Abstract: A semiconductor memory device includes a substrate, at least one floating gate electrode, an interlayer dielectric layer, an interconnection structure, an etching stop layer, a conductive structure, and an opening. The floating gate electrode is disposed on the substrate. The interlayer dielectric layer is disposed on the floating gate electrode. The interconnection structure is disposed in the interlayer dielectric layer. The etching stop layer is disposed on the interlayer dielectric layer. The conductive structure penetrates the etching stop layer and is electrically connected with the interconnection structure. The opening penetrates the etching stop layer and overlaps at least a part of the floating gate electrode in a thickness direction of the substrate.

Abstract: A multimedia apparatus includes a wireless transmission device, an audio receiving device, a processing device and a projection device. The audio receiving device is for receiving a first voice data. The processing device is coupled with the audio receiving device and the wireless transmission device. The processing device is for outputting the first voice data via the wireless transmission device. The projection device is coupled with the processing device. When the processing device receives a first image data corresponding to the first voice data via the wireless transmission device, the processing device operates the projection device to project a first projection picture according to the first image data. A multimedia system including the multimedia apparatus is also disclosed.

Abstract: A semiconductor package includes a first redistribution structure, a semiconductor die electrically coupled to the first redistribution structure, a die attach material interposed between the first redistribution structure and the semiconductor die, and an insulating encapsulant disposed on the first redistribution structure and covering the semiconductor die and the die attach material. A bottom of the semiconductor die is embedded in the die attach material, and a thickness of a portion of the die attach material disposed over a spacing of conductive traces of the first redistribution structure is greater than a thickness of another portion of the die attach material disposed over the conductive traces of the first redistribution structure and underlying the bottom of the semiconductor die.

Abstract: An interactive try-on system and method for eyeglass frame, which utilizes an augmented reality module to combine an image of the consumer itself with images of various eyeglass frames. The consumer can directly see the eyeglass frame on the display device, and decide which eyeglass frame to buy, and then inform the service staff the eyeglass frame that you want to buy, whereby consumers can try a variety of different eyeglass frames.

Abstract: A control circuit including an input-output pin, an image driver, a sensing circuit, a first path, a second path and a microcontroller circuit is provided. The input-output pin is configured to be coupled to the first pin of a display device and the second pin of a capacitive touch device. The image driver is configured to provide a driving signal. The sensing circuit determines whether the capacitive touch device is touched according to the voltage of the second pin. The microcontroller circuit turns on the first path and turns off the second path to transmit the driving signal to the display device via the input-output pin in a first operation period. The microcontroller circuit turns on the second path and turns off the first path to transmit the voltage of the second pin to the sensing circuit via the input-output pin in a second operation period.

Abstract: A liquid crystal composition includes at least one of a monofunctional compound represented by Formula (1) defined herein and a monofunctional compound represented by Formula (2) defined herein, and at least one of a difunctional compound represented by Formula (3) defined herein and a multifunctional compound represented by Formula (4) defined herein.

Abstract: A method for manufacturing a semiconductor package includes the following steps. A semiconductor process is performed to form an encapsulated semiconductor device, wherein the encapsulated semiconductor device comprises an encapsulating material and a semiconductor device encapsulated by the encapsulating material. A testing apparatus including a holder body, a positioning mechanism and a force applying bar is provided. The encapsulated semiconductor device is clamed by the holder body. A clamping position of the encapsulated semiconductor device is adjusted by the positioning mechanism. The positioning mechanism is removed. A predetermined force is applied to a part of the encapsulated semiconductor device exposed by the holder body by the force applying bar. If the encapsulated semiconductor device is failed by the predetermined force, a process parameter of the semiconductor process is modified to form a modified encapsulated semiconductor device.

Abstract: A bicycle has a bicycle frame, two handle bars, and a clamping assembly. The bicycle frame has a front fork having a steerer tube mounted within a head tube of the bicycle frame and a handle mount fastened to the steerer tube and having two receiving tubes longitudinally disposed at two sides of the head tube, respectively. The two handle bars are rotatably mounted to the two receiving tubes, respectively, and each handle bar has a first section inserted inside a corresponding one of the two receiving tubes and a second section integrally fixed to the first section. The clamping assembly has two clamping units respectively mounted around the two receiving tubes and an operating unit connected to the two clamping units and being configured to abut the two clamping units for respectively clamping the two receiving tubes.

Abstract: The present disclosure provides an apparatus for fabricating a semiconductor structure, including a chuck, an edge ring surrounding the chuck, wherein the edge ring comprises a cavity, a focus ring adjacent to an edge of the chuck and over the edge ring, and a first actuator in the cavity of the edge ring and engaging with the focus ring.

Abstract: A power wrench includes an output spindle and a socket member. The output spindle has an axial through hole that extends through the output spindle and that open at two axially opposite ends of the output spindle. The socket member is connected to one of the axially opposite ends and has a first socket hole aligned with the axial through hole and configured to engage a nut or the like. The axial through hole is configured to permit passage of a bolt when the nut is tightened by the socket member.

Abstract: An electronic device includes a first body, a second body, a rotating shaft connected with the first body and the second body, at least one driving member, a third body and a flexible display. The first body and the second body rotate relatively to be folded or unfolded via the rotating shaft. The driving member is movably pivoted to the rotating shaft. The third body is movably disposed at the second body, the third body is located on a moving path of the driving member, and the third body and the driving member rotate relative to the first body to be folded or unfolded along with the second body. The flexible display is disposed at the first body and the third body, and the driving member drives the third body to move close to or away from the first body in a rotating folding or unfolding process.

Abstract: This invention discloses a novel multicomponent system or a single compound that is capable of performing triplet-triplet annihilation up conversion process. (TTA-UC) A solution or solid film that comprises this TTA-UC system or compound is provided. This system or compound can be used in an optical or optoelectronic device.

Abstract: Disclosed is a radio-frequency (RF) circuit capable of performing an RF characteristic test in a test mode. The RF circuit includes: a test signal generator generating a test signal; an RF receiver, coupled to the test signal generator, transmitting the test signal and thereby generating a receiver analog signal; a coupling circuit transmitting the receiver analog signal to an RF transmitter in the test mode; the RF transmitter transmitting the receiver analog signal and thereby generating a transmitter analog signal; a test result generator, coupled between the RF transmitter and a test result output terminal, including a signal converter for generating a converted signal according to the transmitter analog signal in the test mode, wherein the output signal at the test result output terminal is the converted signal or originated therefrom and relates to the result of the RF characteristic test.

Abstract: A semiconductor memory device includes a substrate, at least one floating gate electrode, an interlayer dielectric layer, an interconnection structure, an etching stop layer, a conductive structure, and an opening. The floating gate electrode is disposed on the substrate. The interlayer dielectric layer is disposed on the floating gate electrode. The interconnection structure is disposed in the interlayer dielectric layer. The etching stop layer is disposed on the interlayer dielectric layer. The conductive structure penetrates the etching stop layer and is electrically connected with the interconnection structure. The opening penetrates the etching stop layer and overlaps at least a part of the floating gate electrode in a thickness direction of the substrate.

Abstract: A semiconductor device includes a conductive line and a conductive via contacting the conductive line. A first dielectric material contacts a first sidewall surface of the conductive via. A second dielectric material contacts a second sidewall surface of the conductive via. The first dielectric material includes a first material composition, and the second dielectric material includes a second material composition different than the first material composition.

Abstract: Disclosed is a radio-frequency (RF) circuit capable of performing an RF characteristic test in a test mode. The RF circuit includes: a test signal generator generating a test signal; an RF receiver, coupled to the test signal generator, transmitting the test signal and thereby generating a receiver analog signal; a coupling circuit transmitting the receiver analog signal to an RF transmitter in the test mode; the RF transmitter transmitting the receiver analog signal and thereby generating a transmitter analog signal; a test result generator, coupled between the RF transmitter and a test result output terminal, including a signal converter for generating a converted signal according to the transmitter analog signal in the test mode, wherein the output signal at the test result output terminal is the converted signal or originated therefrom and relates to the result of the RF characteristic test.

Abstract: A keyboard includes a plurality of keyswitch structures and an adjusting plate movably disposed under the keyswitch structures. Each of the keyswitch structures includes a tactile feedback member. The adjusting plate includes a plate body and a plurality of adjusting bars protruding from the plate body toward the keyswitch structures and respectively corresponding to the tactile feedback members of the keyswitch structures. When the adjusting plate moves relative to the keyswitch structures, the adjusting bars drive the tactile feedback members to change tactile feedback of the keyswitch structures.

Abstract: A keyswitch structure includes a base having a positioning means, an cover combined with the base, a plunger with an cam portion movably coupling with the cover relative to the base, a restoring unit disposed between the base and the plunger to provide a restoring force to enable the plunger to move along a direction away from the base, a tactile feedback member having a positioning portion positioned by the positioning means and an extending arm extending across a moving path of the cam portion, and an adjusting unit being movable to drive the positioning portion to shift, so that the tactile feedback member has a first deformation or a second deformation, and a pressing force required for the cam portion to pass the extending arm when the plunger moves toward the base is changed.

Abstract: A light-emitting device includes a first semiconductor layer having an uppermost surface and a bottommost surface; a first light-emitting structure and a second light-emitting structure formed on the same first semiconductor layer, wherein the first semiconductor layer is continuous; a first trench formed between the first and the second light-emitting structures; and a second electrode formed on the second semiconductor layer and including a second pad and a plurality of second extending parts extending from the second pad; wherein the second pad is between the first and the second light-emitting structures, and the plurality of second extending parts extends to the first and the second light-emitting structures, respectively; wherein the first trench passes through the uppermost surface but does not extend to the bottommost surface; wherein the first trench includes an equal width in a top view.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first metal wire arranged within an inter-level dielectric (ILD) layer over a substrate. A second metal wire is arranged within the ILD layer and is laterally separated from the first metal wire by an air-gap. A dielectric layer is arranged over the first metal wire and the second metal wire. The dielectric layer has a curved surface along a top of the air-gap. The curved surface of the dielectric layer is a smooth curved surface that continuously extends between opposing sides of the air-gap. A via is disposed on and over the second metal wire.