Patents by Inventor Chih-Wei Chen
Chih-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11764162Abstract: An electronic package and a manufacturing method thereof are provided, where a plurality of shielding wires are arranged on a carrier and spanning across an electronic component to cover the electronic component, so that the shielding wires serve as a shielding structure to protect the electronic component from the interference of external electromagnetic waves.Type: GrantFiled: August 19, 2020Date of Patent: September 19, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Chih-Wei Chen, Tsung-Hsien Tsai, Chao-Ya Yang, Chia-Yang Chen
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Patent number: 11747092Abstract: A vapor chamber and a heat dissipation device with the vapor chamber are provided. The vapor chamber includes a first plate, a second plate, a first capillary strip, a first communication structure and a working medium. An accommodation space is defined by the first plate and the second plate collaboratively. The first capillary strip is installed in the accommodation space. The accommodation space is divided into a first region and a second region by the first capillary strip. The working medium is accommodated within the accommodation space. The working medium flows between the first region and the second region through the first communication structure. Since the working medium is guided to flow in the accommodation space by the first capillary strip and the first communication structure, the heat dissipating efficacy is enhanced.Type: GrantFiled: August 17, 2022Date of Patent: September 5, 2023Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chih-Wei Chen, Chien-Fu Liu, Guan-Cing Liu
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Patent number: 11747091Abstract: A fast heat-sinking device for evaporators according to the present invention is disclosed, comprising at least one heat-sinking component which is formed by means of conjunctively assembling an outer wall board and an inner wall board; the interior of the outer wall board includes a semi-open first evaporation area; the interior of the inner wall board includes a semi-open second evaporation area, and the inner wall board is concavely configured with a gap; as such, the inner wall board is attached onto one side of the outer wall board thus further being assembled into the heat-sinking component, and the first evaporation area and the second evaporation area are connected in communication at the notch so as to together form an air concentration area, as a heat-sinking structure of the evaporator.Type: GrantFiled: May 18, 2021Date of Patent: September 5, 2023Assignee: LDC PRECISION ENGINEERING CO., LTD.Inventors: Chi-Feng Hsu, Cheng-Jen Liang, Chih-Wei Chen
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Publication number: 20230269908Abstract: A heat dissipation device includes a vapor chamber for contacting a heat source; at least one heat pipe having a first end and a second end connected to the vapor chamber; at least one partition disposed inside the heat pipe to partition the inside of the heat pipe into a first channel and a second channel isolated from each other; and a heat dissipation fin set disposed on the vapor chamber and partially covers the heat pipe. The vapor chamber is filled with a liquid working medium that absorbs the heat of the heat source and then gasifies into a gaseous working medium. The gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set, so the gaseous working medium is liquefied into the liquid working medium, and then the liquid working medium flows back into the vapor chamber.Type: ApplicationFiled: February 8, 2023Publication date: August 24, 2023Inventors: Chih-Wei Chen, Cheng-Ju Chang, Chung-Chien Su, Hsiang-Chih Chuang, Jyun-Wei Huang
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Patent number: 11723144Abstract: An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.Type: GrantFiled: September 2, 2021Date of Patent: August 8, 2023Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ming-Fan Tsai, Chih-Wei Chen, Chien-Cheng Lin, Chao-Ya Yang, Chia-Yang Chen
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Publication number: 20230223398Abstract: A bidirectional electrostatic discharge protection device includes at least one bipolar junction transistor and at least one silicon-controlled rectifier. The silicon-controlled rectifier is coupled to the bipolar junction transistor in series. The absolute value of the breakdown voltage of the bipolar junction transistor is lower than that of the silicon-controlled rectifier and the absolute value of the holding voltage of the bipolar junction transistor is higher than that of the silicon-controlled rectifier when an electrostatic discharge voltage is applied to the bipolar junction transistor and the silicon-controlled rectifier.Type: ApplicationFiled: January 11, 2022Publication date: July 13, 2023Inventors: CHIH-WEI CHEN, MEI-LIAN FAN, KUN-HSIEN LIN
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Patent number: 11698229Abstract: A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.Type: GrantFiled: July 6, 2021Date of Patent: July 11, 2023Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chih-Wei Chen, Tien-Yao Chang, Che-Wei Kuo, Hsiang-Chih Chuang, Jyun-Wei Huang, Cheng-Ju Chang
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Publication number: 20230216571Abstract: The invention provides a method for antenna selectin of a user equipment (UE). The UE may comprise a plurality of antennas. The method may comprise calculating one or more quality evaluations respectively associated with one or more first antenna subsets, and selecting one of the one or more first antenna subsets according to the one or more quality evaluations. Each antenna subset may include one or more of the plurality of antennas. Each quality evaluation may be calculated under a condition that the antenna(s) included in the associated antenna subset is (are) used to communicate.Type: ApplicationFiled: December 29, 2022Publication date: July 6, 2023Inventors: Da-Chun HSING, Wei-Yao CHEN, Nien-En WU, Chih-Wei CHEN, Yabo LI, Jiaxian PAN, Chong-You LEE, Wei-Jen CHEN, Chih-Yuan LIN, Jianwei ZHANG
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Publication number: 20230156968Abstract: A flexible vapor chamber includes a first flexible casing, a second flexible casing, a plurality of capillary strips and a plurality of inner capillary layers. The capillary strips are installed between the first flexible casing and the second flexible casing, and the inner capillary layers are arranged between the first flexible casing and the second flexible casing, and the capillary strips.Type: ApplicationFiled: October 5, 2022Publication date: May 18, 2023Inventors: Chih-Wei CHEN, Che-Wei KUO, Tien-Yao CHANG, Hsiang-Chih CHUANG, Pin-Jei CHEN, Tsung-Min LIU
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Publication number: 20230153958Abstract: Aspects of the disclosure provide a frame processor for processing frames with aliasing artifacts. For example, the frame processor can include a super-resolution (SR) and anti-aliasing (AA) engine and an attention reference frame generator coupled to the SR and AA engine. The SR and AA engine can be configured to enhance resolution and remove aliasing artifacts of a frame to generate a first high-resolution frame with aliasing artifacts and a second high-resolution frame with aliasing artifacts removed. The attention reference frame generator can be configured to generate an attention reference frame based on the first high-resolution frame and the second high-resolution frame.Type: ApplicationFiled: January 6, 2023Publication date: May 18, 2023Applicant: MEDIATEK INC.Inventors: Jen Cheng LUNG, Pei-Kuei TSUNG, Chih-Wei CHEN, Yao-Sheng WANG, Shih-Che CHEN, Yu-Sheng LIN, Chih-Wen GOO, Shih-Chin LIN, Huang TSUNG-SHIAN, Ying-Chieh CHEN
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Patent number: 11653471Abstract: A heat dissipation device is provided and includes: a temperature equalizing plate unit; at least one first vapor chamber unit and at least one second vapor chamber unit disposed on an outer surface of the temperature equalizing plate unit; at least one first tower fin set disposed on the outer surface of the temperature equalizing plate unit to sleeve the first and second vapor chamber units and partially expose the second vapor chamber unit; and at least one second tower fin set disposed on a part of a surface of the first tower fin set to sleeve the exposed part of the second vapor chamber unit.Type: GrantFiled: July 12, 2021Date of Patent: May 16, 2023Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chih-Wei Chen, Cheng-Ju Chang, Jyun-Wei Huang
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Patent number: 11644913Abstract: A touch display device includes a display panel, a conductive layer, an optical matching layer and a buffer layer. The display panel comprises a first substrate, a second substrate and a display medium layer. The first substrate comprises a first surface and a second surface, the second substrate is disposed opposite to the first substrate, and the display medium layer is disposed between the second surface of the first substrate and the second substrate. The conductive layer is disposed on the first surface of the first substrate, and comprises a plurality of sensing electrodes. The optical matching layer is disposed between the conductive layer and the first surface of the first substrate. The buffer layer with a thickness greater than or equal to 50 ? and less than or equal to 3000 ? is disposed between the optical matching layer and the first surface of the first substrate.Type: GrantFiled: April 14, 2021Date of Patent: May 9, 2023Assignee: HANNSTAR DISPLAY CORPORATIONInventors: Tzung-Hsien Hsu, Chih-Wei Chen, Mei-Ling Chou, Chia-Yu Liu, Yao-Chih Chuang
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Publication number: 20230126928Abstract: A heat dissipation device of server cabinet heat dissipation device of server cabinet, comprising an outer case and a plurality of heat dissipation devices, the outer case is provided with a plurality of vents on one side, and a plurality of fans are installed on the other side, each of the heat dissipation devices is installed in the outer case, and each of the heat dissipation devices has an included angle toward each of the vents or the directions of the fans, so that the wind can pass through continuously after the fans are activated. Each of the heat dissipation devices is directly discharged after that. Since the heat dissipation devices do not overlap on the air circulation path, even if there is more than one heat dissipation device, it can still ensure that there is no temperature difference between each air, so that the heat dissipation effect is better so as the effect of stabilizing the overall heat dissipation temperature.Type: ApplicationFiled: October 12, 2022Publication date: April 27, 2023Inventors: Feng-Shih LIAO, Chih-Wei CHEN, Wu-Hsiung LIU
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Publication number: 20230129882Abstract: A touch display device including a substrate, a touch structure, a plurality of light emitting elements and a reflection layer is provided by the present invention. The substrate includes a first surface and a second surface opposite to the first surface. The touch structure includes a plurality of first touch electrodes disposed on the first surface of the substrate. The light emitting elements are disposed on the second surface of the substrate, and one of the light emitting elements includes a light emitting surface and a bottom surface opposite to the light emitting surface. The reflection layer is disposed on the second surface of the substrate. The light emitting elements are disposed between the reflection layer and the substrate, and the light emitting surface of one of the light emitting elements is disposed between the bottom surface and the reflection layer.Type: ApplicationFiled: October 3, 2022Publication date: April 27, 2023Applicant: HANNSTAR DISPLAY CORPORATIONInventors: Yao-Chih Chuang, Chia-Yu Liu, Chih-Wei Chen, Ming-Liang Chen
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Patent number: 11635838Abstract: A touch display device including a substrate, a touch structure, a plurality of light emitting elements and a reflection layer is provided by the present invention. The substrate includes a first surface and a second surface opposite to the first surface. The touch structure includes a plurality of first touch electrodes disposed on the first surface of the substrate. The light emitting elements are disposed on the second surface of the substrate, and one of the light emitting elements includes a light emitting surface and a bottom surface opposite to the light emitting surface. The reflection layer is disposed on the second surface of the substrate. The light emitting elements are disposed between the reflection layer and the substrate, and the light emitting surface of one of the light emitting elements is disposed between the bottom surface and the reflection layer.Type: GrantFiled: October 3, 2022Date of Patent: April 25, 2023Assignee: HANNSTAR DISPLAY CORPORATIONInventors: Yao-Chih Chuang, Chia-Yu Liu, Chih-Wei Chen, Ming-Liang Chen
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Publication number: 20230114666Abstract: A real-time system for monitoring and analysis includes input and output measurement devices, a cloud medical system, and at least one intelligent device. The input measurement device includes a first microprocessor and a first measurement unit configured to measure a volume of substance introduction, the first microprocessor having a first wireless module for transmitting a signal of the measured substance introduction to the cloud medical system. The output measurement device includes a second microprocessor and a second measurement unit configured to measure a volume of metabolic waste expelled from the body, the second microprocessor having a second wireless module for transmitting a signal of the measured urine to the cloud medical system. A signal of doctor's orders is transmitted from a doctor's orders system to the intelligent device.Type: ApplicationFiled: March 31, 2022Publication date: April 13, 2023Inventors: Chih-Wei Chen, You-Chia Chu, Zoe Lai
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Publication number: 20230065137Abstract: A heat dissipation device is provided and includes: a first vapor chamber filled with a first working fluid therein and used for contacting at least one heat source; at least one heat transfer structure disposed on a side of the first vapor chamber; and a second vapor chamber filled with a second working fluid therein and connected to the first vapor chamber via the heat transfer structure, where the first working fluid absorbs heat of the heat source and then vaporizes, and the vaporized first working fluid transfers the heat to the second working fluid via the heat transfer structure.Type: ApplicationFiled: July 7, 2022Publication date: March 2, 2023Inventors: Chih-Wei CHEN, Tien-Yao CHANG, Che-Wei KUO, Hsiang-Chih CHUANG, Jyun-Wei HUANG, Kang-Ming FAN
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Patent number: 11580621Abstract: Aspects of the disclosure provide a device for processing frames with aliasing artifacts. For example, the device can include a motion estimation circuit, a warping circuit coupled to the motion estimation circuit, and a temporal decision circuit coupled to the warping circuit. The motion estimation circuit can estimate a motion value between a current frame and a previous frame. The warping circuit can warp the previous frame based on the motion value such that the warped previous frame is aligned with the current frame and determine whether the current frame and the warped previous frame are consistent. The temporal decision circuit can generate an output frame, the output frame including either the current frame and the warped previous frame when the current frame and the warped previous frame are consistent, or the current frame when the current frame and the warped previous frame are not consistent.Type: GrantFiled: December 7, 2020Date of Patent: February 14, 2023Assignee: MEDIATEK INC.Inventors: Jen Cheng Lung, Pei-Kuei Tsung, Chih-Wei Chen, Yao-Sheng Wang, Shih-Che Chen, Yu-Sheng Lin, Chih-Wen Goo, Shih-Chin Lin, Huang Tsung-Shian, Ying-Chieh Chen
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Patent number: 11573668Abstract: The disclosure provides a touch-sensing panel, which includes a substrate, a first mesh pattern, an insulating layer, and a second mesh pattern. The substrate has an active area and a peripheral area. The first mesh pattern is located in the active area. The insulating layer is disposed on the first mesh pattern. The second mesh pattern is located in the active area. At least a part of the second mesh pattern is disposed on the insulating layer. Each of the first mesh pattern and the second mesh pattern includes a plurality of mesh lines. A reflectivity of a surface of one of the first mesh pattern and the second pattern is smaller than a reflectivity of a surface of the other of the first mesh pattern and the second mesh pattern, and a width of each of the mesh lines of the one of the first mesh pattern and the second mesh pattern is smaller than a width of each of the mesh lines of the other of the first mesh pattern and the second mesh pattern.Type: GrantFiled: October 27, 2021Date of Patent: February 7, 2023Assignee: HannStar Display CorporationInventors: Yao-Chih Chuang, Mei-Ling Chou, Ming-Liang Chen, Chih-Wei Chen, Chia-Yu Liu
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Patent number: 11576279Abstract: A heat dissipation device is provided and includes a vapor chamber unit, a heat pipe set provided on an outer surface of the vapor chamber unit, a first fin set provided on the outer surface of the vapor chamber unit and sleeving the heat pipe set, and a second fin set stacked on the first fin set and sleeving the heat pipe set, where the fin arrangement direction of the first fin set is different from the fin arrangement direction of the second fin set.Type: GrantFiled: July 9, 2021Date of Patent: February 7, 2023Assignee: AURAS TECHNOLOGY CO., LTD.Inventors: Chih-Wei Chen, Cheng-Ju Chang, Jyun-Wei Huang