Abstract: The present invention discloses a light-emitting-diode structure and a fabrication method thereof, wherein firstly, a substrate and a printed circuit board are provided; an epitaxial layer and multiple LED dies are sequentially formed on the bottom surface of the substrate; two electrodes are formed on each LED die; multiple conductive lines penetrating through the printed circuit board are installed inside the printed circuit board; multiple junctions and multiple solder joints are separately formed on the top surface and the bottom surface of the printed circuit board; each junction is connected to its corresponding solder joint via one conductive line; the substrate is compressed to join to the printed circuit board at a high temperature and under a high pressure in order to enable each junction to join with the corresponding electrode of the LED die; and lastly, the joined substrate and printed circuit board is cut by each individual LED die into multiple LED structures.

Abstract: The present invention discloses a package structure of a stack-type light-sensing element and a package method thereof, wherein firstly, a substrate is provided; next, a signal-processing IC chip and a light-sensing chip are sequentially stacked above the substrate in bottom-up sequence; next, lead lines are used to electrically connect the substrate with the signal-processing IC chip and the light-sensing chip in order to form a unitary light-sensing element. The present invention has the advantages that light-sensor signals are directly processed and then output to a display device, and that the volume of a light-sensing element can be reduced to such an extent that it can be easily applied to miniature electronic products. In contrast with the conventional light-sensing element needing massive volume of electronic circuits to process signal and also needing minute and complicated assemblage, the present invention has superior novelty and futurity.

Abstract: A casing for an electronic device and a method producing the same. The method comprises the following steps. First, a first member is formed of a first metallic material, and a second member is formed of a second metallic material. In the second member, at least one step portion is formed. Then, the casing is produced by combining the first member and the second member in a manner such that the step portion corresponds to the unit and the second member is nearer to the unit than the first member.

Abstract: A method of selective growth of carbon nano-structures on silicon substrates, comprising definition of the predetermined area on Si substrates to be grown carbon nano-structures, formation of metal-silicides on the predetermined area on the said Si substrates to be grown carbon nano-structures, and growth of carbon nano-structures on the said metal-silicides by chemical vapor deposition method. Locations of the said metal-silicides on the said Si substrates are growth area of the nano-structures, whereby function of selective growth of carbon nano-structures on Si substrates can be achieved. Besides, the said metal-silicides area is manufactured by semiconductor processes, and is directly compatible with IC processes.

Abstract: A keypad device including a parallel/serial conversion device, a keypad module, and a controller coupled to the parallel/serial conversion device and the keypad module. The keys in the keypad module are arranged in parallel. After the key is triggered, an interrupt signal will be fed to the controller. On receiving the interrupt signal, the controller will feed a drive voltage to the keypad module generating a parallel signal therein. After causing the parallel/serial conversion device to read and store the parallel signal, the controller will be able to read the parallel signal serially by using the clock signals. The status of the keypad module can thereby be obtained.

Abstract: A novel structure for the TEQ in a DMT system receiver to shorten the length of the effective channel impulse response is provided. A time-domain equalizer, based on the decision-feedback filter structure, along with a training method is disclosed. In accordance with the DFE-based TEQ in the DMT system, the data symbols that transmitted through the effective shortened channel would be more reliable.

Abstract: An inrush current suppression circuit is installed between a DC voltage and a load with a parallel system capacitor. The inrush current suppression circuit includes a first current limiting circuit which includes a first resistor, a first controlled switch, and a second controlled switch. The inrush current suppression circuit further includes a second current limiting circuit which further includes a second resistor, a third controlled switch, and an energy-storing capacitor. The second current limiting circuit is electrically connected in parallel to the system capacitor, and the first current limiting circuit is electrically connected with the DC voltage and the second current limiting circuit. When the DC voltage is detected, the first controlled switch is conducted. When a voltage of two ends of the load reaches a first threshold value, the second controlled switch is conducted so as to bypass the first resistor.

Abstract: An inrush current suppression circuit is installed between a DC voltage and a load with a parallel system capacitor. The inrush current suppression circuit includes a first current limiting circuit which includes a first resistor, a first controlled switch, and a second controlled switch. The inrush current suppression circuit further includes a second current limiting circuit which further includes a second resistor, a third controlled switch, and an energy-storing capacitor. The second current limiting circuit is electrically connected in parallel to the system capacitor, and the first current limiting circuit is electrically connected with the DC voltage and the second current limiting circuit. When the DC voltage is detected, the first controlled switch is conducted. When a voltage of two ends of the load reaches a first threshold value, the second controlled switch is conducted so as to bypass the first resistor.

Abstract: A casing for an electronic device and a method producing the same. The method comprises the following steps. First, a first member is formed of a first metallic material, and a second member is formed of a second metallic material. In the second member, at least one step portion is formed. Then, the casing is produced by combining the first member and the second member in a manner such that the step portion corresponds to the unit and the second member is nearer to the unit than the first member.

Abstract: A rechargeable battery pack module includes a battery cell set, a DC-to-DC converter adapted to be connected to one of a portable computer and an AC adapter and operable so as to generate charging current, a safety switch control unit operable so as to permit charging and discharging of the battery cell set, a charging protection unit to control operation of the safety switch control unit according to the cell voltages of battery cells of the battery cell set, and a battery status indicating unit for storing manufacturer information corresponding to the battery cell set therein and capable of providing the manufacturer information and charging status information of the battery cell set to the portable computer.