih Ming Hsu, Yu-De Tsai
  • Publication number: 20080261789
    Abstract: The present invention provides fitness sit-up chair, which is typically comprised of a frame and an exercise ball, wherein said frame is constructed of a support and a triangle stand, said exercise ball is mounted on the foldable triangle stand. The AB trainer has easy exercising, easy folding, occupying small volume features, meanwhile facilitates to packaging, transporting and storing.
    Type: Application
    Filed: December 29, 2007
    Publication date: October 23, 2008
    Inventor: Chih-Ming HSU
  • Patent number: 7397182
    Abstract: The present invention discloses a display module using blue-ray or ultraviolet-ray light sources to excite RGB fluorescent powders to emit light, which comprises a light guide plate, at least one blue-ray or ultraviolet-ray light source, a diffuser plate, a liquid crystal layer and a fluorescent-powder excited layer. The blue-ray or ultraviolet-ray light sources emit a short-wavelength light with the wavelength ranging from 360 to 460 nm; the light guide plate will guide the short-wavelength light to the diffuser plate; the diffuser plate will further diffuse the short-wavelength light; the diffused short-wavelength light will pass through the liquid crystal layer and reach the fluorescent-powder excited layer where the short-wavelength light excites the fluorescent powder to emit light. The excited layer has multiple grids where RGB fluorescent elements are disposed, and each grid has only one single-color fluorescent element.
    Type: Grant
    Filed: June 14, 2005
    Date of Patent: July 8, 2008
    Assignee: Arima Optoelectronics Corp.
    Inventors: Chih Ming Hsu, Yuh Wen Lee
  • Patent number: 7291874
    Abstract: The present invention discloses a laser dicing apparatus for a gallium arsenide wafer and a method thereof, wherein firstly, a gallium arsenide wafer is stuck onto a holding film; next, the gallium arsenide wafer together with the holding film is disposed on a working table; the gallium arsenide wafer has multiple chips or dice with a scribed line drawn between every two chips; a control device and an object lens are used to position the working table and a laser, and two video devices are used to observe whether the laser has been precisely aimed at one of the scribed lines; after parameters have been input into the control device, the laser is used to cut the gallium arsenide wafer, and the gallium arsenide wafer is then separated into multiple discrete chips or dice. The present invention can precisely cut gallium arsenide wafers, reduce the cost and accelerate the fabrication process.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: November 6, 2007
    Assignee: Arima Optoelectronics Corp.
    Inventor: Chih-Ming Hsu
  • Publication number: 20070190750
    Abstract: The present invention discloses a laser dicing apparatus for a gallium arsenide wafer and a method thereof, wherein firstly, a gallium arsenide wafer is stuck onto a holding film; next, the gallium arsenide wafer together with the holding film is disposed on a working table; the gallium arsenide wafer has multiple chips or dice with a scribed line drawn between every two chips; a control device and an object lens are used to position the working table and a laser, and two video devices are used to observe whether the laser has been precisely aimed at one of the scribed lines; after parameters have been input into the control device, the laser is used to cut the gallium arsenide wafer, and the gallium arsenide wafer is then separated into multiple discrete chips or dice. The present invention can precisely cut gallium arsenide wafers, reduce the cost and accelerate the fabrication process.
    Type: Application
    Filed: March 21, 2007
    Publication date: August 16, 2007
    Inventor: Chih-Ming Hsu
  • Publication number: 20070111479
    Abstract: The present invention discloses a high-power-laser chip-fabrication apparatus and a method thereof, wherein a substrate is fixed on a working table; a light-guide device is used to direct a high power laser to a scribed line on the substrate; a control device is used to position the working table and the high power laser so that the high power laser can be precisely aimed at the scribed line to be cut; a video device is used to observe whether the high power has been aimed at the scribed line; an object lens is used to adjust the focal length by which the high power laser is to be aimed at one of the scribed lines; the length of the scribed line to be cut and the spacing between two scribed lines are input; and then, the cutting is performed. The present invention can cut the substrate quickly and precisely into multiple discrete chips and accelerate the fabrication process.
    Type: Application
    Filed: January 3, 2007
    Publication date: May 17, 2007
    Inventor: Chih-Ming Hsu
  • Publication number: 20070084838
    Abstract: A laser cutting system for cutting a wafer includes a working table capable of holding a wafer with a vacuum device. The wafer is monitored on a first side by an electronic micro camera for positioning the wafer to a cutting location. A laser device mounted above the working table generates a laser beam for cutting a second side of the wafer when the electronic micro camera is monitoring and guiding the wafer carried by the working table along an accurate route.
    Type: Application
    Filed: October 5, 2006
    Publication date: April 19, 2007
    Inventor: Chih-Ming Hsu
  • Publication number: 20070032176
    Abstract: A method for polishing diamond wafers. At least a diamond wafer is mounted onto a ceramic plate with wax disposed therebetween and is pressed onto the ceramic plate. The ceramic plate is fixed on a first transmission device of a polishing machine by a vacuum. The ceramic plate is driven by the first transmission device to rotate and move towards a metal disc fixed on a second transmission device driven to rotate unmoved such that the diamond wafer on the ceramic plate is being polished by the metal disc. The method for polishing diamond wafers of the present invention uses the metal disc so as to reduce cost, time and improve polishing efficiency.
    Type: Application
    Filed: August 4, 2005
    Publication date: February 8, 2007
    Inventor: Chih-Ming Hsu
  • Patent number: 7126825
    Abstract: A combined chip/heat-dissipating metal plate includes a chip and a heat-dissipating metal plate bonded to a side of the chip, wherein the heat-dissipating metal plate is in a stretched state. The heat-dissipating metal plate is stretched before bonding the chip. Preferably, the stretched heat-dissipating metal plate has a thickness smaller than that of the heat-dissipating metal plate before stretching by not more than 20%. The chip has good compression strength in the radial direction and the heat-dissipating metal plate has higher tensile strength after being stretched and taking shape, providing a more stable structure and avoiding damage to the chip due to radially outward tension. The combined chip/heat-dissipating metal plate thus obtained is more stable and thus benefits the subsequent cutting by a laser cutting apparatus.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: October 24, 2006
    Assignee: Cleavage Enterprise Co., Ltd.
    Inventor: Chih-Ming Hsu
  • Patent number: 7106304
    Abstract: A keypad device including a parallel/serial conversion device, a keypad module, and a controller coupled to the parallel/serial conversion device and the keypad module. The keys in the keypad module are arranged in parallel. After the key is triggered, an interrupt signal will be fed to the controller. On receiving the interrupt signal, the controller will feed a drive voltage to the keypad module generating a parallel signal therein. After causing the parallel/serial conversion device to read and store the parallel signal, the controller will be able to read the parallel signal serially by using the clock signals. The status of the keypad module can thereby be obtained.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: September 12, 2006
    Assignee: High Tech Computer Corp.
    Inventors: Yu-Chun Peng, Shao-Chun Ho, Hsi-Cheng Yeh, Chih-Ming Hsu
  • Publication number: 20060178252
    Abstract: A method for making a top plate for a paper pallet includes folding a sheet unit in two along a widthwise direction and folding the sheet unit in two or three in a lengthwise direction. Glue or adhesive is applied to obtain a top plate of a firm structure. The sheet unit has a length at least two times the length of a bottom section of the top plate and a width two times the width of the bottom section. Most of the cutting edges of the sheet unit are not exposed.
    Type: Application
    Filed: February 7, 2005
    Publication date: August 10, 2006
    Inventor: Chih-Ming Hsu
  • Publication number: 20060138683
    Abstract: The present invention discloses a fabrication method of light emitting diodes, which comprises the following steps: firstly, providing three sapphire wafers with each sapphire wafer having a substrate and an epitaxial layer; turning the sapphire wafers upside down and sticking an adhesive tape onto each epitaxial layer; attaching three sapphire wafers to a ceramic work piece; performing coarse grinding on the substrates with a machining table; performing fine grinding on the substrates with a polishing disc; removing the substrate completely with etching; unloading the remaining epitaxial layers and the adhesive tapes, and turning them upside down again, and stripping off the adhesive tapes; forming a conductor via joining the epitaxial layer with an electrically-conductive layer of a metal or another wafer. Thereby, the brightness of LED can be increased; the fabrication process can be accelerated; the yield can be promoted; and the cost can be reduced.
    Type: Application
    Filed: September 6, 2005
    Publication date: June 29, 2006
    Inventor: Chih-Ming Hsu
  • Publication number: 20060131010
    Abstract: The present invention provides a heat dissipating assembly for a heat element comprising a board on which at least a heat source, heat conductive layer and a heat dissipating sheet are set. The heat conductive layer is formed between the heat dissipating sheet and the board by squeeze bonding, thermal fusion or ultrasonic fusion. The heat conductive layer is made up of a material possessing the properties of quick heat conduction and compressive flexibility. While the heat conductive layer is adhered by squeeze bonding, thermal fusion or ultrasonic fusion, heat is conducted by its entire surface. The present invention is able to raise the heat dissipating efficacy and draw out the heat from the heat source quickly, therefore, increases the brightness and durability of the light source.
    Type: Application
    Filed: September 6, 2005
    Publication date: June 22, 2006
    Inventors: Chih-Ming Hsu, Chung-Cheng Lin, Chin-Ting Lee
  • Publication number: 20060124616
    Abstract: The present invention discloses a laser dicing apparatus for a silicon wafer and a dicing method thereof, wherein firstly, a silicon wafer, which has multiple chips with a scribed line drawn between every two chips, is provided; next, the silicon wafer is disposed on a working table having a vacuum device and fixed by the vacuum device; next, the working table and a laser are positioned by a control device; next, the laser is directed by a light-guide device to focus at one of the scribed lines; and lastly, the scribed lines on the silicon wafer are sequentially cut by the laser in order to dice the silicon wafer into multiple separate chips. The present invention can reduce the cutting harm on chips, lower the cost, accelerate the fabrication and improve environmental problems.
    Type: Application
    Filed: July 20, 2005
    Publication date: June 15, 2006
    Inventor: Chih-Ming Hsu
  • Publication number: 20060128121
    Abstract: The present invention discloses a laser dicing apparatus for a gallium arsenide wafer and a method thereof, wherein firstly, a gallium arsenide wafer is stuck onto a holding film; next, the gallium arsenide wafer together with the holding film is disposed on a working table; the gallium arsenide wafer has multiple chips or dice with a scribed line drawn between every two chips; a control device and an object lens are used to position the working table and a laser, and two video devices are used to observe whether the laser has been precisely aimed at one of the scribed lines; after parameters have been input into the control device, the laser is used to cut the gallium arsenide wafer, and the gallium arsenide wafer is then separated into multiple discrete chips or dice. The present invention can precisely cut gallium arsenide wafers, reduce the cost and accelerate the fabrication process.
    Type: Application
    Filed: August 26, 2005
    Publication date: June 15, 2006
    Inventor: Chih-Ming Hsu
  • Publication number: 20060128120
    Abstract: The present invention discloses a short-wavelength laser dicing apparatus for a diamond wafer and a dicing method thereof, wherein a diamond wafer is disposed on a working table; the diamond wafer has multiple scribed lines; a control device is used to position the working table and a short-wavelength laser so that the short-wavelength laser can sequentially cut the scribed lines and the diamond wafer can be separated into multiple discrete chips or dice. The present invention utilizes the high-energy photons of a short-wavelength laser to enable a diamond wafer to be easily cut and can accelerate the cutting process.
    Type: Application
    Filed: August 26, 2005
    Publication date: June 15, 2006
    Inventor: Chih-Ming Hsu
  • Publication number: 20060124611
    Abstract: The present invention discloses a high-power-laser chip-fabrication apparatus and a method thereof, wherein a substrate is fixed on a working table; a light-guide device is used to direct a high power laser to a scribed line on the substrate; a control device is used to position the working table and the high power laser so that the high power laser can be precisely aimed at the scribed line to be cut; a video device is used to observe whether the high power has been aimed at the scribed line; an object lens is used to adjust the focal length by which the high power laser is to be aimed at one of the scribed lines; the length of the scribed line to be cut and the spacing between two scribed lines are input; and then, the cutting is performed. The present invention can cut the substrate quickly and precisely into multiple discrete chips and accelerate the fabrication process.
    Type: Application
    Filed: August 15, 2005
    Publication date: June 15, 2006
    Inventor: Chih-Ming Hsu
  • Publication number: 20060124617
    Abstract: The present invention discloses a high-power solid-state laser dicing apparatus for a gallium nitride wafer and a dicing method thereof, wherein a gallium nitride wafer is disposed on a working table; the gallium nitride wafer has multiple chips or dice with a scribed line drawn between every two chips or dice; a light-guide device is used to direct a high-power solid-state laser to one of the scribed lines on the gallium nitride wafer; a control device is used to position the working table and the high-power solid-state laser so that the high-power solid-state laser can be precisely aimed at one of the scribed lines on the gallium nitride; and the high-power solid-state laser is then used to cut the gallium nitride wafer in order to separate the gallium nitride wafer into multiple discrete chips or dice. The present invention can save the manpower, cost and time of cutting a gallium nitride wafer, and can precisely cut a gallium nitride wafer without injuring the surface of the gallium nitride wafer.
    Type: Application
    Filed: August 26, 2005
    Publication date: June 15, 2006
    Inventor: Chih-Ming Hsu
  • Patent number: D573672
    Type: Grant
    Filed: July 9, 2007
    Date of Patent: July 22, 2008
    Inventor: Chih Ming Hsu