Abstract: The present invention provides a method for fabricating patterned cellulose nanocrystal (CNC) composite nanofibers and thin films for optical and electromagnetic sensor and actuator application, comprising the following steps of: selecting materials for fabricating patterned cellulose nanocrystal (CNC) composite nanofibers; and fabricating patterned CNCs composite nanofibers by incorporating secondary phases either during electrospinning or post-processing, wherein the secondary phases may include dielectrics, electrically or magnetically activated nanoparticles or polymers and biological cells mechanically reinforced by CNCs.

Abstract: The present invention provides a method for fabricating patterned cellulose nanocrystal (CNC) composite nanofibers and thin films for optical and electromagnetic sensor and actuator application, comprising the following steps of: selecting materials for fabricating patterned cellulose nanocrystal (CNC) composite nanofibers; and fabricating patterned CNCs composite nanofibers by incorporating secondary phases either during electrospinning or post-processing, wherein the secondary phases may include dielectrics, electrically or magnetically activated nanoparticles or polymers and biological cells mechanically reinforced by CNCs.

Abstract: The present invention provides a method for fabricating patterned cellulose nanocrystal (CNC) composite nanofibers and thin films for optical and electromagnetic sensor and actuator application, comprising the following steps of: selecting materials for fabricating patterned cellulose nanocrystal (CNC) composite nanofibers; and fabricating patterned CNCs composite nanofibers by incorporating secondary phases either during electrospinning or post-processing, wherein the secondary phases may include dielectrics, electrically or magnetically activated nanoparticles or polymers and biological cells mechanically reinforced by CNCs.

Abstract: A substrate and a method for manufacturing the substrate. The substrate is suitable for mounting at least one semiconductor die onto a printed circuit board. The substrate comprises two opposing stacks, with each stack comprising alternating layers of copper and electrically insulating film. The film and the copper have different co-efficients of thermal expansion, allowing the warpage behaviour of the substrate to be controlled by providing the substrate with different film thicknesses between the opposing stacks.

Abstract: A Dynamic Random Access Memory (DRAM) capacitor and a preparation method therefor are provided. The DRAM capacitor includes a dielectric layer, and the dielectric layer includes a high dielectric material layer, and low dielectric loss material layers provided on both side surfaces of the high dielectric material layer.

Abstract: A premixed co-evaporation source that is a mixture of a first compound and a second compound is disclosed. The co-evaporation source is for vacuum deposition process. The first compound has a different chemical structure than the second compound. The first compound and the second compound are both organic compounds. At least one of the first compound and the second compound contains at least one less abundant stable isotope atom. At least one of the first compound and the second compound is a fluorescent or delayed fluorescent emitter. The first compound has an evaporation temperature T1 of 100 to 400° C.; the second compound has an evaporation temperature T2 of 100 to 400° C.; the absolute value of T1?T2 is less than 20° C.

Abstract: A transformer device includes first to third coils. The first coil includes first segments and a first connecting portion. The first segments are coupled to each other through the first connecting portion. The second coil includes second segments and second connecting portions. The second segments are coupled to each other through the second connecting portions. The third coil includes third segments and third connecting portions. The third segments form a ring structure through the third connecting portions, in order to couple the first coil and the second coil. A first portion of the first segments and a second portion of the second segments are arranged in a range of the ring structure, the first portion of the first segments is arranged in a range of the second coil, and the second portion of the second segments is arranged in a range of the first coil.

Abstract: A transformer device includes a first coil, a second coil, and a third coil. The first coil includes first segments and at least one first connecting portion, in which the first segments are coupled to each other through the at least one first connecting portion. The second coil includes second segments and second connecting portions, in which the of second segments are coupled to each other through the second connecting portions. The third coil is configured to couple the first coil and the second coil. The third coil includes third segments and third connecting portions, a part of the plurality of third segments are coupled in parallel with each other through the third connecting portions, and at least one part of the first segments and at least one part of the second segments are arranged between the part of the third segments.

Abstract: A method for manufacturing a semiconductor package includes the following steps. A semiconductor process is performed to form an encapsulated semiconductor device, wherein the encapsulated semiconductor device comprises an encapsulating material and a semiconductor device encapsulated by the encapsulating material. A testing apparatus including a holder body, a positioning mechanism and a force applying bar is provided. The encapsulated semiconductor device is clamed by the holder body. A clamping position of the encapsulated semiconductor device is adjusted by the positioning mechanism. The positioning mechanism is removed. A predetermined force is applied to a part of the encapsulated semiconductor device exposed by the holder body by the force applying bar. If the encapsulated semiconductor device is failed by the predetermined force, a process parameter of the semiconductor process is modified to form a modified encapsulated semiconductor device.

Abstract: Example stylus holders for an electronic device are disclosed herein. In an example, the stylus holder is coupled to an outer housing of the electronic device. In addition, the stylus holder includes a sleeve that is to transition between: an extended position, in which the sleeve is projected out of the aperture of the outer housing; and a retracted position, in which the sleeve is retracted into the aperture of the outer housing from the extended position. Further, the stylus holder includes a biasing member disposed within the outer housing and coupled to the sleeve. The biasing member is to bias the sleeve toward the retracted position when the sleeve is in the extended position.

Abstract: A graphics system includes an effect engine, which executes a predefined set of graphics operations having a higher computational complexity than pipeline operations. The graphics system further includes a graphics pipeline operative to perform the pipeline operations on graphical objects in a frame. The effect engine is operative to execute the predefined set of graphics operations on a subset of the graphical objects in the frame. One or more buffers are operative to receive pixels of the frame for display. The frame includes the graphical objects operated on by the graphics pipeline and the subset of the graphical objects operated on by the effect engine.

Abstract: The present invention provides a method for fabricating patterned cellulose nanocrystal (CNC) composite nanofibers and thin films for optical and electromagnetic sensor and actuator application, comprising the following steps of: selecting materials for fabricating patterned cellulose nanocrystal (CNC) composite nanofibers; and fabricating patterned CNCs composite nanofibers by incorporating secondary phases either during electrospinning or post-processing, wherein the secondary phases may include dielectrics, electrically or magnetically activated nanoparticles or polymers and biological cells in mechanically reinforced by CNCs.

Abstract: The present disclosure provides a fluid-optical encryption system and a method thereof. The fluid-optical encryption system uses a fluid surface that changes topology over time to modulate the wave front of an electromagnetic signal in an encryption, decryption, authentication or other communication system. The electromagnetic signal can be pulsed or continuous, coherent or non-coherent, and can be optical or in another wavelength range such as micrometer or infrared. The information carrying signal is either transmitted through the fluid system or reflected off the surface of the fluid system. The fluid system time dependent change can be induced by mechanical vibration in the fluid container, distorting the fluid container, acoustic waves through the fluid, or by surface tension changes at the boundary of the fluid cause by electrowetting or electrostatic effects. The fluid surface can exhibit patterns that oscillate or change periodically, or change in a chaotic manner.

Abstract: The present disclosure provides an apparatus for manufacturing a semiconductor structure. The apparatus includes a stage, an optical transceiver over the stage, configured to obtain a first profile of a first surface of a substrate, an acoustic transceiver over the stage, configured to obtain a second profile of a top surface of a photo-sensitive layer over the substrate, wherein the stage is adapted to be displaced based on the first profile and the second profile.

Abstract: A polishing delivery apparatus, configured to provide slurry and rinse agent to a polishing pad, includes a delivery arm, at least one first nozzle, and at least one second nozzle. The delivery arm is rotatably connected to the polishing pad and has an arc-shaped top surface facing away from the polishing pad, a bottom surface facing away from the arc-shaped top surface, and a recess indenting from the bottom surface. The first nozzle is mounted on the bottom surface of the delivery arm and has a first nozzle head facing toward the polishing pad. The second nozzle is mounted in the recess of the delivery arm and has three second nozzle heads, in which one of the three second nozzle heads faces toward the polishing pad, and the other two of the three second nozzle heads face toward sidewalls of the recess.

Abstract: A device includes a nanowire, a gate dielectric layer, a gate electrode, a gate pickup metal layer, and a gate contact. The nanowire extends in a direction perpendicular to a top surface of a substrate. The gate dielectric layer laterally surrounds the nanowire. The gate electrode laterally surrounds the gate dielectric layer. The gate pickup metal layer is in contact with a bottom surface of the gate electrode and extends laterally past opposite sidewalls of the gate electrode. The gate contact is in contact with the gate pickup metal layer.

Abstract: A management controller is coupled to a plurality of external devices. The management controller includes a control circuit and a transmission circuit. The control circuit generates a control signal according to a first counting value and a second counting value. The transmission circuit is coupled to the external devices. In response to the first counting value not being equal to a first target value, the transmission circuit enters a circulating mode according to the control signal. In the circulating mode, the transmission circuit triggers the external devices in order. In response to the second counting value not being equal to a second target value, the transmission circuit continues to operate in the circulating mode. In response to the second counting value being equal to the second target value, the transmission circuit exits the circulating mode.

Abstract: A head-mounted display includes a host, two installing bases, two connection elements and a head belt. The host has two installing grooves and two opposite sidewalls, and the two installing grooves respectively penetrate through the two sidewalls. The two installing bases are disposed in the host, wherein each installing base has an abutting portion and an installing portion connected to each other. The abutting portion of each installing base abuts against an inner edge of the corresponding sidewall, and the installing portion of each installing base is exposed outside of the host through the corresponding installing groove. The two connection elements are respectively installed onto the two installing portions of the two installing bases. The head belt has two opposite connection portions, and the two connection portions are respectively connected to the two connection elements.

Abstract: A waveform generator is provided. The waveform generator includes a timer and a digital to analog converter (DAC). The timer periodically provides a trigger signal according to a fixed time period. In response to the trigger signal, the DAC is configured to convert first digital data into output voltage of an analog signal. A data hold register is configured to store second digital data that corresponds to the previous output voltage of the analog signal. A judgment circuit is configured to provide a first control signal according to the second digital data, and the first control signal indicates that the previous output voltage is within a first voltage range. A calculation circuit is configured to obtain the first digital data according to the second control signal, the second digital data, and a voltage variation that corresponds to the first voltage range and to update the second digital data.

Abstract: An electronic device includes a housing that defines an aperture, and a display assembly positioned in the aperture. The display assembly can include a display layer having a first portion, and a second portion bending at least partially below the first portion. The first portion and the second portion can define a bend volume, and a potting material can be disposed in the bend volume, such that the potting material contacts the first portion and the second portion. An internal enclosure can be contoured to the display assembly.