Abstract: A method includes forming a semiconductor fin over a substrate; forming a gate structure over the semiconductor fin, the gate structure comprising: a first metallic layer; a second metallic layer over the first metallic layer, wherein the first metallic layer is a metal compound of a first element and a second element and the second metallic layer is a single-element metal of the second element; and an oxide layer between the first metallic layer and the second metallic layer.

Abstract: A semiconductor device includes a substrate comprising a semiconductor fin, a gate structure over the semiconductor fin, and source/drain structures over the semiconductor fin and on opposite sides of the gate structure. The gate stack comprises a high-k dielectric layer; a first work function metal layer over the high-k dielectric layer; an oxide of the first work function metal layer over the first work function metal layer; and a second work function metal layer over the oxide of the first work function metal layer, in which the first and second work function metal layers have different compositions; and a gate electrode over the second work function metal layer.

Abstract: A semiconductor device includes a substrate, a first gate structure, a plurality of first gate spacers, a second gate structure, and a plurality of second gate spacers. The substrate has a first fin structure and a second fin structure. The first gate structure is over the first fin structure, in which the first gate structure includes a first high dielectric constant material and a first metal. A bottom surface of the first high dielectric constant material is higher than bottom surfaces of the first gate spacers. The second gate structure is narrower than the first gate structure and over the second fin structure, in which the second gate structure includes a second high dielectric constant material and a second metal. A bottom surface of the second high dielectric constant material is lower than bottom surfaces of the second gate spacers.

Abstract: A semiconductor device includes a substrate comprising a semiconductor fin, a gate structure over the semiconductor fin, and source/drain structures over the semiconductor fin and on opposite sides of the gate structure. The gate stack comprises a high-k dielectric layer; a first work function metal layer over the high-k dielectric layer; an oxide of the first work function metal layer over the first work function metal layer; and a second work function metal layer over the oxide of the first work function metal layer, in which the first and second work function metal layers have different compositions; and a gate electrode over the second work function metal layer.

Abstract: A method forming a gate dielectric over a substrate, and forming a metal gate structure over the semiconductor substrate and the gate dielectric. The metal gate structure includes a first metal material. The method further includes forming a seal on sidewalls of the metal gate structure. The method further includes forming a dielectric film on the metal gate structure, the dielectric film including a first metal oxynitride comprising the first metal material and directly on the metal gate structure without extending over the seal formed on sidewalls of the metal gate structure.

Abstract: A semiconductor device includes a substrate, a gate stack. The substrate includes a semiconductor fin. The gate stack is disposed on the semiconductor fin. The gate stack includes a dielectric layer disposed over the semiconductor fin, and a metal stack disposed over the dielectric layer and having a first metallic layer and a second metallic layer over the first metallic layer, and a gate electrode disposed over the metal stack. The first metallic layer and the second metallic layer have a first element, and a percentage of the first element in the first metallic layer is greater than that in the second metallic layer.

Abstract: A semiconductor device includes a substrate, a first gate structure, a plurality of first gate spacers, a second gate structure, and a plurality of second gate spacers. The substrate has a first fin structure and a second fin structure. The first gate structure is over the first fin structure, in which the first gate structure includes a first high dielectric constant material and a first metal. A bottom surface of the first high dielectric constant material is higher than bottom surfaces of the first gate spacers. The second gate structure is narrower than the first gate structure and over the second fin structure, in which the second gate structure includes a second high dielectric constant material and a second metal. A bottom surface of the second high dielectric constant material is lower than bottom surfaces of the second gate spacers.

Abstract: A semiconductor device includes a substrate, a first dielectric layer, a first device and a second device. The first dielectric layer is disposed on the substrate. The first device is disposed on the first dielectric layer on a first region of the substrate, and includes two first spacers, a second dielectric layer and a first gate structure. The first spacers are separated to form a first trench. The second dielectric layer is disposed on side surfaces and a bottom surface of the first trench. The first gate structure is disposed on the second dielectric layer. The second device is disposed on a second region of the substrate, and includes two second spacers and a second gate structure. The second spacers are disposed on the first dielectric layer and are separated to form a second trench. The second gate structure is disposed on the substrate within the second trench.

Abstract: A method forming a gate dielectric over a substrate, and forming a metal gate structure over the semiconductor substrate and the gate dielectric. The metal gate structure includes a first metal material. The method further includes forming a seal on sidewalls of the metal gate structure. The method further includes forming a dielectric film on the metal gate structure, the dielectric film including a first metal oxynitride comprising the first metal material and directly on the metal gate structure without extending over the seal formed on sidewalls of the metal gate structure.

Abstract: An integrated circuit includes a semiconductor substrate, a gate dielectric over the substrate, and a metal gate structure over the semiconductor substrate and the gate dielectric. The metal gate structure includes a first metal material. The integrated circuit further includes a seal formed on sidewalls of the metal gate structure. The integrated circuit further includes a dielectric film on the metal gate structure, the dielectric film including a first metal oxynitride comprising the first metal material and directly on the metal gate structure without extending over the seal formed on sidewalls of the metal gate structure.

Abstract: A semiconductor device includes a substrate, a gate stack. The substrate includes a semiconductor fin. The gate stack is disposed on the semiconductor fin. The gate stack includes a dielectric layer disposed over the semiconductor fin, and a metal stack disposed over the dielectric layer and having a first metallic layer and a second metallic layer over the first metallic layer, and a gate electrode disposed over the metal stack. The first metallic layer and the second metallic layer have a first element, and a percentage of the first element in the first metallic layer is greater than that in the second metallic layer.

Abstract: In a method of manufacturing a semiconductor device, a dummy gate structure is formed over a substrate. A first insulating layer is formed over the dummy gate structure. The dummy gate structure is removed so as to form a gate space in the first insulating layer. A first conductive layer is formed in the gate space so as to form a reduced gate space. The reduced gate space is filled with a second conductive layer made of a different material from the first conductive layer. The filled first conductive layer and the second conductive layer are recessed so as to form a first gate recess. A third conductive layer is formed over the first conductive layer and the second conductive layer in the first gate recess. After recessing the filled first conductive layer and the second conductive layer, the second conductive layer protrudes from the first conductive layer.

Abstract: In a method for manufacturing a semiconductor device, a first raised structure is formed on a surface of a substrate. The first raised structure includes a top surface and a side surface adjoining the top surface. The side surface includes an upper portion, a middle portion, and a lower portion. A deposition operation is performed with a precursor to form a first film on the top surface, the upper portion and the lower portion of the side surface, and the surface of the substrate. Performing the deposition operation includes controlling a saturated vapor pressure of the precursor. A re-deposition operation is performed on the first film and the first raised structure, so as to form a film structure. A thickness of the film structure on the middle portion of the side surface is smaller than a thickness of the film structure on the top surface.

Abstract: In a method for manufacturing a semiconductor device, a first raised structure is formed on a surface of a substrate. The first raised structure includes a top surface and a side surface adjoining the top surface. The side surface includes an upper portion, a middle portion, and a lower portion. A deposition operation is performed with a precursor to form a first film on the top surface, the upper portion and the lower portion of the side surface, and the surface of the substrate. Performing the deposition operation includes controlling a saturated vapor pressure of the precursor. A re-deposition operation is performed on the first film and the first raised structure, so as to form a film structure. A thickness of the film structure on the middle portion of the side surface is smaller than a thickness of the film structure on the top surface.

Abstract: A semiconductor device includes a substrate, a first dielectric layer, a first device and a second device. The first dielectric layer is disposed on the substrate. The first device is disposed on the first dielectric layer on a first region of the substrate, and includes two first spacers, a second dielectric layer and a first gate structure. The first spacers are separated to form a first trench. The second dielectric layer is disposed on side surfaces and a bottom surface of the first trench. The first gate structure is disposed on the second dielectric layer. The second device is disposed on a second region of the substrate, and includes two second spacers and a second gate structure. The second spacers are disposed on the first dielectric layer and are separated to form a second trench. The second gate structure is disposed on the substrate within the second trench.

Abstract: An imaging lens includes an aperture stop, first to fifth lens elements arranged from an object side to an image side in the given order along an optical axis. The first lens element has a positive refractive power. The image-side surface of the second lens element has a convex portion in a vicinity of the optical axis. The image-side surface of the third lens element has a convex portion in a vicinity of its periphery. The image-side surface of the fourth lens element has a convex portion in a vicinity of the optical axis. The image-side surface of the fifth lens element has a concave portion in a vicinity of the optical axis and a convex portion in a vicinity of its periphery.

Abstract: A semiconductor device includes a first semiconductor channel, a second semiconductor channel, a first gate stack and a second gate stack. The first gate stack includes N-work function metal present on the first semiconductor channel. The second gate stack includes N-work function metal present on the second semiconductor channel. The N-work function metal in the first gate stack and the second gate stack are substantially different. The difference includes at least one of N-work function metal type and N-work function metal amount.

Abstract: A semiconductor device includes a first semiconductor channel, a second semiconductor channel, a first gate stack and a second gate stack. The first gate stack includes N-work function metal present on the first semiconductor channel. The second gate stack includes N-work function metal present on the second semiconductor channel. The N-work function metal in the first gate stack and the second gate stack are substantially different. The difference includes at least one of N-work function metal type and N-work function metal amount.

Abstract: An integrated circuit includes a semiconductor substrate, a gate dielectric over the substrate, and a metal gate structure over the semiconductor substrate and the gate dielectric. The metal gate structure includes a first metal material. The integrated circuit further includes a seal formed on sidewalls of the metal gate structure. The integrated circuit further includes a dielectric film on the metal gate structure, the dielectric film including a first metal oxynitride comprising the first metal material and directly on the metal gate structure without extending over the seal formed on sidewalls of the metal gate structure.

Abstract: An imaging lens includes first to sixth lens elements arranged from an object side to an image side in the given order. Through designs of surfaces of the lens elements and relevant lens parameters, a short system length of the imaging lens may be achieved while maintaining good optical performance.