Patents by Inventor Chih-Wei Chen

Chih-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12723823
    Abstract: A blade vapor chamber structure and a manufacturing method thereof are disclosed. The blade vapor chamber structure includes a vapor chamber, a thermal conductive part and a seal ring module, the vapor chamber includes a casing with a through opening; the thermal conductive part is inserted in the through opening and has a peripheral wall; the seal ring module surrounds outside of the peripheral wall and seals the through opening, and includes two ring parts and solder layer, each ring part is formed by multiple blocks, a gap is formed between two adjacent blocks, the gaps of the ring part at the upper layer and the gaps of the ring part at the lower layer are misaligned, and a solder layer is filled between two adjacent ring parts, between the ring part at the lower layer and casing, between the peripheral wall and each ring part, and in each gap.
    Type: Grant
    Filed: September 12, 2024
    Date of Patent: September 1, 2026
    Assignee: JWS TECHNOLOGY CO., LTD.
    Inventors: Pang-Hung Liao, Chih-Wei Chen, Chien-Chiang Kang, Ming-Chan Wu
  • Patent number: 12674626
    Abstract: A loop heat pipe one-way circulation device includes a lower cover plate and an upper casing closely connected to the lower cover plate. The upper casing includes a fluid inlet, a fluid outlet, a joint surface, a heat absorption area and a gas discharge cavity. The joint surface is in close contact with the lower cover plate, and the heat absorption area is formed between the fluid inlet and the fluid outlet. In addition, the heat absorption area includes a heat absorption area inner surface height, and the gas discharge cavity has a gas discharge cavity height, and the gas discharge cavity height is greater than the heat absorption area inner surface height.
    Type: Grant
    Filed: April 26, 2024
    Date of Patent: July 7, 2026
    Assignee: Auras Technology Co., Ltd.
    Inventors: Chih-Wei Chen, Kang-Ming Fan
  • Patent number: 12663220
    Abstract: A heat dissipation device is provided and includes: a first vapor chamber having a first chamber and two first openings; and a second vapor chamber disposed on the first vapor chamber and having a second chamber, two bending portions and a middle portion. The two bending portions are inserted into the two first openings respectively to connect the first vapor chamber, such that the second chamber is in communication with the first chamber.
    Type: Grant
    Filed: November 29, 2023
    Date of Patent: June 23, 2026
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Yi-Le Cheng, Jyun-Wei Huang, Cheng-Ju Chang, Chih-Wei Chen, Tien-Yao Chang, Che-Wei Kuo
  • Publication number: 20260129976
    Abstract: An electrostatic discharge protection device includes a diode, a voltage clamping component, an electronic component, a first pin, and a second pin. The diode includes a first doped area of a first conductivity type and a second doped area of a second conductivity type opposite to the first conductivity type. The voltage clamping component is electrically connected to the first doped area. The electronic component includes a first region of the first conductivity type, a second region of the second conductivity type, a third region of the first conductivity type, and a fourth region of the second conductivity type. The first region is electrically connected to the second doped area. The second region is electrically connected to the first doped area and the voltage clamping component. The fourth region is electrically connected to the voltage clamping component.
    Type: Application
    Filed: November 6, 2024
    Publication date: May 7, 2026
    Applicant: AMAZING MICROELECTRONIC CORP.
    Inventors: Chih-Wei CHEN, Kuan-Yu LIN, Kun-Hsien LIN
  • Patent number: 12618494
    Abstract: A sealing workpiece applied to a piece of vacuum testing equipment is provided, including a first cover, including a mounting portion and a joint portion integrally formed with the mounting portion, the mounting portion is mounted to the vacuum testing equipment, the mounting portion includes a first opening closing to the vacuum testing equipment, and communicated with an external connection hole of the vacuum testing equipment, the joint portion includes a second opening communicated with the first opening; a second cover, the first cover is connected to the second cover through the joint portion; when the first cover and the second cover are connected, the first cover and the second cover engage to form a third opening communicating with the first opening, the third opening is away from the vacuum testing equipment, a diameter of the third opening is less than a diameter of the first opening.
    Type: Grant
    Filed: March 26, 2025
    Date of Patent: May 5, 2026
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Chih-Wei Chen, Chang-Hsien Chen, Wei-Ting Chien
  • Patent number: 12621955
    Abstract: A heat dissipation device includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. In addition, the inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion so that the inclined heat dissipation area of the inclined heat pipe forms a predetermined angle relative to a horizontal plane.
    Type: Grant
    Filed: April 11, 2024
    Date of Patent: May 5, 2026
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chih-Wei Chen, Kang-Ming Fan, Tsung-Han Tsai, Fu-Hsuan Hsieh, Chien-Yu Liu
  • Patent number: 12577767
    Abstract: A bathtub overflow pipe includes an overflow pipe, an adapter and a over. The overflow pipe includes an extending section with an outlet. The adapter is connected to the end face of the extending section of the overflow pipe by bolts. The adapter includes a sleeve and a tab extending radially from one end of the sleeve. The sleeve includes a passage and is inserted into the outlet of the overflow pipe. The tab has a recess formed to its lower edge and communicating with the outlet for drainage. The cover includes a pillar and a rim which has a recessed area. The pillar extends axially from one of two sides of the cover and has a rib. The pillar extends through the passage of the adapter, the rib is slidably engaged with the recessed rail. The cover, the adapter and the overflow pipe can be precisely and easily assembled.
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: March 17, 2026
    Assignees: Bridging Partners Corporation, Unik Industry Limited
    Inventors: Kuang-Ming Kuo, Chih-Wei Chen
  • Publication number: 20260075752
    Abstract: An immersion heat dissipation structure includes: a heat dissipating fin set, having a plurality of heat dissipating fins parallelly disposed and a plurality of spaced flow channels arranged between each of the two adjacent heat dissipating fins, each heat dissipating fin having a notch inwardly formed from an outer circumference thereof, a recessed passageway being defined by the plurality of the notches, and the recessed passageway and the plurality of the spaced flow channels communicating with each other; and a sealed housing, covering an outer side of the plurality of the heat dissipating fins and having has at least one liquid input port arranged corresponding to the recessed passageway and at least one liquid output port arranged corresponding to the plurality of the spaced flow channels. Accordingly, a desirable heat dissipating efficiency is provided.
    Type: Application
    Filed: September 6, 2024
    Publication date: March 12, 2026
    Inventors: Pang-Hung LIAO, Chih-Wei CHEN, Chia-Yi CHUANG
  • Publication number: 20260071825
    Abstract: A blade vapor chamber structure and a manufacturing method thereof are disclosed. The blade vapor chamber structure includes a vapor chamber, a thermal conductive part and a seal ring module, the vapor chamber includes a casing with a through opening; the thermal conductive part is inserted in the through opening and has a peripheral wall; the seal ring module surrounds outside of the peripheral wall and seals the through opening, and includes two ring parts and solder layer, each ring part is formed by multiple blocks, a gap is formed between two adjacent blocks, the gaps of the ring part at the upper layer and the gaps of the ring part at the lower layer are misaligned, and a solder layer is filled between two adjacent ring parts, between the ring part at the lower layer and casing, between the peripheral wall and each ring part, and in each gap.
    Type: Application
    Filed: September 12, 2024
    Publication date: March 12, 2026
    Inventors: Pang-Hung LIAO, Chih-Wei CHEN, Chien-Chiang KANG, Ming-Chan WU
  • Patent number: 12566033
    Abstract: This disclosure is directed to a three-dimensional vapor chamber device having a thermal base, a vertical thermal plate arranged up-right on the thermal base, and a working fluid accommodated in the thermal base and may flow to the vertical thermal plate. A first chamber having a first capillary structure is defined in the thermal base. A second chamber having a second capillary structure is defined in the vertical thermal plate. The first chamber and the second chamber are connected with an inlet and a return port. The second chamber has a flow channel structure connected between the inlet and the return port. The working fluid may flow to the second chamber through the inlet, pass the flow channel structure and return to the first chamber through the return port, so to define a specific flow path leading to a desirable and stable heat transfer efficiency.
    Type: Grant
    Filed: December 8, 2023
    Date of Patent: March 3, 2026
    Assignee: JWS TECHNOLOGY CO., LTD.
    Inventors: Cheng-Tu Wang, Pang-Hung Liao, Chih-Wei Chen
  • Publication number: 20260033011
    Abstract: A transient voltage suppression device includes at least one N-type lightly-doped structure, a first P-type well, a second P-type well, a first N-type heavily-doped area, and a second N-type heavily-doped area. The first P-type well and the second P-type well are formed in the N-type lightly-doped structure. The first N-type heavily-doped area and the second N-type heavily-doped area are respectively formed in the first P-type well and the second P-type well. The doping concentration of the first P-type well is higher than that of the second P-type well. The first P-type well and the second P-type well can be replaced with P-type lightly-doped wells respectively having P-type heavily-doped areas under the N-type heavily-doped areas.
    Type: Application
    Filed: September 26, 2025
    Publication date: January 29, 2026
    Applicant: AMAZING MICROELECTRONIC CORP.
    Inventors: Chih-Wei CHEN, Kuan-Yu LIN, Mei-Lian FAN, Kun-Hsien LIN
  • Patent number: 12492493
    Abstract: A woven brushed elastic fabric includes a fabric blank and a plurality of yarn segments. The fabric blank is formed by interweaving a plurality of first yarns and composite yarns. Each composite yarn is composed of a second yarn and an elastic yarn. The second yarn is wound around the elastic yarn. The fabric blank has a first side, and a second side opposite to the first side and formed with a plurality of yarn loops. The yarn loops are formed by the interweaving of the first yarns and the composite yarns in a skip manner along a first direction or a second direction transverse to the first direction. The yarn segments are formed on the second side of the fabric blank by breaking at least some of the yarn loops.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: December 9, 2025
    Assignee: SINGTEX INDUSTRIAL CO., LTD.
    Inventors: Kuo-Chin Chen, Sung-Yun Huang, Chia-Cheng Chou, Chih-Wei Chen, Li-Hsun Chang
  • Patent number: 12492869
    Abstract: An immersion liquid cooling heat sink includes a substrate, a fin assembly and a housing. The fin assembly is disposed on the substrate and includes a first fin module and a second fin module, both having multiple passages. Each passage has an inlet and an outlet, the first and second fin modules are spaced from each other to form a first groove which communicate between each inlet of the first fin module and each inlet of the second fin module. The housing is disposed on the substrate and has a first liquid inlet port, and covers the entire fin assembly and exposes each outlet. The first liquid inlet port is arranged corresponding to the first groove and communicates to the first groove, so as to enable a dielectric fluid to flow directly from the mid-section to two ends of the fin assembly.
    Type: Grant
    Filed: January 31, 2024
    Date of Patent: December 9, 2025
    Assignee: JWS TECHNOLOGY CO., LTD.
    Inventors: Pang-Hung Liao, Chih-Wei Chen, Shih-Ming Wang
  • Patent number: 12471383
    Abstract: A transient voltage suppression device includes at least one N-type lightly-doped structure, a first P-type well, a second P-type well, a first N-type heavily-doped area, and a second N-type heavily-doped area. The first P-type well and the second P-type well are formed in the N-type lightly-doped structure. The first N-type heavily-doped area and the second N-type heavily-doped area are respectively formed in the first P-type well and the second P-type well. The doping concentration of the first P-type well is higher than that of the second P-type well. The first P-type well and the second P-type well can be replaced with P-type lightly-doped wells respectively having P-type heavily-doped areas under the N-type heavily-doped areas.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: November 11, 2025
    Assignee: AMAZING MICROELECTRONIC CORP.
    Inventors: Chih-Wei Chen, Kuan-Yu Lin, Mei-Lian Fan, Kun-Hsien Lin
  • Patent number: 12461211
    Abstract: Apparatuses for detecting distance and methods thereof are provided. First, a first distance measurement mode and a second distance measurement mode can be executed by using an apparatus having a distance measurement capability, and the apparatus has an anti-vibration module. When the first distance measurement mode is executed, the anti-vibration module is electrically connected to perform distance measurement, and a first distance measurement result is obtained, wherein the maximum movement compensation amount of the anti-vibration module is a first value. When the second distance measurement mode is executed, the anti-vibration module is electrically connected to perform distance measurement, and a second distance measurement result is obtained, wherein the maximum movement compensation amount of the anti-vibration module is a second value, and the first value is greater than the second value.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: November 4, 2025
    Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.
    Inventors: Chia-Heng Chen, Ming-Sheng Chi, Chih-Wei Chen
  • Patent number: 12432882
    Abstract: A flexible vapor chamber includes a first flexible casing, a second flexible casing, a plurality of capillary strips and a plurality of inner capillary layers. The capillary strips are installed between the first flexible casing and the second flexible casing, and the inner capillary layers are arranged between the first flexible casing and the second flexible casing, and the capillary strips.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: September 30, 2025
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chih-Wei Chen, Che-Wei Kuo, Tien-Yao Chang, Hsiang-Chih Chuang, Pin-Jei Chen, Tsung-Min Liu
  • Patent number: 12430542
    Abstract: A system receives a neural network model that includes asymmetric operations. Each asymmetric operation includes one or more fixed-point operands that are asymmetrically-quantized from corresponding floating-point operands. The system compiles a given asymmetric operation of the neural network model into a symmetric operation that includes a combined bias value. A compiler computes the combined bias value is a constant by merging at least zero points of input and output of the given asymmetric operation. The system then generates a symmetric neural network model including the symmetric operation for inference hardware to execute in fixed-point arithmetic.
    Type: Grant
    Filed: June 12, 2022
    Date of Patent: September 30, 2025
    Assignee: MediaTek Inc.
    Inventors: Chih-Wen Goo, Pei-Kuei Tsung, Chih-Wei Chen, Mingen Shih, Shu-Hsin Chang, Po-Hua Huang, Ping-Yuan Tsai, Shih-Wei Hsieh, You Yu Nian
  • Patent number: D1099030
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: October 21, 2025
    Assignee: Delta Electronics, Inc.
    Inventors: Chen-Hsien Chang, Chih-Wei Chen, Feng-Pin Hsu
  • Patent number: D1134249
    Type: Grant
    Filed: June 13, 2023
    Date of Patent: July 14, 2026
    Assignee: Artilux, Inc.
    Inventors: Cheng-Te Yu, Chih-Wei Chen
  • Patent number: D1136752
    Type: Grant
    Filed: November 30, 2022
    Date of Patent: July 28, 2026
    Assignee: Botrista, Inc.
    Inventors: Wu-Chou Kuo, Yu Wei Chen, Yu-Min Lee, Chih-Wei Chen