Abstract: A method includes scanning a lithography mask with a repair process, and measuring back-scattered electron signals of back-scattered electrons generated from the scanning. An endpoint is determined from the back-scattered electron signals. A stop point is calculated from the endpoint. The step of scanning is stopped when the calculated stop point is reached.

Abstract: A method includes performing a beam scan on a photolithography mask to repair the photolithography mask. After the beam scan, a radiation treatment is performed on the photolithography mask. The method is performed by an apparatus including a beam generator configured to generate and project a beam on the lithography mask, a radiation source configured to generate a radiation on the lithography mask, and a process gas source configured to release a process gas onto the lithography mask. The process as reacts with a surface portion of the lithography mask to repair the lithography mask. With the radiation treatment, residue process gas on the lithography mask is removed.

Abstract: A method for repairing a defect, such as a pinhole, on a photomask is described. In an example, a laser beam is used to form a matrix of laser burn spots in a substrate of the photomask proximate a defect, such as a pinhole, of the photomask. Each laser burn spot is formed at a focal point of the laser beam inside the substrate by melting a material of the substrate proximate to the defect. In an example, the defect is surrounded and covered by the matrix of laser burn spots. The matrix of laser burn spots can attenuate or block light from passing through the defect, such as the pinhole. The matrix of laser burn spots may repair the defect of the photomask without removing a pellicle and pellicle frame mounted on the photomask.

Abstract: A display module having an improved assembly structure is provided. The display module includes a frame, a display panel, and a glue. The frame has a side wall and a supporting part, wherein the supporting part has a supporting surface and the side wall is formed on the periphery of the supporting surface. A groove is formed on the supporting surface adjacent to the side wall and is distributed along the side wall. The display panel is disposed within the frame and has a bottom face and a side face. The bottom face is supported by the supporting surface of the supporting part. The side face faces the side wall and forms a gap with the side wall. The glue is filled in the gap and adheres the side wall to the side face.

Abstract: A display module having an improved assembly structure is provided. The display module includes a frame, a display panel, and a glue. The frame has a side wall and a supporting part, wherein the supporting part has a supporting surface and the side wall is formed on the periphery of the supporting surface. A groove is formed on the supporting surface adjacent to the side wall and is distributed along the side wall. The display panel is disposed within the frame and has a bottom face and a side face. The bottom face is supported by the supporting surface of the supporting part. The side face faces the side wall and forms a gap with the side wall. The glue is filled in the gap and adheres the side wall to the side face.

Abstract: A method for repairing a defect, such as a pinhole, on a photomask is described. In an example, a laser beam is used to form a matrix of laser burn spots in a substrate of the photomask proximate a defect, such as a pinhole, of the photomask. Each laser burn spot is formed at a focal point of the laser beam inside the substrate by melting a material of the substrate proximate to the defect. In an example, the defect is surrounded and covered by the matrix of laser burn spots. The matrix of laser burn spots can attenuate or block light from passing through the defect, such as the pinhole. The matrix of laser burn spots may repair the defect of the photomask without removing a pellicle and pellicle frame mounted on the photomask.

Abstract: A display module having an improved assembly structure is provided. The display module includes a frame, a display panel, and a glue. The frame has a side wall and a supporting part, wherein the supporting part has a supporting surface and the side wall is formed on the periphery of the supporting surface. A groove is formed on the supporting surface adjacent to the side wall and is distributed along the side wall. The display panel is disposed within the frame and has a bottom face and a side face. The bottom face is supported by the supporting surface of the supporting part. The side face faces the side wall and forms a gap with the side wall. The glue is filled in the gap and adheres the side wall to the side face.

Abstract: The present invention relates to a method for removing etching assist gas from a fabrication system used during defect repair of a photomask in the fabrication of an integrated circuit, including: (a) inspecting the photomask and detecting a defect, the defect in a defect region; and (b) repairing the defect, wherein an amount, effective for the purpose of styrene is added to the system. By the method of the present invention, the amount of gas remaining on the MOS film is reduced, resulting in less surface defects present on the photomask.