Abstract: Ruthenium of a metal gate (MG) and/or a middle end of line (MEOL) structure is annealed to reduce, or even eliminate, seams after the ruthenium is deposited. Because the annealing reduces (or removes) seams in deposited ruthenium, electrical performance is increased because resistivity of the MG and/or the MEOL structure is decreased. Additionally, for MGs, the annealing generates a more even deposition profile, which results in a timed etching process producing a uniform gate height. As a result, more of the MGs will be functional after etching, which increases yield during production of the electronic device.

Abstract: A method includes providing a substrate, a dummy fin, and a stack of semiconductor channel layers; forming an interfacial layer wrapping around each of the semiconductor channel layers; depositing a high-k dielectric layer, wherein a first portion of the high-k dielectric layer over the interfacial layer is spaced away from a second portion of the high-k dielectric layer on sidewalls of the dummy fin by a first distance; depositing a first dielectric layer over the dummy fin and over the semiconductor channel layers, wherein a merge-critical-dimension of the first dielectric layer is greater than the first distance thereby causing the first dielectric layer to be deposited in a space between the dummy fin and a topmost layer of the stack of semiconductor channel layers, thereby providing air gaps between adjacent layers of the stack of semiconductor channel layers and between the dummy fin and the stack of semiconductor channel layers.

Abstract: A semiconductor device structure includes nanostructures formed over a substrate. The structure also includes a fin isolation structure formed beside the nanostructures. The structure also includes a work function layer surrounding the nanostructures and covering a sidewall of the fin isolation structure. The structure also includes a gate electrode layer covering the work function layer. The gate electrode layer has an extending portion surrounded by the work function layer.

Abstract: A semiconductor device structure and a formation method are provided. The method includes forming a fin structure over a substrate, and the fin structure has multiple sacrificial layers and multiple semiconductor layers laid out alternately. The method also includes removing the sacrificial layers to release multiple semiconductor nanostructures made up of remaining portions of the semiconductor lavers. The method further includes forming a gate dielectric layer to wrap around the semiconductor nanostructures and forming a first metal-containing layer over the gate dielectric layer to wrap around the semiconductor nanostructures. In addition, the method includes introducing oxygen-containing plasma on the first metal-containing layer to transform an upper portion of the first metal-containing layer into a metal oxide layer. The method includes forming a second metal-containing layer over the metal oxide layer.

Abstract: An autonomously activated electric energy storage device and a control method thereof are provided. The autonomously activated electric energy storage device includes a first battery cell, a second battery cell, a temperature detector, a first bidirectional charger, a second bidirectional charger and a control circuit. When the control circuit determines through the temperature detector that a battery cell temperature is equal to or lower than a low working temperature limit, the control circuit allows the first bidirectional charger to be electrically conducted with the first battery cell and the second bidirectional charger to be electrically conducted with the second battery cell, and the first battery cell and the second battery are controlled to perform power transfer therebetween through the first and the second bidirectional charger until temperatures of the first battery cell and the second battery cell are both higher than the low working temperature limit.

Abstract: A communication device for detecting an object includes a power module, an antenna array, a first sensor pad, a second sensor pad, and a control unit. The antenna array is excited by the power module, and is configured to provide a first beam group and a second beam group. The first sensor pad is disposed adjacent to the first side of the antenna array. A first capacitance is formed between the first sensor pad and the object. The second sensor pad is disposed adjacent to the second side of the antenna array. A second capacitance is formed between the second sensor pad and the object. The control unit controls the power module according to the first capacitance and the second capacitance, so as to selectively apply at least one power backoff operation to the first beam group and/or the second beam group.

Abstract: A method includes providing a structure having a first channel member and a second channel member over a substrate. The first channel member is located in a first region of the structure and the second channel member is located in a second region of the structure. The method also includes forming a first oxide layer over the first channel member and a second oxide layer over the second channel member, forming a first dielectric layer over the first oxide layer and a second dielectric layer over the second oxide layer, and forming a capping layer over the second dielectric layer but not over the first dielectric layer. The method further includes performing an annealing process to increase a thickness of the second oxide layer under the capping layer.

Abstract: An n-type field effect transistor includes semiconductor channel members vertically stacked over a substrate, a gate dielectric layer wrapping around each of the semiconductor channel members, and a work function layer disposed over the gate dielectric layer. The work function layer wraps around each of the semiconductor channel members. The n-type field effect transistor also includes a WF isolation layer disposed over the WF layer and a gate metal fill layer disposed over the WF isolation layer. The WF isolation layer fills gaps between adjacent semiconductor channel members.

Abstract: A semiconductor device and related method for forming a gate structure. In some embodiments, a semiconductor device includes a fin extending from a substrate. In some cases, the fin includes a plurality of semiconductor channel layers. In some examples, the semiconductor device further includes a gate dielectric surrounding each of the plurality of semiconductor channel layers. In some embodiments, a first thickness of the gate dielectric disposed on a top surface of a topmost semiconductor channel layer of the plurality of semiconductor channel layers is greater than a second thickness of the gate dielectric disposed on a surface of another semiconductor channel layer disposed beneath the topmost semiconductor channel layer.

Abstract: A method includes providing a substrate, a dummy fin, and a stack of semiconductor channel layers; forming an interfacial layer wrapping around each of the semiconductor channel layers; depositing a high-k dielectric layer, wherein a first portion of the high-k dielectric layer over the interfacial layer is spaced away from a second portion of the high-k dielectric layer on sidewalls of the dummy fin by a first distance; depositing a first dielectric layer over the dummy fin and over the semiconductor channel layers, wherein a merge-critical-dimension of the first dielectric layer is greater than the first distance thereby causing the first dielectric layer to be deposited in a space between the dummy fin and a topmost layer of the stack of semiconductor channel layers, thereby providing air gaps between adjacent layers of the stack of semiconductor channel layers and between the dummy fin and the stack of semiconductor channel layers.

Abstract: A method and structure for modulating a threshold voltage of a device. In various embodiments, a fin extending from a substrate is provided. In some embodiments, the fin includes a plurality of semiconductor channel layers defining a channel region for a P-type transistor. In some examples, a gate dielectric is formed wrapping around each of the plurality of semiconductor channel layers of the P-type transistor. In some cases, a P-type work function (PWF) metal gate cap is formed wrapping around the gate dielectric. In various embodiments, the PWF metal gate cap merges between adjacent semiconductor channel layers of the plurality of channel layers. Additionally, in some examples, the PWF metal gate cap includes a plurality of nitrogen-containing layers.

Abstract: An antenna module comprises a printed circuit board, a communication circuit disposed on a first surface of the printed circuit board, an array antenna configured to transmit/receive a signal in a specified high-frequency band with the communication circuit, wherein the array antenna includes, first conductive elements disposed on the first surface of the printed circuit board, and second conductive elements disposed on a second surface facing the first conductive elements, and a first molding layer covering the first conductive elements.

Abstract: Disclosed is an electronic device.

Abstract: An antenna module comprises a printed circuit board, a communication circuit disposed on a first surface of the printed circuit board, an array antenna configured to transmit/receive a signal in a specified high-frequency band with the communication circuit, wherein the array antenna includes, first conductive elements disposed on the first surface of the printed circuit board, and second conductive elements disposed on a second surface facing the first conductive elements, and a first molding layer covering the first conductive elements.

Abstract: A 3D NAND memory on a single integrated circuit is described including a block of vertical NAND strings, including a plurality of sub-blocks. Sub-blocks in the plurality of sub-blocks each comprise an upper select line in an upper level; word lines in intermediate levels below the upper level; a first lower select line in a first lower level below the intermediate levels; a second lower select line in a second lower level below the first lower level. A reference conductor can be disposed below the block. Bit lines are disposed over the block. Control circuitry applies voltages to the upper select lines, to the word lines and to the first and second lower select lines in the plurality of sub-blocks in various combinations for memory operations.

Abstract: A method for programming a non-volatile memory and a memory system are provided. Each of multiple cells of the non-volatile memory stores data having at least 2 bits. The method includes the following steps. At least one programming pulse is provided for programming a target cell of the cells. At least one program-verify pulse is provided for verifying whether the target cell is successfully programmed. It is determined that whether a threshold voltage of the target cell is greater than or equal to a program-verify voltage. When the threshold voltage is greater than or equal to the program-verify voltage, the target cell is set as successfully programmed. Next, a post-verifying operation is performed to the successfully programmed cell. The post-verifying operation includes determining whether the threshold voltage of the target cell is greater than or equal to a post-verifying voltage.

Abstract: Disclosed is an electronic device.

Abstract: A 3D NAND memory on a single integrated circuit is described including a block of vertical NAND strings, including a plurality of sub-blocks. Sub-blocks in the plurality of sub-blocks each comprise an upper select line in an upper level; word lines in intermediate levels below the upper level; a first lower select line in a first lower level below the intermediate levels; a second lower select line in a second lower level below the first lower level. A reference conductor can be disposed below the block. Bit lines are disposed over the block. Control circuitry applies voltages to the upper select lines, to the word lines and to the first and second lower select lines in the plurality of sub-blocks in various combinations for memory operations.

Abstract: The method for programming a non-volatile memory includes the following steps. Perform a program and program verify operation for a memory cell in the non-volatile memory, wherein the program and program verify operation includes applying a sequence of incremental step pulses to the memory cell. Perform a post-verifying operation for the memory cell after the memory cell passes the program and program verify operation. Apply a post-programming pulse to the memory cell if the memory cell fails the post-verifying operation, wherein the amplitude of the post-programming pulse is greater than the amplitude of the last pulse in the sequence of incremental step pulses. Perform a read operation to the non-volatile memory to obtain a failed bit count corresponding to the read operation. Adjust a read reference voltage of the read operation to minimize the failed bit count.

Abstract: An erase-verify method for a three-dimensional (3D) memory and a memory system are provided. The 3D memory includes at least one memory cell string including a plurality of memory cells, and the memory cells include a first group of memory cells and a second group of memory cells. Each of the memory cells is coupled to a word line. The method comprises the following steps. A first erase-verify operation is performed on the first group of memory cells. After performing the first erase-verify operation on the first group of memory cells, a second erase-verify operation is performed on the second group of memory cells in condition that the first group of memory cells are verified as erased successfully.