Patents by Inventor Chih-Ming Hsu

Chih-Ming Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10459332
    Abstract: A method of fabricating a photomask includes providing a mask blank; removing a portion of the resist layer to form a patterned resist layer exposing a portion of the cooling layer; patterning the cooling layer by using the patterned resist layer as an etching mask; patterning the opaque layer; and removing the patterned resist layer and the patterned cooling layer. The mask blank includes a light-transmitting substrate and an opaque layer, a cooling layer, and a resist layer sequentially stacked thereon, wherein the cooling layer has a thermal conductivity ranging between 160 and 5000 and an effective atomic number ranging between 5 and 14.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: October 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hao-Ming Chang, Chih-Ming Chen, Cheng-Ming Lin, Sheng-Chang Hsu, Shao-Chi Wei, Hsao Shih, Li-Chih Lu
  • Patent number: 10453999
    Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: October 22, 2019
    Assignee: Genesis Photonics Inc.
    Inventors: Yi-Ru Huang, Tung-Lin Chuang, Yan-Ting Lan, Sheng-Tsung Hsu, Chih-Ming Shen, Jing-En Huang, Teng-Hsien Lai, Hung-Chuan Mai, Kuan-Chieh Huang, Shao-Ying Ting, Cheng-Pin Chen, Wei-Chen Chien, Chih-Chin Cheng, Chih-Hung Tseng
  • Patent number: 10446642
    Abstract: An epitaxial substrate and a method for forming the same are disclosed. The epitaxial substrate includes a substrate, a deposition layer, a buffer layer and an epitaxial layer. The deposition layer is directly formed on the substrate, wherein the deposition layer includes a gradient doping concentration, and has a first surface and a second surface which are opposite to each other; the gradient doping concentration has a minimum value at the first surface. The buffer layer is formed on the deposition layer, and an epitaxial layer is formed on the buffer layer. The epitaxial layer is mainly formed of group III-V nitride. The substrate and the deposition layer are formed of homogeneous material. Since the deposition layer is directly formed on the substrate, and the deposition layer and the substrate are formed of a homogeneous material, the epitaxial substrate includes a good heat dissipation efficiency and low leakage current.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: October 15, 2019
    Assignee: GLOBALWAFERS CO., LTD.
    Inventors: Che-Ming Liu, Man-Hsuan Lin, Chih-Yuan Chuang, Shuo-Hung Hsu, Chuan-Wei Tsou, Wen-Ching Hsu
  • Publication number: 20190310314
    Abstract: A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.
    Type: Application
    Filed: March 20, 2019
    Publication date: October 10, 2019
    Inventors: Chih-Yang Liu, Ying-Chou Shih, Yen-Ju Lu, Chih-Ming Hung, Jui-Lin Hsu
  • Publication number: 20190301548
    Abstract: A motor brake module for braking a motor is provided. The motor includes a shell, a shaft portion and a driving portion. The motor brake module includes a brake assembly, a block assembly and an armature assembly. The brake assembly includes a shaft hole, plural teeth and plural openings. The shaft portion passes through the shaft hole, and the shaft portion drives the brake assembly to rotate when the shaft portion is rotated. The armature assembly is connected with the block assembly for driving the block assembly to move between the armature assembly and the brake assembly. When the block assembly is moved toward the brake assembly, a portion of the block assembly is contacted with one of the plural teeth and the other portion of the block assembly passes through one of the plural openings.
    Type: Application
    Filed: June 25, 2018
    Publication date: October 3, 2019
    Inventors: Chi-Huan Shao, Chi-Shun Chang, Chih-Ming Hsu
  • Patent number: 10421194
    Abstract: A tool driving module for a robot manipulator comprising an end-shaft is disclosed. The tool driving module comprises a connection part, a motor driving module, a driving arm and a tool fixing bracket. The connection part comprising a combination bracket is coupled with the end-shaft. The motor driving module is coupled with the combination bracket. The driving arm is connected with the motor driving module, and driven by the motor driving module to rotate. The tool fixing bracket is connected with the driving arm for mounting a tool thereon. The tool fixing bracket and the tool are driven by the driving arm to rotate synchronously, and a tool center point of the tool and an extending line of an axis of the end-shaft are at a common point via the rotation of the tool.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: September 24, 2019
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Chih-Ming Hsu
  • Patent number: 10418458
    Abstract: The present invention discloses a manufacturing method for a semiconductor device. The manufacturing method includes: providing a substrate; forming a semiconductor stacked structure on the substrate; forming at least apart of a stacked cap layer on the semiconductor stacked structure, wherein the part of the stacked cap layer includes a nitride layer; removing a part of the nitride layer; forming the rest part of the stacked cap layer; forming a protection layer on the stacked cap layer, and etching the protection layer to form an opening, wherein the nitride layer is not exposed by the opening; and introducing an etchant material into the opening to etch the substrate. The present invention also provides a semiconductor device made by the method.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: September 17, 2019
    Assignee: PIXART IMAGING INCORPORATION
    Inventors: Chih-Ming Sun, Hsin-Hui Hsu, Ming-Han Tsai
  • Patent number: 10411331
    Abstract: The present disclosure provides a back cover assembly of a portable electronic device. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: September 10, 2019
    Assignee: INPAQ TECHNOLOGY CO., LTD.
    Inventors: Po-Kai Hsu, Chih-Ming Su
  • Publication number: 20190252767
    Abstract: The present disclosure provides a back cover assembly of a portable electronic device. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Inventors: PO-KAI HSU, CHIH-MING SU
  • Patent number: 10381228
    Abstract: An epitaxial process applying light illumination includes the following steps. A substrate is provided. A dry etching process and a wet etching process are performed to form a recess in the substrate, wherein an infrared light illuminates while the wet etching process is performed. An epitaxial structure is formed in the recess.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: August 13, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Ying Lin, Ted Ming-Lang Guo, Chin-Cheng Chien, Chih-Chien Liu, Hsin-Kuo Hsu, Chin-Fu Lin, Chun-Yuan Wu
  • Publication number: 20190238890
    Abstract: A deblocking filtering method includes receiving reconstructed video data associated with a block boundary in a video coding system. The block boundary has N lines of samples crossing the block boundary from a P side to a Q side of the boundary. The method further includes determining whether to apply a first filter set to reduce block artifacts at the block boundary based on whether a first inter-side difference of a first line of the N lines of samples is greater than an inter-side difference threshold, determining a filter length of a filter in the first filter set based on a first side length of the P side, and a second side length of the Q side when it is determined to apply the first filter set, and applying at least one filter in the first filter set with the determined filter length on the block boundary.
    Type: Application
    Filed: December 11, 2018
    Publication date: August 1, 2019
    Applicant: MEDIATEK INC.
    Inventors: Chia-Ming TSAI, Tzu-Der Chuang, Chih-Wei Hsu, Ching-Yeh Chen, Yu-Wen Huang
  • Patent number: 10365829
    Abstract: A memory transaction-level modeling method and a memory transaction-level modeling system are provided. The memory transaction-level modeling method is used for simulating the operation of outputting at least one command to the memory. The memory includes a plurality of banks each of which corresponds with a bank status table. The memory transaction-level modeling method includes the following steps: An event is received. Whether one of the bank status tables is needed to be updated is determined. If one of the bank status tables is needed to be updated, this bank status table is recovered according to a TMP queue. A command is outputted to the memory according to a command queue. The outputted command is stored in the TMP queue. Some of the bank status tables are updated and others of the bank status tables are kept unchanged.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: July 30, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yao-Hua Chen, Che-Wei Hsu, Juin-Ming Lu, Wei-Shiang Lin, Jing-Jia Liou, Chih-Tsun Huang
  • Patent number: 10367365
    Abstract: A method used between a portable device and a battery pack including at least one battery cell includes: transmitting information for the battery cell from the portable device to the battery pack via the connecting interface or from the battery pack to the portable device via the connecting interface; and according to the information for the battery cell, performing at least one control operation that is associated with the battery cell; wherein there is an analog communication from the battery cell of the battery pack to the portable device to provide a voltage level actually from the battery cell.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: July 30, 2019
    Assignee: MEDIATEK INC.
    Inventors: Jui-Chi Wu, Chi-Ming Lee, Chih-Yuan Hsu
  • Publication number: 20190227144
    Abstract: A wireless system includes a local oscillator (LO) signal generation circuit, a receiver (RX) circuit, and a calibration circuit. The LO signal generation circuit generates an LO signal according to a reference clock. The LO signal generation circuit includes an active oscillator. The active oscillator generates the reference clock, wherein the active oscillator includes at least one active component, and does not include an electromechanical resonator. The RX circuit generates a down-converted RX signal by performing down-conversion upon an RX input signal according to the LO signal. The calibration circuit generates a frequency calibration control output according to a signal characteristic of the down-converted RX signal, and outputs the frequency calibration control output to the LO signal generation circuit. The LO signal generation circuit adjusts an LO frequency of the LO signal in response to the frequency calibration control output.
    Type: Application
    Filed: October 24, 2018
    Publication date: July 25, 2019
    Inventors: Tzu-Chin Lin, Chih-Ming Hung, Jui-Lin Hsu, Chao-Ching Hung, Bao-Chi Peng
  • Publication number: 20190221648
    Abstract: A heterostructure, includes: a substrate; and a buffer layer that includes a plurality of layers having a composition AlxInyGa1-x-yN, where x?1 and y?0; wherein the buffer layer has a first region that includes at least two layers, a second region that includes at least two layers, and a third region that includes at least two layers.
    Type: Application
    Filed: December 19, 2018
    Publication date: July 18, 2019
    Applicant: GlobalWafers Co., Ltd.
    Inventors: Jia-Zhe Liu, Yen Lun Huang, Chih-Yuan Chuang, Che Ming Liu, Wen-Ching Hsu, Manhsuan Lin
  • Publication number: 20190214374
    Abstract: A light emitting component includes an epitaxial structure, an adhesive layer, a first reflective layer, a second reflective layer, a block layer, a first electrode and a second electrode. The epitaxial structure includes a substrate, a first semiconductor layer, a light emitting layer and a second semiconductor layer. The adhesive layer is disposed on the second semiconductor layer of the epitaxial structure. The first reflective layer is disposed on the adhesive layer. The second reflective layer is disposed on the first reflective layer and extended onto the adhesive layer. A projection area of the second reflective layer is larger than a projection area of the first reflective layer. The block layer is disposed on the second reflective layer. The first electrode is electrically connected to the first semiconductor layer. The second electrode is electrically connected to the second semiconductor layer.
    Type: Application
    Filed: March 13, 2019
    Publication date: July 11, 2019
    Applicant: Genesis Photonics Inc.
    Inventors: Yi-Ru Huang, Tung-Lin Chuang, Chih-Ming Shen, Sheng-Tsung Hsu, Kuan-Chieh Huang, Jing-En Huang
  • Publication number: 20190214477
    Abstract: The present invention discloses a manufacturing method for a semiconductor device. The manufacturing method includes: providing a substrate; forming a semiconductor stacked structure on the substrate; forming at least apart of a stacked cap layer on the semiconductor stacked structure, wherein the part of the stacked cap layer includes a nitride layer; removing a part of the nitride layer; forming the rest part of the stacked cap layer; forming a protection layer on the stacked cap layer, and etching the protection layer to form an opening, wherein the nitride layer is not exposed by the opening; and introducing an etchant material into the opening to etch the substrate. The present invention also provides a semiconductor device made by the method.
    Type: Application
    Filed: March 19, 2019
    Publication date: July 11, 2019
    Inventors: Chih-Ming Sun, Hsin-Hui Hsu, Ming-Han Tsai
  • Publication number: 20190207640
    Abstract: A wireless system includes an active oscillator and a front-end circuit. The active oscillator is used to generate and output a reference clock. The active oscillator includes at least one active component, and does not include an electromechanical resonator. The front-end circuit is used to process a transmit (TX) signal or a receive (RX) signal according to a local oscillator (LO) signal. The LO signal is derived from the reference clock.
    Type: Application
    Filed: October 4, 2018
    Publication date: July 4, 2019
    Inventors: Jui-Lin Hsu, Chao-Ching Hung, Tzu-Chin Lin, Wei-Hsiu Hsu, Yu-Li Hsueh, Jing-Hong Conan Zhan, Chih-Ming Hung
  • Publication number: 20190181149
    Abstract: A method for manufacturing a semiconductor device having a multi-height structure is provided. The semiconductor device having a multi-height structure includes a silicon substrate. A first structure and a second structure are respectively formed on the silicon substrate and connected to each other. A limiting block is formed on the second structure and near an edge of the second structure beside the first structure. A bottom anti-reflection coating (BARC) layer is formed to blanketly cover the first structure, the second structure and the limiting block, in which the BARC layer includes a low-viscosity material, and the BARC layer overlying the top surface of the second structure has an external surface substantially parallel to the top surface of the second structure. Control gates are formed on the external surface of the BARC layer.
    Type: Application
    Filed: February 18, 2019
    Publication date: June 13, 2019
    Inventors: Kuan-Wei SU, Yung-Lung HSU, Chih-Hsun LIN, Kun-Tsang CHUANG, Chiang-Ming CHUANG, Chia-Yi TSENG
  • Patent number: 10320058
    Abstract: The present disclosure provides a portable electronic device and a back cover assembly thereof. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: June 11, 2019
    Assignee: INPAQ TECHNOLOGY CO., LTD.
    Inventors: Po-Kai Hsu, Chih-Ming Su