Patents by Inventor Chih-Wei Lee
Chih-Wei Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9047049Abstract: A docking station suitable for detachably assembling to an electronic device is provided. A bracket of the docking station includes a housing, a pushing element, a restoring element, and a main hook. When the pushing element is slid relative to the housing through the restoring element so the main hook is buckled to a main groove of the electronic device, a main hook relation between the bracket and the electronic device is established. When the pushing element is slid relative to the housing so the main hook departs from the main groove, a secondary hook of the docking station establishes a secondary hook relation between the bracket and the electronic device. When the electronic device is removed from the bracket until the secondary hook relation between the bracket and the electronic device is released, the restoring element restores the pushing element relative to the housing.Type: GrantFiled: September 14, 2012Date of Patent: June 2, 2015Assignee: COMPAL ELECTRONICS, INC.Inventors: Hsiang-Chun Yang, Chia-Ying Chen, Chih-Wei Lee, Cheng-Hsun Lee, Shih-Huei Liu, Ping-Huei Lee, Er-Jie Tsai
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Patent number: 8687379Abstract: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.Type: GrantFiled: February 27, 2013Date of Patent: April 1, 2014Assignee: Phytrex Technology CorporationInventors: Feng-Chi Hsiao, Kun-Shan Yang, Tung-Fu Lin, Chin-Fen Cheng, Chih-Wei Lee
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Patent number: 8649184Abstract: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.Type: GrantFiled: May 26, 2010Date of Patent: February 11, 2014Assignee: Phytrex Technology CorporationInventors: Feng Chi Hsiao, Kun Shan Yang, Tung Fu Lin, Chin Fen Cheng, Chih Wei Lee
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Patent number: 8558742Abstract: A monopole antenna for an electronic device includes a grounding element electrically connected to a ground, a radiating element including a first radiator and a second radiator for transmitting and receiving a wireless signal of a first frequency band, a coupling element electrically connected to the second radiator for transmitting and receiving a wireless signal of a second frequency band, and a feed-in element electrically connected between the second radiator of the radiating element and the grounding element for transmitting the wireless signals of the first frequency band and the second frequency band.Type: GrantFiled: December 7, 2011Date of Patent: October 15, 2013Assignee: Wistron CorporationInventors: Chen-Yu Chou, Chih-Wei Lee, Chang-Hsin Lai
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Publication number: 20130155583Abstract: A docking station suitable for detachably assembling to an electronic device is provided. A bracket of the docking station includes a housing, a pushing element, a restoring element, and a main hook. When the pushing element is slid relative to the housing through the restoring element so the main hook is buckled to a main groove of the electronic device, a main hook relation between the bracket and the electronic device is established. When the pushing element is slid relative to the housing so the main hook departs from the main groove, a secondary hook of the docking station establishes a secondary hook relation between the bracket and the electronic device. When the electronic device is removed from the bracket until the secondary hook relation between the bracket and the electronic device is released, the restoring element restores the pushing element relative to the housing.Type: ApplicationFiled: September 14, 2012Publication date: June 20, 2013Applicant: COMPAL ELECTRONICS, INC.Inventors: Hsiang-Chun Yang, Chia-Ying Chen, Chih-Wei Lee, Cheng-Hsun Lee, Shih-Huei Liu, Ping-Huei Lee, Er-Jie Tsai
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Publication number: 20130142225Abstract: A mobile communication device and a method thereof. The mobile communication device includes a processor, a transceiver circuit, an amplifier circuit, and a control logic circuit. The processor generates a baseband signal and a gain control signal. The transceiver circuit converts the baseband signal to an analog form, and amplifies the converted baseband signal to output a first transmission signal. The amplifier circuit amplifies the first transmission signal to output a second transmission signal. The control logic circuit controls the transceiver circuit and the amplifier circuit based on the gain control signal to generate the second transmission signal. The transceiver circuit adopts one of a first plurality of power gain levels at an increasing sequence when the amplifier circuit adopts a lowest level of a second plurality of power gain levels.Type: ApplicationFiled: September 5, 2012Publication date: June 6, 2013Applicant: HTC CORPORATIONInventors: Chih-Wen KO, Chien-Yen LI, Wei-Yi CHIU, Chih-Wei LEE
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Patent number: 8422238Abstract: The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.Type: GrantFiled: April 13, 2010Date of Patent: April 16, 2013Assignee: Phytrex Technology CorporationInventors: Feng Chi Hsiao, Kun Shan Yang, Tung Fu Lin, Chin Fen Cheng, Chih Wei Lee
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Publication number: 20130063312Abstract: A monopole antenna for an electronic device includes a grounding element electrically connected to a ground, a radiating element including a first radiator and a second radiator for transmitting and receiving a wireless signal of a first frequency band, a coupling element electrically connected to the second radiator for transmitting and receiving a wireless signal of a second frequency band, and a feed-in element electrically connected between the second radiator of the radiating element and the grounding element for transmitting the wireless signals of the first frequency band and the second frequency band.Type: ApplicationFiled: December 7, 2011Publication date: March 14, 2013Inventors: Chen-Yu Chou, Chih-Wei Lee, Chang-Hsin Lai
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Patent number: 8106841Abstract: An antenna structure consists of a substrate, a radiation element, a signal feeding element, and a grounding element. The radiation element includes a first radiator and a second radiator coupled to the first radiator, wherein the first radiator is identical to the second radiator. The signal feeding element is coupled to a joint of the first radiator and the second radiator, wherein the first radiator and the second radiator are symmetrically disposed in the left and right sides of the signal feeding element to permute an array. The grounding element includes a first grounding sub-element and a second grounding sub-element, wherein the first grounding sub-element is coupled between the first radiator and the substrate and the second grounding sub-element is coupled between the second radiator and the substrate. The first grounding sub-element is identical to the second grounding sub-element.Type: GrantFiled: March 19, 2009Date of Patent: January 31, 2012Assignee: Wistron CorporationInventors: Yin-Yu Chen, Chen-Yu Chou, Chih-Wei Lee
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Patent number: 8081127Abstract: The antenna of the invention includes a transceiver unit and a dielectric unit. The transceiver unit has a ground portion, a radial portion, a conductive portion and a feed portion. The ground portion and the radial portion are disposed apart in parallel, so as to form a space therebetween. The distance between the ground portion and the radial portion is defined as a transceiver unit height. The dielectric unit is disposed in the space. That is, the dielectric unit is disposed between the ground portion and the radial portion. The dielectric unit has a dielectric unit thickness less than the transceiver unit height. In one embodiment, the ratio of the dielectric unit thickness to the transceiver unit height is preferably between 0.4 and 0.7.Type: GrantFiled: March 17, 2009Date of Patent: December 20, 2011Assignee: Wistron Corp.Inventors: Yin-Yu Chen, Chen-Yu Chou, Ming-Feng Tsai, Chih-Wei Lee
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Publication number: 20110105183Abstract: The present invention provides an electronic wallet device for a mobile phone comprising a SIM card interface, comprising: a processing unit configured to provide a top-up service interface to the mobile phone and to receive and convert a first transaction instruction from the mobile phone into a top-up instruction; an authentication unit provided with an electronic wallet and configured to receive and convert the top-up instruction into an authorized top-up instruction and to write an amount to the electronic wallet according to the authorized top-up instruction; and an NFC antenna electrically connected to the authentication unit.Type: ApplicationFiled: August 5, 2010Publication date: May 5, 2011Applicant: PHYTREX TECHNOLOGY CORPORATIONInventors: Feng Chi Hsiao, Kun Shan Yang, Tung Fu Lin, Chin Fen Cheng, Chih Wei Lee
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Patent number: 7916551Abstract: A method of programming a first cell in a memory, wherein the first cell has a first S/D region and shares a second S/D region with a second cell that has a third S/D region opposite to the second S/D region. The channels of the first and the second cells are turned on, a first voltage is applied to the first S/D region, a second voltage is applied to the second S/D region and a third voltage is applied to the third S/D region. The second voltage is between the first voltage and the third voltage, and the first to third voltages make carriers flow from the third S/D region to the first S/D region and cause hot carriers in the channel of the first cell to be injected into the charge storage layer of the first cell.Type: GrantFiled: June 13, 2008Date of Patent: March 29, 2011Assignee: MACRONIX International Co., Ltd.Inventors: Wen-Jer Tsai, Ta-Hui Wang, Chih-Wei Lee
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Publication number: 20110065476Abstract: The present invention provides an antenna device comprising: a contact substrate with a plurality of electrical contacts, an antenna substrate, and a connecting member connected between said contact substrate and said antenna substrate. Said connecting member is flexible and foldable and is provided with at least one corner portion. Said corner portion defines at least one horizontal section and at least one vertical section to render the antenna device better adaptability.Type: ApplicationFiled: September 16, 2010Publication date: March 17, 2011Applicant: PHYTREX TECHNOLOGY CORPORATIONInventors: Feng Chi Hsiao, Kun Shan Yang, Tung Fu Lin, Chin Fen Cheng, Chih Wei Lee
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Publication number: 20100309642Abstract: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.Type: ApplicationFiled: May 26, 2010Publication date: December 9, 2010Applicant: PHYTREX TECHNOLOGY CORPORATIONInventors: Feng Chi Hsiao, Kun Shan Yang, Tung Fu Lin, Chin Fen Cheng, Chih Wei Lee
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Publication number: 20100259904Abstract: The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.Type: ApplicationFiled: April 13, 2010Publication date: October 14, 2010Inventors: Feng Chi Hsiao, Kun Shan Yang, Tung Fu Lin, Chin Fen Cheng, Chih Wei Lee
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Publication number: 20100201588Abstract: An antenna structure consists of a substrate, a radiation element, a signal feeding element, and a grounding element. The radiation element includes a first radiator and a second radiator coupled to the first radiator, wherein the first radiator is identical to the second radiator. The signal feeding element is coupled to a joint of the first radiator and the second radiator, wherein the first radiator and the second radiator are symmetrically disposed in the left and right sides of the signal feeding element to permute an array. The grounding element includes a first grounding sub-element and a second grounding sub-element, wherein the first grounding sub-element is coupled between the first radiator and the substrate and the second grounding sub-element is coupled between the second radiator and the substrate. The first grounding sub-element is identical to the second grounding sub-element.Type: ApplicationFiled: March 19, 2009Publication date: August 12, 2010Inventors: Yin-Yu Chen, Chen-Yu Chou, Chih-Wei Lee
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Publication number: 20100190528Abstract: The present disclosure provides a signal processing device comprising: a first substrate, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a second substrate, one side surface thereof being provided with at least an integrated circuit or an antenna; and a first connecting portion for connecting the first and second substrates; wherein the second and fourth contacts are electrically connected to the integrated circuit or antenna via the first connecting portion.Type: ApplicationFiled: January 22, 2010Publication date: July 29, 2010Applicant: Phytrex Technology CorporationInventors: Feng-Chi Hsiao, Kun-Shan Yang, Tung-Fu Lin, Chin-Fen Cheng, Chih-Wei Lee
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Publication number: 20090315793Abstract: The antenna of the invention includes a transceiver unit and a dielectric unit. The transceiver unit has a ground portion, a radial portion, a conductive portion and a feed portion. The ground portion and the radial portion are disposed apart in parallel, so as to form a space therebetween. The distance between the ground portion and the radial portion is defined as a transceiver unit height. The dielectric unit is disposed in the space. That is, the dielectric unit is disposed between the ground portion and the radial portion. The dielectric unit has a dielectric unit thickness less than the transceiver unit height. In one embodiment, the ratio of the dielectric unit thickness to the transceiver unit height is preferably between 0.4 and 0.7.Type: ApplicationFiled: March 17, 2009Publication date: December 24, 2009Inventors: Yin-Yu CHEN, Chen-Yu Chou, Ming-Feng Tsai, Chih-Wei Lee
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Publication number: 20090195264Abstract: A high temperature test system is adapted for testing a device under test (DUT) under a high temperature environment. The high temperature test system includes a preheating unit, a first moving unit, a testing unit, and a second moving unit. The preheating unit is adapted for preheating the DUT. The first moving unit is adapted for removing the preheated DUT from the preheating unit. The testing unit is adapted for placement of the DUT removed by the first moving unit, for testing the DUT, and for providing the high temperature environment to the DUT during testing. The second moving unit is adapted for removing the DUT that has passed testing from the testing unit.Type: ApplicationFiled: February 4, 2008Publication date: August 6, 2009Inventors: Wen-Yuan Tsen, Guei-Tang Huang, Sung-Rong Shu, Wan-Te Hung, Chih-Wei Lee, Su-Hui Wang, Chih-Hung Huang
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Publication number: 20090116294Abstract: A method of programming a first cell in a memory, wherein the first cell has a first S/D region and shares a second S/D region with a second cell that has a third S/D region opposite to the second S/D region. The channels of the first and the second cells are turned on, a first voltage is applied to the first S/D region, a second voltage is applied to the second S/D region and a third voltage is applied to the third S/D region. The second voltage is between the first voltage and the third voltage, and the first to third voltages make carriers flow from the third S/D region to the first S/ID region and cause hot carriers in the channel of the first cell to be injected into the charge storage layer of the first cell.Type: ApplicationFiled: June 13, 2008Publication date: May 7, 2009Applicant: MACRONIX INTERNATIONAL CO., LTD.Inventors: Wen-Jer Tsai, Ta-Hui Wang, Chih-Wei Lee