Abstract: Methods of forming contacts for source/drain regions and a contact plug for a gate stack of a finFET device are disclosed herein. Methods include etching a contact opening through a dielectric layer to expose surfaces of a first source/drain contact and repairing silicon oxide structures along sidewall surfaces of the contact opening and along planar surfaces of the dielectric layer to prevent selective loss defects from occurring during a subsequent selective deposition of conductive fill materials and during subsequent etching of other contact openings. The methods further include performing a selective bottom-up deposition of conductive fill material to form a second source/drain contact. According to some of the methods, once the second source/drain contact has been formed, the contact plug may be formed over the gate stack.

Abstract: Connection structures and methods of manufacture in which a conductive structure is disposed between, and in electrical contact with, pluralities of via structures. Each via structure is laterally offset from adjacent via structures to avoid stacked vias, and each via is electrically connected to at least two additional vias on a level of a semiconductor device, through conductive traces and footprints of the connection structure.

Abstract: A pre-cleaning technique described herein may be used to remove native oxides and/or other contaminants from a semiconductor device in a manner in which the likelihood of chopping, clipping, and/or sidewall spacer thickness reduction is reduced. As described herein, a protection layer is formed on a capping layer over a gate structure of a transistor. A pre-cleaning operation is then performed to remove native oxides from the top surface of a source/drain region of the transistor. In the pre-cleaning operation, the protection layer is consumed instead of the material of the capping layer. In this way, the use of the protection layer reduces the likelihood of removal of material from the capping layer and/or reduces the amount of material that is removed from the capping layer during the pre-cleaning operation.

Abstract: Methods of forming a semiconductor device structure are described. In some embodiments, the method includes forming a contact opening in an interlayer dielectric (ILD) layer disposed over an epitaxy source/drain region and forming a metal layer in the contact opening. The metal layer includes top portions, side portions, and a bottom portion, and a space is defined between the top portions of the metal layer. The method further includes performing a gradient metal removal process on the metal layer to enlarge the space, forming a sacrificial layer in the contact opening, recessing the sacrificial layer in the contact opening to expose a portion of the sidewall portions, removing the top portions and the exposed portion of the sidewall portions, removing the sacrificial layer, and forming a bulk metal layer on the bottom portion of the metal layer.

Abstract: A method includes clustering cells in a group of cells into a selected number of clusters, and ranking the clusters based on a list of prioritized features to generate a list of ranked clusters. The method also includes ranking cells in each of one or more ranked clusters in the list of ranked clusters, based on the list of prioritized features, to generate a list of ranked critical cells. The method further includes outputting the list of ranked critical cells for use in adjusting cell layouts based on the ranked critical cells.

Abstract: The present disclosure discloses a memory access interface device. A data processing circuit receives a data signal including 2M pieces of data from a memory device. A sampling clock generation circuit receives a data strobe signal from the memory device to generate a valid data strobe signal having P valid strobe pulses and further generate a sampling clock signal accordingly, in which P is larger than M. A sampling circuit samples the data signal according to the sampling clock signal to generate sampling results. A control circuit determines valid sampling results according to a time difference between the valid data strobe signal and the data signal and outputs valid data generated according to the valid sampling results as a read data signal to a memory access controller.

Abstract: A semiconductor device with multiple silicide regions is provided. In embodiments a first silicide precursor and a second silicide precursor are deposited on a source/drain region. A first silicide with a first phase is formed, and the second silicide precursor is insoluble within the first phase of the first silicide. The first phase of the first silicide is modified to a second phase of the first silicide, and the second silicide precursor being soluble within the second phase of the first silicide. A second silicide is formed with the second silicide precursor and the second phase of the first silicide.

Abstract: The present disclosure provides an interconnect structure and a method for forming an interconnect structure. The method for forming an interconnect structure includes forming a bottom metal line in a first interlayer dielectric layer, forming a second interlayer dielectric layer over the bottom metal line, exposing a top surface of the bottom metal line, increasing a total surface area of the exposed top surface of the bottom metal line, forming a conductive via over the bottom metal line, and forming a top metal line over the conductive via.

Abstract: A processor circuit sends a read request. A clock signal of the processor circuit corresponds to a first counting value. A memory circuit stores data and sends a data strobe signal in response to the read request. The data strobe signal corresponds to a second counting value. The processor circuit includes a selector circuit and a feedback circuit. The selector circuit selects and outputs a flag signal from a plurality of flag control signals according to the second counting value. The feedback circuit generates an enable signal according to a set signal associated with the first counting value, the flag signal associated with the second counting value, and a data strobe gate signal, and generates the data strobe gate signal according to the enable signal and the data strobe signal. The processor circuit reads the data according to the data strobe gate signal.

Abstract: A method of fabricating a contact structure includes the following steps. An opening is formed in a dielectric layer. A conductive material layer is formed within the opening and on the dielectric layer, wherein the conductive material layer includes a bottom section having a first thickness and a top section having a second thickness, the second thickness is greater than the first thickness. A first treatment is performed on the conductive material layer to form a first oxide layer on the bottom section and on the top section of the conductive material layer. A second treatment is performed to remove at least portions of the first oxide layer and at least portions of the conductive material layer, wherein after performing the second treatment, the bottom section and the top section of the conductive material layer have substantially equal thickness.

Abstract: The present disclosure discloses a memory access interface device. A data processing circuit receives a data signal including 2M pieces of data from a memory device. A sampling clock generation circuit receives a data strobe signal from the memory device to generate a valid data strobe signal having P valid strobe pulses and further generate a sampling clock signal accordingly, in which P is larger than M. A sampling circuit samples the data signal according to the sampling clock signal to generate sampling results. A control circuit determines valid sampling results according to a time difference between the valid data strobe signal and the data signal and outputs valid data generated according to the valid sampling results as a read data signal to a memory access controller.

Abstract: A semiconductor device with multiple silicide regions is provided. In embodiments a first silicide precursor and a second silicide precursor are deposited on a source/drain region. A first silicide with a first phase is formed, and the second silicide precursor is insoluble within the first phase of the first silicide. The first phase of the first silicide is modified to a second phase of the first silicide, and the second silicide precursor being soluble within the second phase of the first silicide. A second silicide is formed with the second silicide precursor and the second phase of the first silicide.

Abstract: A manufacturing method of a semiconductor device includes the following steps. A III-V compound barrier layer is formed on a III-V compound semiconductor layer. A passivation layer is formed on the III-V compound barrier layer. A silicon layer is formed on the passivation layer, the III-V compound barrier layer, and the III-V compound semiconductor layer. A silicon implantation process is performed to the III-V compound semiconductor layer for forming a source doped region and a drain doped region in the III-V compound semiconductor layer under the silicon layer. A source electrode and a drain electrode are formed on the silicon layer. A source silicide layer is formed between the source electrode and the source doped region, and a drain silicide layer is formed between the drain electrode and the drain doped region. The source silicide layer and the drain silicide layer are partly formed on the passivation layer.

Abstract: A system and method for image-guided microscopic illumination are provided. A processing module controls an imaging assembly such that a camera acquires an image or images of a sample in multiple fields of view, and the image or images are automatically transmitted to a processing module and processed by the first processing module automatically in real-time based on a predefined criterion so as to determine coordinate information of an interested region in each field of view. The processing module also controls an illuminating assembly to illuminate the interested region of the sample according to the received coordinate information regarding to the interested region, with the illumination patterns changing among the fields of view.

Abstract: The invention provides a semiconductor structure, the semiconductor structure includes a substrate, a resistance random access memory on the substrate, an upper electrode, a lower electrode and a resistance conversion layer between the upper electrode and the lower electrode, and a cap layer covering the outer side of the resistance random access memory, the cap layer has an upper half and a lower half, and the upper half and the lower half contain different stresses.

Abstract: A semiconductor device and related manufacturing methods are provided. The semiconductor device includes one interconnection structure including: a substrate; a first insulating dielectric layer underneath a lower surface of the substrate; a second insulating dielectric layer on an upper surface of the substrate; a first connecting pad disposed within the first insulating dielectric layer; a metal connection member penetrating through a portion of the second insulating dielectric layer, the substrate and a portion of the first insulating dielectric layer to connect the first connecting pad; and a second connecting pad disposed within the second insulating dielectric layer and connecting the metal connection member. The metal connection member may be a Through-Silicon Via (TSV). The device includes a confined air gap surrounding the metal connection member, which improves the performance and reliability of the device.

Abstract: A method for calibrating a data reception window includes: (A) setting a level of a reference voltage by different predetermined values and repeatedly sampling a data signal to obtain multiple first valid data reception windows; (B) establishing a first eye diagram based on the first valid data reception windows; (C) resetting the level of the reference voltage by the predetermined values combined with a first offset and repeatedly sampling the data signal according to the reference voltage to obtain multiple second valid data reception windows and (D) selectively updating the first eye diagram according to the second valid data reception windows. When width of a second valid data reception window is greater than width of a first valid data reception window corresponding to the same predetermined value, the first valid data reception window in the first eye diagram is replaced by the second valid data reception window.

Abstract: A wearable display device, including an optical waveguide element and a projection device, is provided. The projection device includes an optical engine main body, a light emitting unit, an optical combiner, a projection lens, and a connection assembly. The light emitting unit is connected to the optical engine main body and configured to emit an illumination beam. The optical combiner is disposed in the optical engine main body, located on a transmission path of the illumination beam, and configured to guide the illumination beam to form an image beam. The projection lens is connected to the optical engine main body, located on a transmission path of the image beam, and configured to project the image beam. The connection assembly includes a flexible circuit board and a system connector. The light emitting unit is connected to the flexible circuit board and electrically connected to the system connector.

Abstract: An adjustable dumbbell includes a handle assembly and weight assemblies. The weight assemblies connect ends of the handle assembly. Each weight assembly includes an outer shell assembly, a counterweight element, and a locking assembly. The outer shell assembly includes a housing, the housing is connected to the handle assembly. A receiving cavity is defined in the housing. An opening communicated with the receiving cavity is defined at a side of the housing facing the handle assembly. The counterweight element is detachably received in the receiving cavity. The counterweight is fixed with the outer shell assembly by the locking element. The adjustable dumbbell of the disclosure hides the counterweight element, locking element, and two ends of the handle assembly in the outer shell element, prevents the counterweight element from shaking and making abnormal noise due to collision, and raising appearance beauty of the adjustable dumbbell.

Abstract: A fabricating method of reducing photoresist footing includes providing a silicon nitride layer. Later, a fluorination process is performed to graft fluoride ions onto a top surface of the silicon nitride layer. After the fluorination process, a photoresist is formed to contact the top surface of the silicon nitride layer. Finally, the photoresist is patterned to remove at least part of the photoresist contacting the silicon nitride layer.